Thermal Guidelines for Data Processing Environments provides groundbreaking, vendor-neutral information that empowers data center designers, operators, and managers to better determine the impacts of varying design and operation parameters on information technology equipment (ITE). This book covers six primary areas: • Environmental guidelines for air-cooled equipment • New environmental class for high-density air-cooled equipment • Environmental guidelines for liquid-cooled equipment • Facility temperature and humidity measurement • Equipment placement and airflow patterns • Equipment manufacturers’ heat load and airflow requirement reporting Since its first publication in 2004, Thermal Guidelines has enabled HVAC equipment manufacturers and installers, data center designers, and facility operators to find common solutions and standard practices that facilitate ITE interchangeability while preserving industry innovation. This fifth edition features clarified wording throughout, changes due to research on the effects of high relative humidity and gaseous pollutants on the corrosion of ITE, and a new environmental class for high-density server equipment. The book also includes a removable reference card with helpful information for facility managers and others. The reference card may also be accessed online. This book is the first in the ASHRAE Datacom Series, authored by ASHRAE Technical Committee 9.9, Mission Critical Facilities, Data Centers, Technology Spaces and Electronic Equipment. The series provides comprehensive treatment of datacom cooling and related subjects.

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PDF Pages	PDF Title
14	Table of Contents
18	Preface
20	Acknowledgments
22	Chapter 1 – Introduction
23	1.1 Book Flow
25	1.2 Primary Users of This Book 1.3 Adoption 1.4 Definitions
30	Chapter 2 – Environmental Guidelines for  Air-Cooled Equipment 2.1 Background
31	Figure 2.1 Server metrics for determining data center operating environment envelope.
32	2.2 New Air-Cooled Equipment Environmental Specifications
35	Figure 2.2 2021 recommended and allowable envelopes for Classes A1, A2, A3 and A4. The recommended envelope is for low levels of pollutants verified by coupon measurements as indicated in note 3 of Section 2.2. Figure 2.3 2021 recommended and allowable envelopes for Classes A1, A2, A3 and A4. The recommended envelope is for high levels of pollutants verified by coupon measurements as indicated in note 3 of Section 2.2.
36	Table 2.1 2021 Thermal Guidelines for Air Cooling— SI Version (I-P Version in Appendix B)
38	2.2.1 Environmental Class Definitions for Air-Cooled Equipment
39	Figure 2.4 Climatogram of Class A3 illustrating how dew-point limits modify relative humidity specification limits.
41	Figure 2.5 World population distribution by altitude. (Courtesy Bill Rankin, www.radicalcartography.net/howhigh.html)
42	Figure 2.6 2021 recommended and allowable envelopes for ASHRAE Class H1. The recommended envelope is for low levels of pollutants verified by coupon measurements as indicated in note 3 of Section 2.2. 2.2.2 Environmental Class Definition for High-Density Air-Cooled Equipment
43	Figure 2.7 2021 recommended and allowable envelopes for ASHRAE Class H1. The recommended envelope is for high levels of pollutants verified by coupon measurements as indicated in note 3 of Section 2.2. Table 2.2 2021 Thermal Guidelines for High-Density Servers— SI Version (I-P Version in Appendix B)
45	Table 2.3 ETSI Class 3.1 and 3.1e Environmental Requirements (ETSI 2014) 2.2.3 ETSI Environmental Specifications
46	2.3 Guide for the Use and Application of the ASHRAE Data Center Classes Figure 2.8 Climatogram of the ETSI Class 3.1 and 3.1e environmental conditions (ETSI 2014).
47	Table 2.4 Ranges of Options to Consider for Optimizing Energy Savings
48	2.4 Server Metrics to CONSIDER IN USING Guidelines
49	2.4.1 Server Power Trend versus Ambient Temperature Figure 2.9 Server power increase (Class A3 is an estimate) versus ambient temperature for Classes A2 and A3.
50	Figure 2.10 Server flow rate increase versus ambient temperature increase.
51	2.4.2 Acoustical Noise Levels versus Ambient Temperature
52	Table 2.5 Expected Increase in A-Weighted Sound Power Level
53	2.4.3 Server Reliability Trend versus Ambient Temperature
55	Table 2.6 Relative ITE Failure Rate x-Factor as Function of Constant ITE Air Inlet Temperature
56	Figure 2.11 Time-weighted x-factor estimates for air-side economizer use for selected U.S. cities. 2.4.4 Server Reliability versus Moisture, Contamination, and Other Temperature Effects
59	2.4.5 Server Performance Trend versus Ambient Temperature
60	2.4.6 Server Cost Trend versus Ambient Temperature
61	2.4.7 Summary of Air-Cooled Equipment Environmental Specifications
62	Chapter 3 – Environmental Guidelines for Liquid-Cooled Equipment
63	3.1 ITE Liquid Cooling 3.1.1 New Construction
64	3.1.2 Expansions 3.1.3 High-Performance Computing and Other High-Density Workloads
65	3.1.4 ITE and Facilities Interface Figure 3.1 Liquid-cooled rack or cabinet with external CDU. Figure 3.2 Combination air- and liquid-cooled rack or cabinet with internal CDU.
