ASTM-F3147:2015 Edition

$35.75

F3147-15 Standard Test Method for Evaluating the Reliability of Surface Mounted Device (SMD) Joints on a Flexible Circuit by a Rolling Mandrel Bend

Published By	Publication Date	Number of Pages
ASTM	2015	3

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Category: ASTM

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Description

ASTM F3147-15

Withdrawn Standard: Standard Test Method for Evaluating the Reliability of Surface Mounted Device (SMD) Joints on a Flexible Circuit by a Rolling Mandrel Bend (Withdrawn 2024)

ASTM F3147

Scope

1.1 This test method covers a means to test a completed Surface Mounted Device (SMD) joint for bond strength and inter-layer stress compatibility

1.2 A completed SMD joint includes; SMD (LED, resistor, etc), PTF ink land (typically silver), conductive adhesive (typically silver), staking compound (non-conductive), and encapsulant (non-conductive).

Keywords

bend; conductive adhesive; encapsulant; land-pad; mandrel; printed flexible circuit; SMD; staking compound;

ICS Code

ICS Number Code 31.020 (Electronic components in general)

DOI: 10.1520/F3147-15

Additional information

Standard Title	F3147-15 Standard Test Method for Evaluating the Reliability of Surface Mounted Device (SMD) Joints on a Flexible Circuit by a Rolling Mandrel Bend
Published Code	ASTM
Publication Date	2015
Pages Count	3