ASHRAE Book ThermalGuidelinesDataProcessing 4thEdition 2015
$31.96
ASHRAE Datacom Series Book 1: Thermal Guidelines for Data Processing Environments, 4th Edition
| Published By | Publication Date | Number of Pages |
| ASHRAE | 2015 | 162 |
IT equipment environmental requirements are often mismatched with adjacent equipment requirements or with facility operating conditions. How can HVAC equipment manufacturers and installers, data center designers, and facility operators find common solutions and standard practices that facilitate IT equipment interchangeability while preserving industry innovation? Thermal Guidelines for Data Processing Environments provides a framework for improved alignment of efforts among IT equipment hardware manufacturers (including manufacturers of computers, servers, and storage products), HVAC equipment manufacturers, data center designers, and facility operators and managers. This guide covers five primary areas: Equipment operating environment guidelines for air-cooled equipment Environmental guidelines for liquid-cooled equipment Facility temperature and humidity measurement Equipment placement and airflow patterns Equipment manufacturers’ heat load and airflow requirement reporting This fourth edition of Thermal Guidelines features updated information as well as new discussions on topics such as increasing energy efficiency by allowing reducedmoisture levels with minimum risk of electrostatic discharge. The guide provides groundbreaking, vendor-neutral information that will empower data center designers, operators, and managers to better determine the impact of varying design and operation parameters. The book comes with a removable reference card with helpful information for facility managers and others. The reference card may also be accessed online. This book is the first in the ASHRAE Datacom Series, authored by ASHRAE Technical Committee 9.9, Mission Critical Facilities, Data Centers, TechnologySpaces and Electronic Equipment. The series provides comprehensive treatment of datacom cooling and related subjects. Keywords: datacom, data center, data processing, thermal guidelines, IT equipment
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 6 | Contents |
| 12 | Preface to the Fourth Edition |
| 14 | Acknowledgments |
| 16 | I Introduction |
| 17 | Figure 1.1 Heat density trends, projections for information technology products (ASHRAE 2012). Figure 1.2 1U server trends showing 2005 and 2011 projections (ASHRAE 2012). |
| 18 | 1.1 Book Flow |
| 20 | 1.2 Primary Users of This Book 1.3 Compliance 1.4 Definitions and terms |
| 24 | 2.1 Background 2 Environmental Guidelines for Air-Cooled Equipment |
| 25 | Figure 2.1 Server metrics for determining data center operating environment envelope. |
| 26 | 2.2 New Air-Cooled Equipment Environmental Specifications |
| 27 | Figure 2.2 2011 recommended and allowable envelopes for ASHRAE Classes A1, A2, A3, and A4. 2.2.1 Environmental Class Definitions for Air-Cooled Equipment |
| 28 | Figure 2.3 2015 recommended and allowable envelopes for ASHRAE Classes A1, A2, A3, and A4. |
| 29 | Table 2.1 2015 Thermal Guidelines—SI Version (I-P Version in Appendix B) |
| 31 | Figure 2.4 Climatogram of Class A3 illustrating how dew-point limits modify relative humidity specification limits. |
| 32 | Table 2.2 NEBS Environmental Specifications |
| 33 | Table 2.3 ETSI Class 3.1 and 3.1e Environmental Requirements (ETSI 2009) Figure 2.5 Climatogram of the ETSI Class 3.1 and 3.1e environmental conditions (ETSI 2009). |
| 35 | Figure 2.6 World population distribution versus altitude (Cohen and Small 1998). |
| 36 | 2.3 Guide for the Use and Application of the ASHRAE Data Center Classes |
| 37 | 2.4 Server Metrics to Guide Use of New Guidelines |
| 38 | Table 2.4 Range of Options to Consider for Optimizing Energy Savings |
| 39 | 2.4.1 Server Power Trend Versus Ambient Temperature Figure 2.7 Server power increase (Class A3 is an estimate) versus ambient temperature for Classes A2 and A3. |
| 40 | Figure 2.8 Server flow rate increase versus ambient temperature increase. |