66	Figure 3.3 Liquid-cooling systems/loops for a data center.
67	3.2 Facility Water Supply Temperature Classes for ITE 3.2.1 Liquid Cooling Environmental Class Definitions Table 3.1 2021 Thermal Guidelines for Liquid Cooling
68	Figure 3.4 Liquid-cooling Classes W17 and W27 typical infrastructure. Figure 3.5 Liquid-cooling Classes W32, W40, W45, and W+ typical infrastructure.
69	3.2.2 Condensation Considerations
70	Chapter 4 – Facility Temperature and Humidity Measurement
71	4.1 Facility Health and Audit Tests 4.1.1 Aisle Measurement Locations
72	Figure 4.1 Measurement points in aisle. Figure 4.2 Measurement points between rows. 4.1.2 HVAC Operational Status
73	Figure 4.3 Measurement points in a hot-aisle/cold-aisle configuration. 4.1.3 Evaluation
74	4.2 Equipment Installation Verification Tests Figure 4.4 Monitoring points for configured racks.
75	Figure 4.5 Monitoring points for 1U to 3U equipment. Figure 4.6 Monitoring points for 4U to 6U equipment. 4.3 Equipment Troubleshooting Tests
76	Figure 4.7 Monitoring points for 7U and larger equipment. Figure 4.8 Monitoring points for equipment with localized cooling.
77	4.4 COOLING SIMULATION
78	Chapter 5 – Equipment Placement and Airflow Patterns 5.1 Equipment Airflow 5.1.1 Airflow Protocol Syntax 5.1.2 Airflow Protocol for Equipment
79	Figure 5.1 Syntax of face definitions. Figure 5.2 Recommended airflow protocol. 5.1.3 Cabinet Design
80	5.2 Equipment Room Airflow 5.2.1 Placement of Cabinets and Rows of Cabinets Figure 5.3 View of a hot-aisle/cold-aisle configuration.
81	Figure 5.4 Example of hot and cold aisles for raised-floor environments with underfloor cooling. Figure 5.5 Example of hot and cold aisles for non-raised-floor environments with overhead cooling. 5.2.2 Cabinets with Dissimilar Airflow Patterns
82	Figure 5.6 Cold-aisle containment. Figure 5.7 Hot-aisle containment. 5.2.3 Aisle Pitch
83	Figure 5.8 Seven-tile aisle pitch, equipment aligned on hot aisle. Table 5.1 Aisle Pitch Allocation
84	Figure 5.9 Seven-tile aisle pitch, equipment aligned on cold aisle.
86	Chapter 6 – Equipment Manufacturers’ Heat and Airflow Reporting 6.1 Providing Heat Release and Airflow Values
87	6.2 Equipment Thermal Report
88	Table 6.1 Example of Thermal Reporting
89	6.3 EPA Energy Starâ Reporting
92	Appendix A – 2021 ASHRAE Environmental Guidelines for ITE— Expanding the Recommended  Environmental Envelope Table A.1 Comparison of 2004, 2008/2011, 2015, and 2021 Versions of Recommended Envelopes
93	Figure A.1 Highlighted in red is the 2021 recommended envelope for a low level of pollutants. Figure A.2 Highlighted in red is the 2021 recommended envelope for a high level of pollutants.
