ASHRAE DesignGuide CleanRooms 2017
$92.63
ASHRAE Design Guide for Cleanrooms: Fundamentals, Systems, and Performance
Published By | Publication Date | Number of Pages |
ASHRAE | 2017 | 450 |
ASHRAE Design Guide for Cleanrooms provides the information needed for successful cleanroom projects. Designers, builders, owners, and operators of cleanrooms will find this book an indispensable resource. The guide begins with fundamentals such as cleanroom classification and airflow, standards and guidelines for cleanroom design, and sources of contaminants inside cleanrooms, including separate chapters on airborne particulate contaminants, surface particulate contaminants, airborne molecular contaminants, liquid-borne contaminants, and microbial contaminants. From there, guidance proceeds to specific recommendations on design of environmental control systems, covering planning and concerns such as contamination control, site selection and services requirements, critical flow arrangements, architectural considerations, indoor environmental quality, outdoor emission control and outdoor air intake, and safety. Additional chapters discuss electrical, control, and lighting systems, as well as using computational fluid dynamics (CFD) to assist in cleanroom design. Finally, dedicated chapters address cleanroom testing and certification, qualification, commissioning, and the needs of cleanrooms in specific facility types, such as semiconductor and electronics, pharmaceutical, biotechnology and health care, and food processing.
PDF Catalog
PDF Pages | PDF Title |
---|---|
2 | ASHRAE Design Guide for Cleanrooms |
6 | Authors and Contributors |
8 | Contents |
16 | Preface |
18 | Acknowledgments |
20 | Abbreviations and Acronyms |
24 | Chapter 1 1.1 HISTORY OF CLEANROOMS AND CLEANROOM STANDARDS |
25 | 1.2 EVOLUTION OF INTERNATIONAL STANDARDS FOR CLEANROOM DESIGN |
26 | 1.3 CLASSIFICATION OF CLEANROOMS |
27 | 1.4 CLEANROOMS REQUIRED BY VARIOUS INDUSTRIES 1.5 CLEANROOM AIRFLOW |
30 | 1.6 SOURCES OF CONTAMINANTS INSIDE CLEANROOMS |
32 | 1.7 EFFECTOFHUMANINTERFERENCE |
33 | 1.8 REFERENCES |
35 | 1.9 BIBLIOGRAPHY |
38 | Chapter 2 2.1 AIRBORNE PARTICLES AND THEIR PROPERTIES OF RELEVANCE TO CLEANROOMS |
39 | 2.2 DISPERSION OF AIRBORNE CONTAMINANTS |
40 | 2.3 PARTICLE SIZE DISTRIBUTION |
41 | 2.4 CONTAMINATION RISKS AND ASSESSMENT |
43 | 2.5 SAMPLING TECHNIQUES |
44 | 2.6 PARTICLE COUNTERS |
50 | 2.7 FIBROUS FILTERS |
52 | 2.8 FILTRATION MECHANISMS |
53 | 2.9 MEMBRANE FILTERS |
54 | 2.10 TYPE AND CONSTRUCTION OF HIGH-EFFICIENCY FILTERS FOR CLEANROOMS |
