UNE-EN 62047-9:2011:2012 Edition
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Semiconductor devices – Micro-electromechanical devices – Part 9: Wafer to wafer bonding strength measurement for MEMS
| Published By | Publication Date | Number of Pages |
| AENOR | 2012-06-01 | 29 |
| Published Code | AENOR |
|---|---|
| Published By | Asociación Española de Normalización |
| Publication Date | 2012-06-01 |
| Pages Count | 29 |
| Language | English |
| File Size | 768.0 KB |
| ICS Codes | 31.080.99 - Other semiconductor devices |
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