ASTM-F3147:2015 Edition
$35.75
F3147-15 Standard Test Method for Evaluating the Reliability of Surface Mounted Device (SMD) Joints on a Flexible Circuit by a Rolling Mandrel Bend
| Published By | Publication Date | Number of Pages |
| ASTM | 2015 | 3 |
ASTM F3147-15
Withdrawn Standard: Standard Test Method for Evaluating the Reliability of Surface Mounted Device (SMD) Joints on a Flexible Circuit by a Rolling Mandrel Bend (Withdrawn 2024)
ASTM F3147
Scope
1.1 This test method covers a means to test a completed Surface Mounted Device (SMD) joint for bond strength and inter-layer stress compatibility
1.2 A completed SMD joint includes; SMD (LED, resistor, etc), PTF ink land (typically silver), conductive adhesive (typically silver), staking compound (non-conductive), and encapsulant (non-conductive).
Keywords
bend; conductive adhesive; encapsulant; land-pad; mandrel; printed flexible circuit; SMD; staking compound;
ICS Code
ICS Number Code 31.020 (Electronic components in general)
DOI: 10.1520/F3147-15
