ASHRAE ParticulateandGaseousContaminationinDatacomEnvironments 09 2009
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Particulate and Gaseous Contamination in Datacom Environments
| Published By | Publication Date | Number of Pages |
| ASHRAE | 2009 | 105 |
Even though particle contamination resulting from dust and dirt can lead to unexpected shutdowns of critical IT equipment, the connection between contamination and hardware failures is often overlooked.Particulate and Gaseous Contamination in Datacom Environments sheds light on this issue and will provide readers with the information they need to maintain a high level of IT equipment dependability and availability. This book identifies datacom equipment susceptibility and operational impact, as well as strategies for prevention, control, contamination testing, and analysis.This book is the eighth in a series of datacom books authored by ASHRAE Technical Committee 9.9, Mission Critical Facilities, Technology Spaces and Electronic Equipment. This series provides comprehensive treatment of datacom cooling and related subjects.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 13 | 1.1 General Description of Particulate Matter |
| 14 | Figure 1.1 Size ranges of various PM sources. 1.2 General Description of Gaseous Contamination |
| 15 | 1.3 Contaminant Sources |
| 16 | Figure 1.2 Filter efficiency of commonly used filters in datacom environments. 1.4 How Contaminants Settle on Equipment |
| 17 | Figure 1.3 Airflow in a raised-access floor data center. |
| 18 | 1.5 Differences between Human Health and Datacom Equipment concerns |
| 19 | 1.6 Overview of Chapters |
| 22 | 2.1 Introduction |
| 23 | 2.2 Reasons for Increased Concern 2.2.1 Restriction of Hazardous Substances 2.3 Airborne Contamination Ingress Mechanisms 2.4 Particulate Matter Properties and Effects |
| 24 | 2.4.1 Areas Susceptible to Particulate Matter Accumulation |
| 25 | 2.4.1.1 Air Intake and Exhaust 2.4.1.2 Fans 2.4.1.3 Heat Sinks and Cooling Mechanisms 2.4.1.4 Magnetic Media and Optical Drive Mechanisms 2.4.1.5 Electrical Signals and Interconnects |
| 26 | Figure 2.1 PM accumulation in a fine-pitch heat sink. Fibers have bridged gaps between fins and are now trapping additional material. This heat sink will continue accumulating PM until it is completely covered. The deposited material becomes an incre… |
| 27 | Figure 2.2 Exit vents viewed from inside a system (cover removed). PM accumulation blocks a significant portion of the available area. Notice there is not much accumulation of the printed circuit board itself. Figure 2.3 An example of accumulation around unexpected intakes. PM is shown in the small gap surrounding the connector sockets. |
| 28 | Figure 2.4 Scanning electron microscope (SEM) image of PM accumulation from a heat sink. Also, notice how the intertwined fibers form a matrix that traps smaller particulates. Notice that most of the material is far larger than 10 microns (3.94 × 10… Figure 2.5 These fibers were recovered from a heat sink after exposure to field use conditions. The scale markings at the bottom of the photograph are 1 mm (0.04 in.) each. Some fibers are 5 mm (0.20 in.) in length. |
| 29 | Figure 2.6 This optical photograph shows the copper sulfide bridging between the integrated circuit leads and a contact on the card. Figure 2.7 A conductive substance frequently found on the underside of wood-core floor panels with flat, zinc-coated steel bottoms. Zinc whiskers are typically several micrometers in length. Airborne introduction of zinc whiskers into datacom equipme… |
| 30 | 2.5 Gaseous Contamination 2.5.1 Gas Properties 2.5.1.1 Corrosion Risks From Airborne Contamination |
| 31 | Table 2.1 Compounds of Most Concern in the Datacom Equipment Center |
| 32 | Figure 2.8 The top left and top right micrographs show the resistor in low magnification. The bottom left and bottom right micrographs show silver sulfide flowers protruding out from under the dielectric insulation. The resistor terminal was electric… |
| 34 | 3.1 Introduction |