57 | 2.11 TESTING OF HIGH-EFFICIENCY FILTERS |
60 | 2.12 AIRBORNE ULTRAFINE PARTICLES AND MEASUREMENT |
63 | 2.13 AIRBORNE MACROPARTICLES AND MEASUREMENT |
64 | 2.14 STATISTICAL ANALYSIS |
65 | 2.15 REFERENCES |
70 | Chapter 3 3.1 SURFACE PARTICLE DEPOSITION |
71 | 3.2 PARTICLE ADHESION TO SURFACES |
72 | 3.3 RATE OF DEPOSITION OF NONVOLATILE RESIDUE |
74 | 3.4 PARTICLE DEPOSITION VELOCITY |
75 | 3.5 SURFACE PARTICLE MEASUREMENT |
78 | 3.6 PARTICLE IDENTIFICATION AND ELECTRON MICROSCOPY SCANNING |
80 | 3.7 PRODUCT CLEANLINESS LEVELS |
82 | 3.8 SURFACE CLEANING |
86 | 3.9 REFERENCES |
87 | 3.10 BIBLIOGRAPHY |
88 | Chapter 4 4.1 SUMMARY OF AIRBORNE MOLECULAR CONTAMINATION SOURCES AND TYPES |
89 | 4.2 OFF-GASSED ORGANIC COMPOUNDS FROM CLEANROOM MATERIALS AND COMPONENTS |
92 | 4.3 CLASSIFICATION OF AIRBORNE MOLECULAR CONTAMINATION |
102 | 4.4 MEASUREMENT, TESTING, AND COMPLIANCE |
105 | 4.5 REFERENCES |
106 | 4.6 BIBLIOGRAPHY |
108 | Chapter 5 |
109 | 5.1 PARTICLES IN PROCESS LIQUIDS |
110 | 5.2 LIQUID-BORNE PARTICLE COUNTERS AND TURBIDITY METERS |
113 | 5.3 LIQUID FILTRATION |
114 | 5.4 REFERENCES |
116 | Chapter 6 6.1 PRINCIPLE OF BIOCONTAMINATION CONTROL |
117 | 6.2 DETERMINATION OF AIRBORNE BIOCONTAMINATION |
121 | 6.3 DETERMINATION OF SURFACE BIOCONTAMINATION |
123 | 6.4 DETERMINATION OF LIQUID BIOCONTAMINATION 6.5 EVALUATION AND EXPRESSION OF SAMPLING DATA |
125 | 6.6 CLEANING AND DISINFECTION |
127 | 6.7 REFERENCES |
130 | 6.8 BIBLIOGRAPHY |
134 | Chapter 7 7.1 CONTAMINATION CONTROL CONSIDERATIONS |
135 | 7.2 SITE SELECTION AND SERVICES REQUIREMENT 7.3 CRITICAL FLOW ARRANGEMENTS—PERSONNEL, MATERIALS, PRODUCTS, AND WASTE |
137 | 7.4 FACILITY DESIGN CONSIDERATIONS |
150 | 7.5 ARCHITECTURAL CONSIDERATIONS 7.6 INDOOR ENVIRONMENTAL QUALITY |
151 | 7.7 OUTDOOR EMISSION CONTROL AND OUTDOOR AIR INTAKE 7.8 DESIGN FOR SAFETY CONCERNS |
152 | 7.9 SECURITY AND ACCESS CONTROL 7.10 BUILDING CODES AND STANDARDS |
166 | 7.11 CONSTRUCTION PROTOCOL |
167 | 7.12 PROJECT SIZE, BUDGET, AND SCHEDULE |
168 | 7.13 REFERENCES |
169 | 7.14 BIBLIOGRAPHY |
174 | Chapter 8 8.1 AIRFLOW PATTERNS |
176 | 8.2 CONTAMINATION CONTROLS IN ROOM AIRFLOW PATH DESIGN |
177 | 8.3 CLEANROOM HVAC SYSTEM CONFIGURATION |
180 | 8.4 CLEANROOM AIRFLOW RATE DETERMINATION |
192 | 8.5 CLEANROOM PRESSURE CONTROL |
202 | 8.6 QUANTITATIVE ANALYSIS OF PARTICLE MIGRATION UNDER PRESSURE DIFFERENTIALS |
206 | 8.7 PARTICLE MIGRATION ACROSS A CLOSED DOOR UNDER SIGNIFICANT CONCENTRATION DIFFERENCE |
207 | 8.8 REQUIRED PRESSURE DIFFERENTIAL ACROSS CLEANROOM ENVELOPE |
