SAE AIR 1141:1971
$25.35
1992 Report on Flip Chip and Beam Lead Bonding for Electronic Circuits
| Published By | Publication Date | Number of Pages |
| SAE | 1971-12-01 | 21 |
| Published Code | SAE |
|---|---|
| Published By | SAE International, formerly Society of Automotive Engineers |
| Publication Date | 1971-12-01 |
| Pages Count | 21 |
| Language | English |
| File Size | 624.6 KB |