95	A.1 DRY-BULB TEMPERATURE LIMITS A.1.1 Low End A.1.2 High End
96	Figure A.3 Inlet and component temperatures with fixed fan speed.
97	Figure A.4 Inlet and component temperatures with variable fan speed. A.2 MOISTURE LIMITS A.2.1 High End
100	Figure A.5 Temperature and humidity distribution of a free-cooled data center. A.2.2 Low End
101	A.3 ACOUSTICAL NOISE LEVELS
102	A.4 Data Center Operation Scenarios for the Recommended Environmental Limits
104	Appendix B – 2021 Air-Cooled Equipment  Thermal Guidelines (I-P)
105	Table B.1 2021 Thermal Guidelines for Air Cooling— I-P Version (SI Version in Chapter 2)
107	Table B.2 2021 Thermal Guidelines for High-Density Servers— I-P Version (SI Version in Chapter 2)
110	Appendix C – Detailed Flowchart for the Use and Application of the ASHRAE Data Center Classes C.1 Notes for Figures C.2 Nomenclature for Figures
111	Figure C.1 Guidance for applying thermal guidelines.
112	Figure C.2 Guidance for applying thermal guidelines to new construction projects.
113	Figure C.3 Guidance for applying thermal guidelines to major retrofit projects.
114	Figure C.4 Guidance for applying thermal guidelines to existing facilities looking for efficiency gains.
116	Appendix D – ESD Research and Static Control Measures D.1 ESD Background D.2 ESD RESEARCH
119	Figure D.1 Walking pattern according to ANSI/ESD STM97.2 (ESDA 2016). (Reprinted with permission of EOS/ESD Association, Inc.) Figure D.2 Walking voltage test setup according to ANSI/ESD STM97.2 (ESDA 2016). (Reprinted with permission of EOS/ESD Association, Inc.)
120	Table D.1 Types of Flooring and Shoes Used in Test Program
121	Table D.2 Flooring and Shoes Defined by Electrical Resistance
122	Table D.3 Probabilities of Voltages from Walking Tests Greater than Threshold Values
123	D.3 Personnel and Operational Issues D.4 Flooring Issues
124	D.4.1 Measuring Floor Resistance Figure D.3 Typical test setup for measuring floor conductivity. D.5 Further Reading
126	Appendix E – Research on the Effect of RH and Gaseous Pollutants on  ITE Reliability
127	Figure E.1 2015 thermal environmental conditions of air entering ITE (A1, A2, A3, and A4 represent different environmental envelopes for ITE).
128	Figure E.2 Test specimens: a) standard copper and silver coupons and b) printed circuit board (PCB) coupons. Figure E.3 Experimental setup for mixed flowing gas testing.
129	Figure E.4 Corrosion thicknesses for copper at 50% rh, 70% rh, and 80% rh. E.1 Conclusions From the Research
130	Figure E.5 Corrosion thicknesses for silver at 50% rh, 70% rh, and 80% rh.
132	Appendix F – Psychrometric Charts
133	Figure F.1 Classes A1–A4 allowable and recommended operating conditions for (a) low level of pollutants and (b) high level of pollutants (SI units).
134	Figure F.2 Classes A1–A4 allowable and recommended operating conditions for (a) low level of pollutants and (b) high level of pollutants (I-P units).
135	Figure F.3 Class H1 allowable and recommended operating conditions for (a) low level of pollutants and (b) high level of pollutants (SI units).
136	Figure F.4 Class H1 allowable and recommended operating conditions for (a) low level of pollutants and (b) high level of pollutants (I-P units).
138	Appendix G – Altitude Derating Curves Figure G.1 Classes A1 to A4 temperature versus altitude.
140	Appendix H – Practical Example of the Impact of Compressorless Cooling on Hardware Failure Rates
141	Figure H.1 Histogram of dry-bulb temperatures for Chicago. Figure H.2 Dry-bulb temperatures for Chicago with economization assumptions that include reuse of ITE exhaust heat to maintain a minimum 15°C to 20°C (59°F to 68°F) temperature and a 1.5°C (2.7°F) temperature rise from outdoor air to server inlet.
142	Table H.1 Time-Weighted Failure Rate x-Factor Calculations for Air-Side Economization for ITE in Chicago
144	Appendix I – ITE Reliability Data for Selected Major U.S. and Global Cities
145	I.1 Notes on figures and tables
147	Figure I.1 Failure rate projections for air-side economizer for selected U.S. cities. Figure I.2 Failure rate projections for water-side economizer for selected U.S. cities.
148	Table I.1 Time-Weighted Failure Rate x-Factor Calculations for Class A2 for Air-Side Economization for Selected Major U.S. Cities Assuming 1.5°C (2.7°F) Temperature Rise between Outdoor Ambient Temperature and ITE Inlet Air Temperature
149	Table I.2 Time-Weighted Failure Rate x-Factor Calculations for Class A2 for Water-Side Economization for Selected Major U.S. Cities Assuming 9°C (16.2°F) Temperature Rise between Outdoor Ambient Temperature and ITE Inlet Air Temperature
150	Figure I.3 Failure rate projections for water-side economizer with dry-cooler-type tower for selected U.S. cities. Figure I.4 Failure rate projections for air-side economizer for selected global cities.