| 41 | 2.4.2 Acoustical Noise Levels in Data Center Versus Ambient Temperature |
| 42 | Table 2.5 Expected Increase in A-Weighted Sound Power Level (in Decibels) |
| 43 | 2.4.3 Server Reliability Trend Versus Ambient Temperature |
| 45 | Table 2.6 Relative ITE Failure Rate x-Factor as Function of Constant ITE Air Inlet Temperature |
| 46 | Figure 2.9 Time-weighted x-factor estimates for air-side economizer use for selected U.S. cities. 2.4.4 Server Reliability Versus Moisture, Contamination, and Other Temperature Effects |
| 49 | 2.4.5 Server Performance Trend Versus Ambient Temperature |
| 50 | 2.4.6 Server Cost Trend Versus Ambient Temperature 2.4.7 Summary of New Air-Cooled Equipment Environmental Specifications |
| 52 | 3 Environmental Guidelines for Liquid-Cooled Equipment |
| 53 | 3.1 ITE Liquid Cooling |
| 55 | Figure 3.1 Liquid-cooled rack or cabinet with external CDU. Figure 3.2 Combination air- and liquid-cooled rack or cabinet with internal CDU. |
| 56 | Figure 3.3 Liquid-cooling systems/loops for a data center. 3.2 Facility Water Supply Characteristics for ITE |
| 57 | 3.2.1 Facility Water Supply Temperature Classes for ITE Table 3.1 2011 ASHRAE Liquid-Cooled Guidelines |
| 58 | Figure 3.4 Liquid-cooling Classes W1, W2, and W3 typical infrastructure. Figure 3.5 Liquid-cooling Class W4 typical infrastructure. 3.2.2 Condensation Considerations |
| 59 | Figure 3.6 Liquid-cooling Class W5 typical infrastructure. 3.2.3 Operational Characteristics |
| 60 | Figure 3.7 Typical water flow rates for constant heat load. |
| 61 | 3.2.4 Water Flow Rates/Pressures 3.2.5 Velocity Limits 3.2.6 Water Quality 3.3 Liquid-Cooling Deployments in NEBS-Compliant Spaces Table 3.2 Maximum Velocity Requirements |
| 62 | Table 3.3 Water Quality Specifications Supplied to ITE 3.3.1 NEBS Space Similarities and Differences |
| 63 | Figure 3.8 Liquid cooling systems/loops for a NEBS space. 3.3.2 Use of CDU in NEBS Spaces |
| 64 | 3.3.3 Refrigerant Distribution Infrastructure 3.3.4 Connections 3.3.5 Condensation Consideration 3.3.6 Close-Coupled Cooling Units |
| 66 | 4.1 Facility Health and Audit Tests 4 Facility Temperature and Humidity Measurement |
| 67 | Figure 4.1 Measurement points in aisle. 4.1.1 Aisle Measurement Locations |
| 68 | Figure 4.2 Measurement points between rows. Figure 4.3 Measurement points in a hot-aisle/cold-aisle configuration. |
| 69 | 4.1.2 HVAC Operational Status 4.1.3 Evaluation 4.2 Equipment Installation Verification Tests |
| 70 | Figure 4.4 Monitor points for configured racks. 4.3 Equipment Troubleshooting Tests |
| 71 | Figure 4.5 Monitor points for 1U to 3U equipment. Figure 4.6 Monitor points for 4U to 6U equipment. |
| 72 | Figure 4.7 Monitor points for 7U and larger equipment. Figure 4.8 Monitor points for equipment with localized cooling. |
| 74 | 5.1 Equipment Airflow 5.1.1 Airflow Protocol Syntax 5.1.2 Airflow Protocol for Equipment 5 Equipment Placement and Airflow Patterns |
| 75 | Figure 5.1 Syntax of face definitions. Figure 5.2 Recommended airflow protocol. |
| 76 | 5.1.3 Cabinet Design 5.2 Equipment Room Airflow 5.2.1 Placement of Cabinets and Rows of Cabinets Figure 5.3 View of a hot-aisle/cold-aisle configuration. |
| 77 | Figure 5.4 Example of hot and cold aisles for raised-floor environments with underfloor cooling. Figure 5.5 Example of hot and cold aisles for non-raised-floor environments with overhead cooling. 5.2.2 Cabinets with Dissimilar Airflow Patterns |
| 78 | 5.2.3 Aisle Pitch Figure 5.6 Seven-tile aisle pitch, equipment aligned on hot aisle. |
| 79 | Table 5.1 Aisle Pitch Allocation Figure 5.7 Seven-tile aisle pitch, equipment aligned on cold aisle. |
| 80 | 6.1 Providing Heat Release and Airflow Values 6 Equipment Manufacturers’ Heat and Airflow Reporting |
| 81 | 6.2 Equipment Thermal Report |
| 82 | Table 6.1 Example Thermal Report |
| 84 | 6.3 EPA Energy Star |
| 85 | 6.3.1 Server Thermal Data Reporting Capabilities |