| 35 | 3.2 Published Guidelines and Limits for Particulate matter 3.2.1 GR-63-CORE/Network Equipment-Building Systems— Telecommunications Table 3.1 Average Annual Levels of Indoor Contaminants |
| 36 | 3.2.2 IEC 60721-3-3 Table 3.2 Environmental Parameters of IEC 60721-3-3 (IEC 2002) |
| 37 | 3.2.3 Federal Standard 209E-100,000 (M6.5) and ISO 14644-1 Class 8 |
| 38 | Table 3.3 Airborne Particulate Cleanliness Class Comparison |
| 39 | Table 3.4 ISO Air Cleanliness Classifications vs. Maximum Particle Concentrations Allowed (particles/m3 [in.3]) 3.3 Published Guidelines and Limits for Gaseous Contaminants |
| 40 | Table 3.5 ISA Corrosion Class Levels (ISA 1985) |
| 41 | Table 3.6 Published Gaseous Contaminants for IT Equipment |
| 42 | 4.1 Introduction |
| 43 | 4.2 Prevention 4.2.1 Risk Assessment |
| 44 | 4.2.2 Facility Location 4.2.3 Computer Room Design |
| 45 | 4.2.3.1 Attached/Adjacent Staging Areas 4.2.3.2 Attached/Adjacent Storage Areas |
| 46 | 4.2.3.3 Traffic Flow 4.2.3.4 Office and Operations Areas 4.2.4 Computer Room Construction |
| 47 | 4.2.4.1 Wall, Ceiling, Underfloor Materials, and Surfaces |
| 49 | 4.2.4.2 Fit and Finish |
| 50 | Figure 1.1 Column with a large hole. |
| 51 | 4.2.5 HVAC System 4.2.5.1 Makeup Air 4.2.5.2 Positive Pressurization 4.2.5.3 Humidification Systems |
| 52 | 1. Potable water essentially has no treatment other than filtration. Unless the potable water source is one of very low dissolved solids, this source will significantly increase maintenance and repair costs. |
| 53 | 5. Boiler feed water systems exist in many larger facilities. This water could be used for humidification systems as it generally has a reduced level of contaminants; however, the specific water chemistry needs to be fully understood and compared to … |
| 54 | 4.2.5.4 Air Filtration |
| 55 | Table 4.1 Values from ASHRAE Standard 52.2 |
| 56 | 4.2.6 Fire Suppression System 4.2.7 Mechanical Malfunction |
| 57 | 4.2.7.1 Ceiling Returns |
| 58 | 4.2.8 Operational Procedures 4.2.8.1 Record Keeping 4.2.8.2 Control Access |
| 59 | 4.2.8.3 Track-Off Matting and Contamination Control Mats 4.2.8.4 Datacom Equipment Center Change Control |
| 60 | 4.3 Control 4.3.1 Monitoring 4.3.2 Equipment Failures—Severe |
| 61 | 4.3.3 Equipment Failures—Nonsevere 4.3.4 Periodic Maintenance Plan |
| 63 | 4.3.5 Nonroutine Events 4.3.5.1 Clean Up Your Mess! 4.3.5.2 Contractor Cleanup 4.3.5.3 Contamination Control During Construction and Other Major Events |
| 64 | 4.3.5.4 Disaster Response and Contamination Control |
| 65 | 4.4 Special Considerations Based on Datacom Equipment Center Levels |
| 66 | 5.1 Introduction |
| 67 | 5.2 Airborne Particle Counts |
| 69 | 5.3 Total Suspended Particulates |
| 70 | 5.4 Mass Concentration 5.5 Corrosiveness of Particulate Matter 5.6 Volatile Organic Compounds |
| 71 | Figure 5.1 Interdigitated card results. 5.7 Real-time Gaseous Monitoring |
| 73 | 5.8 Settled dust analysis |
| 74 | 6.1 Introduction 6.2 Implementing Air-Side Economizers |
| 80 | Datacom Environment Level 0 Datacom Environment Level 1 |
| 81 | Datacom Environment Level 2— Server Closet (Bailey et Al. 2007) Datacom Environment Level 3— Server Room (Bailey et al. 2007) Datacom Environment Level 4— Data Center (Bailey et al. 2007) |
| 84 | C.1 Objectives 1. Measure particulate concentration (size range: 0.01–2.5 µm [3.93701 × 10–7– 9.8452 × 10–5 in.]) in a data center using partial and full air-side economizer modes with three different ratings—minumum efficiency reporting value (MERV) 7… 3. Measure variation in fan energy and the overall energy savings from the economizer system in different MERV filter scenarios. C.2 Sampling Site |
| 85 | Figure C.1 Layout of the data center and AHU (chiller system not in illustration). C.3 Sampling Periods |
| 86 | C.4 Experimental Methods C.5 Analysis and Results |
| 87 | Figure C.2 Filter setup for indoor and outdoor particulate matter (PM). |
| 88 | REFERENCES |
| 91 | Bibliography |
| 100 | A B C |
| 101 | D E F |
| 102 | G H I L M N O |
| 103 | P Q R S T U V |
| 104 | W X Z |
