BS EN 60191-6:2009:2010 Edition
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Mechanical standardization of semiconductor devices – General rules for the preparation of outline drawings of surface mounted semiconductor device packages
Published By | Publication Date | Number of Pages |
BSI | 2010 | 42 |
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IEC 60191-6:2009 gives general rules for the preparation of outline drawings of surface-mounted semiconductor devices. It supplements IEC 60191-1 and IEC 60191-3. It covers all surface-mounted devices discrete semiconductors with lead count of greater or equal to 8, as well as integrated circuits classified as form E in Clause 3 of IEC 60191-4. This third edition of IEC 60191-6 cancels and replaces the second edition, published in 2004 and constitutes a technical revision. This edition includes the following significant changes with respect to the previous edition: a) scope is modified to cover all surface-mounted devices discrete semiconductors with lead count of greater or equal to 8; b) editorial modifications on several pages; and c) technical revision to ball grid array package (BGA) especially its geometrical drawing format. (two types of BGA would unify as one type as a result of revising drawing format.
Status | Under Review |
---|---|
Title | Mechanical standardization of semiconductor devices – General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
Replaces | BS EN 60191-6:2004 |
Publisher | BSI |
Committee | EPL/47 |
Pages | 42 |
Publication Date | 2010-04-30 |
Replaced By | BS EN IEC 61755-2-2:2022 |
ISBN | 978 0 580 59338 3 |
Standard Number | BS EN 60191-6:2009 |
Identical National Standard Of | EN 60191-6:2009, IEC 60191-6:2009, EN 61755-2-2:2006 |
Descriptors | Packages, Technical drawing, Interchangeability, Integrated circuits, Engineering drawings, Standardization, Dimensions, Electronic equipment and components, Surface mounting devices, Shape, Drawings, Semiconductor devices |
ICS Codes | 31.080.01 - Semiconductor devices in general |
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