| 86 | Table A.1 Comparison of 2004, 2008/2011, and 2015 Versions of Recommended Envelopes Appendix A 2015 ASHRAE Environmental Guidelines for Datacom Equipment—Expanding the Recommended Environmental Envelope |
| 87 | Figure A.1 2008 recommended environmental envelope (new Classes 1 and 2). |
| 90 | Figure A.2 Inlet and component temperatures with fixed fan speed. Figure A.3 Inlet and component temperatures with variable fan speed. |
| 96 | Appendix B 2015 Air-Cooled Equipment Thermal Guidelines (I-P) |
| 97 | Table B.1 2015 Thermal Guidelines—I-P Version (SI Version in Table 2.1) |
| 100 | Appendix C Detailed Flowchart for the Use and Application of the ASHRAE Data Center Classes |
| 101 | Figure C.1 Guidance for applying thermal guidelines. |
| 102 | Figure C.2 Guidance for applying thermal guidelines to new construction projects. |
| 103 | Figure C.3 Guidance for applying thermal guidelines to major retrofit projects. |
| 104 | Figure C.4 Guidance for applying thermal guidelines to existing facilities looking for efficiency gains. |
| 106 | Appendix D ESD Research and Static Control Measures |
| 108 | Figure D.1 Walking pattern according to ANSI/ESD STM97.2. |
| 109 | Figure D.2 Walking voltage test setup according to ANSI/ESD STM97.2. |
| 110 | Table D.1 Types of Floor and Shoes Used in Test Program Table D.2 Flooring and Shoes Defined by Electrical Resistance |
| 112 | Table D.3 Probabilities of Voltages from Walking Tests Greater than Threshold Values |
| 113 | D.2 Personnel and Operational Issues D.3 Flooring Issues |
| 114 | Figure D.3 Typical test setup to measure floor conductivity. |
| 116 | Appendix E OSHA and Personnel Working in High Air Temperatures |
| 117 | Table E.1 Permissible Heat Exposure Threshold Limit Value (TLV) (ACGIH 1992) |
| 118 | Appendix F Psychrometric Charts |
| 119 | Figure F.1 Allowable Class A1 through A4 operating conditions (SI units). Figure F.2 Allowable Class A1 through A4 operating conditions (I-P units). |
| 120 | Figure F.3 Allowable data center and NEBS operating conditions (SI units). Figure F.4 Allowable data center and NEBS operating conditions (I-P units). |
| 121 | Figure F.5 Recommended data center and central office operating conditions (SI units). Figure F.6 Recommended data center and central office operating conditions (I-P units). |
| 122 | Appendix G Altitude Derating Curves |
| 123 | Figure G.1 Class A1 to A4 temperature versus altitude. Figure G.2 Classes A1 and A2 and NEBS temperature versus altitude. |
| 124 | Appendix H Practical Example of the Impact of Compressorless Cooling on Hardware Failure Rates |
| 125 | Figure H.1 Histogram of dry-bulb temperatures for Chicago. Figure H.2 Dry-bulb temperatures for Chicago with economization assumptions that include reuse of ITE exhaust heat to maintain a minimum 15°C to 20°C (59°F to 68°F) temperature and a 1.5°C (2.7°F) temperature rise from outdoor air to server inlet. |
| 126 | Table H.1 Time-at-Temperature Weighted Failure Rate Calculation for ITE in Chicago |
| 128 | Appendix I ITE Reliability Data for Selected Major U.S. and Global Cities |
| 131 | Figure I.1 Failure rate projections for air-side economizer for selected U.S. cities. Figure I.2 Failure rate projections for water-side economizer for selected U.S. cities. |
| 132 | Table I.1 Time-Weighted Failure Rate x-Factor Calculations for Class A2 for Air-Side Economization for Selected Major U.S. Cities Assuming 1.5°C (2.7°F) Temperature Rise between Outdoor Ambient Temperature and ITE Inlet Air Temperature |
| 133 | Table I.2 Time-Weighted Failure Rate x-Factor Calculations for Class A2 for Water-Side Economization for Selected Major U.S. Cities Assuming 9°C (16.2°F) Temperature Rise between Outdoor Ambient Temperature and ITE Inlet Air Temperature |
| 134 | Figure I.3 Failure rate projections for water-side economizer with dry- cooler-type tower for selected U.S. cities. Figure I.4 Failure rate projections for air-side economizer for selected global cities. |
| 135 | Table I.3 Time-Weighted Failure Rate x-Factor Calculations for Class A2 for Water-Side Dry-Cooler-Type Tower Economization for Selected Major U.S. Cities Assuming 12°C (21.6°F) Temperature Rise between Outdoor Ambient Temperature and ITE Inlet Air … |