208 | 8.9 CLEANROOMAIRLOCKS |
212 | 8.10 AIR LOCK GENERAL APPLICATION 8.11 PERFORMANCE COMPARISON AMONG AIR LOCKS |
214 | 8.12 ENERGY-EFFICIENT AND COST-EFFECTIVE CLEANROOM DESIGN |
215 | 8.13 DEMAND-BASED CONTROL FOR CLEANROOMS |
216 | 8.14 REFERENCES |
218 | 8.15 BIBLIOGRAPHY |
220 | Chapter 9 9.1 TEMPERATURE |
221 | 9.2 HUMIDITY |
222 | 9.3 EXHAUST 9.4 COST CONSIDERATIONS 9.5 AIRBORNE MOLECULAR CONTAMINATION |
223 | 9.6 MAKEUP AIR 9.7 PROCESS EXHAUST 9.8 FILTRATION SYSTEMS |
224 | 9.9 REFERENCES 9.10 BIBLIOGRAPHY |
226 | Chapter 10 10.1 INTRODUCTION 10.2 SITE MASTER PLANNING |
227 | 10.3 RELIABILITY AND REDUNDANCY |
228 | 10.4 ELECTRICAL LOADS 10.5 VOLTAGE AND FREQUENCY CONSIDERATIONS |
229 | 10.6 POWER (VOLTAGE) QUALITY 10.7 HARMONICS MITIGATION AND POWER FACTOR CORRECTION |
230 | 10.8 TYPES OF POWER |
231 | 10.9 CODES AND STANDARDS 10.10 POWER DISTRIBUTION CONFIGURATIONS |
233 | 10.11 ELECTRICAL EQUIPMENT LOCATION |
234 | 10.12 POWER MONITORING SYSTEM 10.13 UPS POWER |
235 | 10.14 CENTRAL VERSUS POINT-OF-USE UNIT SUBSTATION TRANSFORMERS FOR TOOL POWER DISTRIBUTION |
236 | 10.15 GROUNDING |
237 | 10.16 LIGHTNING PROTECTION SYSTEM |
238 | 10.17 POWER DISTRIBUTION EQUIPMENT |
239 | 10.18 EMERGENCY POWER |
240 | 10.19 LIGHTING SYSTEM 10.20 FFU POWER DISTRIBUTION 10.21 SUBFAB POWER DISTRIBUTION 10.22 EMI ISSUES |
241 | 10.23 REFERENCES |
242 | Chapter 11 11.1 INTRODUCTION |
246 | 11.2 CONTROL SYSTEM ARCHITECTURE |
260 | 11.3 REFERENCES 11.4 BIBLIOGRAPHY |
262 | Chapter 12 12.1 INTRODUCTION 12.2 CODES AND STANDARDS |
263 | 12.3 REDUNDANCY AND RELIABILITY 12.4 LIGHTING SOURCES ANDSYSTEM INSTALLATION |
265 | 12.5 LIGHTING CONTROLS AND LIGHTING LEVELS |
266 | 12.6 LIGHTING FIXTURE ACCESS AND MAINTAINABILITY 12.7 REFERENCES 12.8 BIBLIOGRAPHY |
268 | Chapter 13 |
271 | 13.1 REFERENCE |
272 | 13.2 BIBLIOGRAPHY |
274 | Chapter 14 |
275 | 14.1 HEALTH CARE 14.2 PHARMACEUTICAL |
278 | 14.3 ELECTRONIC AND GENERAL |
279 | 14.4 WAFER FABRICATION AND NANOTECHNOLOGY |
280 | 14.5 REFERENCES |
284 | Chapter 15 15.1 TERMINOLOGY |
285 | 15.2 TEST SELECTION 15.3 ORDER OF TESTS 15.4 INDUSTRIAL APPLICATION REQUIREMENTS |
288 | 15.5 TYPICAL CLEANROOM TESTING EQUIPMENT 15.6 CLEANROOM ACCEPTANCE CRITERIA |
289 | 15.7 REQUIRED TESTS FOR CERTIFICATION |
304 | 15.8 REFERENCES |
305 | 15.9 BIBLIOGRAPHY |
308 | Chapter 16 16.1 DESIGN-PHASE COMMISSIONING |
309 | 16.2 INSTALLATION VERIFICATION COMMISSIONING |
310 | 16.3 OPERATIONAL VERIFICATION COMMISSIONING |
311 | 16.4 POSTOCCUPANCY COMMISSIONING |
