IEC 60749-25:2003
$22.75
Semiconductor devices – Mechanical and climatic test methods – Part 25: Temperature cycling
| Published By | Publication Date | Number of Pages |
| IEC | 2003-07-11 | 34 |
Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses.
Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.
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