BS EN 60191-6-6:2001

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Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for fine pitch land grid array (FLGA) – Proposed amendment on terminology

Published By	Publication Date	Number of Pages
BSI	2001	16

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Description

IEC 60191-6-6:2001 provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array (hereinafter called FLGA) whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.

Additional information

Status	Definitive
Pages	16
Publication Date	2001-09-05
ISBN	0 580 38393 8
Standard Number	BS EN 60191-6-6:2001, IEC 60191-6-6:2001
Title	Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for fine pitch land grid array (FLGA) – Proposed amendment on terminology
Identical National Standard Of	IEC 60191-6-6:2001, EN 60191-6-6:2001
Descriptors	Electronic equipment and components, Engineering drawings, Graphic representation, Drawings, Dimensions, Design, Semiconductor devices, Standardization, Integrated circuits, Surface mounting devices
Publisher	BSI
Committee	EPL/47

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BS EN 60191-6-6:2001

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