312 | 16.5 BIBLIOGRAPHY |
314 | Chapter 17 17.1 QUALIFICATION TERMINOLOGY |
316 | 17.2 INTRODUCTION |
317 | 17.3 WHY DO WE NEED TO QUALIFY? |
318 | 17.4 DOCUMENTATION REQUIREMENTS |
319 | 17.5 QUALIFICATION PROCESS FOR CLEAN SPACES 17.6 REQUIREMENTS DEFINITION |
322 | 17.7 SPECIFICATION AND DESIGN |
323 | 17.8 COMMISSIONING AND QUALIFICATION |
324 | 17.9 ACCEPTANCE AND RELEASE 17.10 OPERATION AND CONTINUOUS IMPROVEMENT |
325 | 17.11 CONCLUSION 17.12 REFERENCES |
327 | 17.13 BIBLIOGRAPHY |
332 | Chapter 18 18.1 A BRIEF HISTORY OF SEMICONDUCTORS AND INTEGRATED CIRCUITS |
334 | 18.2 SEMICONDUCTOR MANUFACTURING—AN EVER-CHANGING INDUSTRY |
335 | 18.3 FAB DESIGN PROCESS |
342 | 18.4 BUILDING CODES |
344 | 18.5 SEMICONDUCTOR FAB ARCHITECTURAL LAYOUT |
345 | 18.6 MATERIAL-HANDLING SYSTEMS 18.7 CONTAMINATION CONTROL |
348 | 18.8 AIR PATTERN EFFECTIVENESS AND COMPUTER-AIDED FLOW MODELING 18.9 INDOOR DESIGN CONDITIONS |
350 | 18.10 MAKEUP AIR |
356 | 18.11 CLEANROOM CLEANLINESS AND AIRFLOW CONCEPTS |
363 | 18.12 PROCESS AREA AIR MANAGEMENT |
365 | 18.13 RAISED-FLOOR AIR PLENUM AIR MANAGEMENT |
366 | 18.14 SUBFAB AIR MANAGEMENT |
367 | 18.15 PRIMARY PROCESS AREA AIRFLOW |
368 | 18.16 PRESSURE CONTROL |
369 | 18.17 TEMPERATURE AND HUMIDITY CONTROL 18.18 ROOM AIR CHANGE RATE AND AIR VELOCITY |
372 | 18.19 COOLING AND HEATING LOADS 18.20 UTILITIES 18.21 PROCESS EXHAUST |
374 | 18.22 OTHER PROCESS UTILITIES |
376 | 18.23 ARCHITECTURAL COMPONENTS |
378 | 18.24 AIR SHOWERS 18.25 CONSTRUCTION PROTOCOL 18.26 CLEANROOM CERTIFICATION |
379 | 18.27 NEXT-GENERATION WAFER FABS |
380 | 18.28 REFERENCES |
384 | Chapter 19 19.1 GENERAL CONSIDERATIONS |
392 | 19.2 HVAC DESIGN FOR VARIOUS TYPES OFPHARMACEUTICAL FACILITIES 19.3 FACILITY DESIGN CONSIDERATIONS |
418 | 19.4 RESOURCES |
420 | 19.5 REFERENCES |
423 | 19.6 BIBLIOGRAPHY |
424 | Chapter 20 20.1 GENERAL REQUIREMENTS FOR BIOTECHNOLOGY FACILITIES |
425 | 20.2 BIOTECHNOLOGY FACILITIES DESIGN GUIDELINES |
427 | 20.3 CONTROL OF PARTICLE AND MICROBIOLOGICAL CONTAMINATION |
428 | 20.4 ENGINEERING DESIGN CONSIDERATIONS FOR VALIDATED SYSTEMS |
429 | 20.5 ROOM PRESSURE AND VENTILATION REQUIREMENTS |
432 | 20.6 FACILITY-LEVEL BIOPHARMACEUTICAL DESIGN CONSIDERATIONS |
435 | 20.7 CLEANROOM AREAS FOR HEALTH CARE FACILITIES |
439 | 20.8 REFERENCES |
442 | Chapter 21 21.1 DESIGN CONSIDERATIONS |
443 | 21.2 FACILITY CONFIGURATIONS AND PLANNING |
444 | 21.3 DESIGN CRITERIA AND INDOOR AIR QUALITY 21.4 CLEANROOM QUALIFICATION 21.5 ABOUT HACCP |
446 | 21.6 REFERENCES |
447 | 21.7 BIBLIOGRAPHY |