151	Table I.3 Time-Weighted Failure Rate x-Factor Calculations for Class A2 for Water-Side Dry-Cooler-Type Tower Economization for Selected Major U.S. Cities Assuming 12°C (21.6°F) Temperature Rise between Outdoor Ambient Temperature and ITE Inlet Air …
152	Table I.4 Time-Weighted Failure Rate x-Factor Calculations for Class A2 for Air-Side Economization for Selected Major Global Cities Assuming 1.5°C (2.7°F) Temperature Rise between Outdoor Ambient Temperature and ITE Inlet Air Temperature
153	Figure I.5 Failure rate projections for water-side economizer for selected global cities. Figure I.6 Failure rate projections for water-side economizer with dry-cooler-type tower for selected global cities.
154	Table I.5 Time-Weighted Failure Rate x-Factor Calculations for Class A2 for Water-Side Economization for Selected Major U.S. Cities Assuming 9°C (16.2°F) Temperature Rise between Outdoor Ambient Temperature and ITE Inlet Air Temperature
155	Table I.6 Time-Weighted Failure Rate x-Factor Calculations for Class A2 for Water-Side Dry-Cooler-Type Tower Economization for Selected Major U.S. Cities Assuming 12°C (21.6°F) Temperature Rise between Outdoor Ambient Temperature and ITE Inlet Air …
156	Figure I.7 Number of hours per year of chiller operation required for air-side economizer for selected U.S. cities. Figure I.8 Number of hours per year of chiller operation required for water-side economizer for selected U.S. cities.
157	Figure I.9 Number of hours per year of chiller operation required for water-side dry-cooler economizer for selected U.S.cities. Figure I.10 Number of hours per year of chiller operation required for air-side economizer for selected global cities.
158	Figure I.11 Number of hours per year of chiller operation required for water-side economizer for selected global cities. Figure I.12 Number of hours per year of chiller operation required for water-side dry-cooler economizer for selected global cities.
160	Appendix J – OSHA and Personnel Working in High Air Temperatures
161	Table J.1 Screening Criteria for ACGIH TLVs® and Action Limits for Heat Stress Exposure (ACGIH 2017)
164	Appendix K – Allowable Server Inlet Temperature Rate of Change
165	Figure K.1 Examples of tape equipment inlet air temperature versus time that are compliant with the 5°C (9°F) in an hour temperature change requirement for data center rooms with tape. equipment. Figure K.2 Examples of tape equipment inlet air temperature versus time that are noncompliant with the 5°C (9°F) in an hour temperature change requirement for data center rooms with tape equipment.
166	Figure K.3 Examples of equipment inlet air temperature versus time that are compliant with the 20°C (36°F) in an hour and the 5°C (9°F) in 15 minutes temperature change requirements for data center rooms that contain other types of ITE not includ… Figure K.4 Examples of equipment inlet air temperature versus time that: a) are noncompliant with the 20°C (36°F) in an hour requirement, b) are noncompliant with the 5°C (9°F) in 15 minutes requirement, and c) are noncompliant with 5°C (9°F) i…
167	Figure K.5 Example of ITE air inlet temperature rate of change (°C/h) calculated over 1 min, 5 min, 15 min, and 60 min time intervals. Figure K.6 Example of time delay between inlet air temperature change to storage array and the corresponding temperature change in HDDs of the storage array.
168	Appendix L – Allowable Server Inlet RH Limits versus Maximum Inlet Dry-Bulb Temperature Figure L.1 Class A3 climatogram illustrating how dew-point limits modify RH specification limits.
169	Figure L.2 Climatogram of recommended ranges for Classes A1 to A4 (see Table 2.1 in Chapter 2 for more details): a) low levels of pollutants and b) high levels of pollutants. Figure L.3 Class A1 and A2 operation climatograms.
170	Figure L.4 Class A3 and A4 operation climatograms. Figure L.5 Class A1 though A4 power off climatogram.
171	Figure L.6 Climatogram of recommended ranges for Class H1 (see Table 2.2 in Chapter 2 for more details): a) low levels of pollutants and b) high levels of pollutants. Figure L.7 Class H1 operation climatogram.
172	References and Bibliography

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Standard Title	ASHRAE Thermal Guidelines for Data Processing Environments, 5th Ed.
Published Code	ASHRAE
Publication Date	2021
Pages Count	178

ASHRAE Book ThermalGuidelines 5ed 2021

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