BS EN 61190-1-1:2002

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Attachment materials for electronic assembly – Requirements for soldering fluxes for high-quality interconnections in electronics assembly

Published By	Publication Date	Number of Pages
BSI	2002	26

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Description

Specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux characterization, quality control, and procurement document for solder flux and flux containing material in electronics assembly technology.

Additional information

Status	Definitive
Pages	26
Publication Date	2002-08-16
ISBN	0 580 40261 4
Standard Number	BS EN 61190-1-1:2002
Title	Attachment materials for electronic assembly – Requirements for soldering fluxes for high-quality interconnections in electronics assembly
Identical National Standard Of	EN 61190-1-1 (IEC 61190-1-1:2002 AS), IEC 61190-1-1:2002
Descriptors	Soldering, Soldering fluxes, Electrical connections, Quality control, Bonding, Electronic engineering, Quality assurance, Electronic equipment and components
Publisher	BSI
Committee	EPL/501
ICS Codes	31.190 - Electronic component assemblies

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BS EN 61190-1-1:2002

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