| 136 | Table I.4 Time-Weighted Failure Rate x-Factor Calculations for Class A2 for Air-Side Economization for Selected Major Global Cities Assuming 1.5°C (2.7°F) Temperature Rise between Outdoor Ambient Temperature and ITE Inlet Air Temperature |
| 137 | Figure I.5 Failure rate projections for water-side economizer for selected global cities. Figure I.6 Failure rate projections for water-side economizer with dry- cooler-type tower for selected global cities. |
| 138 | Table I.5 Time-Weighted Failure Rate x-Factor Calculations for Class A2 for Water-Side Economization for Selected Major U.S. Cities Assuming 9°C (16.2°F) Temperature Rise between Outdoor Ambient Temperature and ITE Inlet Air Temperature |
| 139 | Table I.6 Time-Weighted Failure Rate x-Factor Calculations for Class A2 for Water-Side Dry-Cooler-ype Tower Economization for Selected Major U.S. Cities Assuming 12°C (21.6°F) Temperature Rise between Outdoor Ambient Temperature and ITE Inlet Air T… |
| 140 | Figure I.7 Number of hours per year of chiller operation required for air- side economizer for selected U.S. cities. Figure I.8 Number of hours per year of chiller operation required for water-side economizer for selected U.S. cities. |
| 141 | Figure I.9 Number of hours per year of chiller operation required for water-side dry-cooler economizer for selected U.S.cities. Figure I.10 Number of hours per year of chiller operation required for air- side economizer for selected global cities. |
| 142 | Figure I.11 Number of hours per year of chiller operation required for water-side economizer for selected global cities. Figure I.12 Number of hours per year of chiller operation required for water-side dry-cooler economizer for selected global cities. |
| 144 | Appendix J Most Common Problems in Water-Cooled Systems |
| 145 | J.2 Fouling—Insoluble particulate matter in water J.3 Scale—Precipitation of salts directly on metal surfaces J.4 Microbiologically induced corrosion— Corrosion due to bacteria, fungi, and algae |
| 148 | Figure K.1 Examples of tape equipment inlet air temperature versus time that are compliant with the 5°C (9°F) in an hour temperature change requirement for data center rooms with tape. equipment. Figure K.2 Examples of tape equipment inlet air temperature versus time that are noncompliant with the 5°C (9°F) in an hour temperature change requirement for data center rooms with tape equipment. Appendix K Allowable Server Inlet Temperature Rate of Change |
| 149 | Figure K.3 Examples of equipment inlet air temperature versus time that are compliant with the 20°C (36°F) in an hour and the 5°C (9°F) in 15 minutes temperature change requirement for data center rooms that contain other types of ITE not includi… Figure K.4 Examples of equipment inlet air temperature versus time that: a) are noncompliant with the 20°C (36°F) in an hour, b) are noncompliant with the 5°C (9°F) in 15 minutes temperature change, and c) are noncompliant with 5°C (9°F) in 15 … |
| 150 | Figure K.5 Example of ITE air inlet temperature rate of change (°C/h) calculated over 1 min, 5 min, 15 min, and 60 min time intervals. |
| 151 | Figure K.6 Example of time delay between inlet air temperature change to storage array and the corresponding temperature change in hard-disk drives of the storage array. |
| 152 | Appendix L Allowable Server Inlet RH Limits Versus Maximum Inlet Dry-Bulb Temperature |
| 153 | Figure L.1 Class A3 climatogram illustrating how dew-point limits modify RH specification limits. Figure L.2 Climatogram of recommended range for Classes A1 to A4. Figure L.3 Class A1 and A2 operation climatograms. |
| 154 | Figure L.4 Class A1 and Class A2 power-off climatogram. Figure L.5 Class A3 operation and power-off climatograms. Figure L.6 Class A4 operation and power-off climatograms. |
| 155 | Figure L.7 Class B and Class C operation climatograms. Figure L.8 Classes B and Class C power-off climatogram. |
| 156 | References and Bibliography |
