BICSI EIBG 2 2022
$32.50
Essentials of ICT Bonding and Grounding, Version 2.0
| Published By | Publication Date | Number of Pages |
| BICSI | 2022 |
The bonding of the information and communications technology (ICT) infrastructure to a building’s grounding system is an important element in safeguarding personnel, property, and equipment from foreign electrical voltages and currents. The new Version 2 of BICSI’s Essentials of ICT Bonding and Grounding provides the common foundational knowledge needed for all aspects of bonding the ICT infrastructure, paving the way for designers, technicians and installers to design and implement a successful bonding infrastructure.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 1 | Essentials of ICT Bonding and Grounding |
| 2 | Preface |
| 4 | WARNING |
| 6 | Acknowledgments |
| 7 | Reader’s Comment Form |
| 8 | Acronyms and Abbreviations A B C D E G |
| 9 | H I L M N O P |
| 10 | R S T U V W |
| 11 | Units of Measurement |
| 12 | Table of Contents |
| 13 | Figures |
| 15 | Tables |
| 16 | Chapter 1: Bonding and Grounding (Earthing) Fundamentals |
| 17 | Table of Contents |
| 19 | Figures Tables |
| 20 | Bonding and Grounding (Earthing) Fundamentals Introduction |
| 21 | Why Bonding and Grounding (Earthing)? |
| 22 | Electricity and Conductors Overview Ohm’s Law |
| 23 | Conductors |
| 24 | Description of Conductors |
| 25 | Comparison of Solid Conductors Solid Conductors versus Stranded Conductors |
| 26 | American Wire Gauge (AWG) Solid Conductor Diameters Differences Between Solid and Stranded Conductor Diameters Circular Mils |
| 27 | Square Mils Busbars |
| 28 | Alternating Current (ac) Power Overview |
| 29 | Frequency Voltage Power Phase Difference |
| 30 | Phase Configuration |
| 31 | Reactance (X) Inductive Reactance (XL) Capacitive Reactance (XC) |
| 32 | Power |
| 33 | Apparent Power Real Power |
| 34 | Short Circuit Current |
| 35 | Direct Current (dc) Power Overview |
| 36 | Electromagnetic Interference (EMI) Overview Ground Loops |
| 38 | Alternating Current (ac) Power |
| 39 | Unwanted Signal Coupling Mechanism Conduits, Cable Trays, and Raceways |
| 41 | Electrical Fast Transient (EFT) Transient Voltages and Currents |
| 42 | Other Bonding and Grounding (Earthing) Topics Impedance |
| 43 | Planning Assignment of Responsibilities Equipment Manufacturer’s Warranty |
| 44 | Alternative Nomenclature and Terminology |
| 46 | Codes, Standards, and Regulations Overview Design and Construction |
| 47 | Codes, Regulations, and Directives State Regulations |
| 48 | Standards |
| 49 | Bonding and Grounding (Earthing) Standards Other Standards and Resources |
| 51 | Chapter 2: Bonding and Grounding (Earthing) Systems and Components |
| 52 | Table of Contents |
| 54 | Figures Tables |
| 55 | Bonding and Grounding (Earthing) Systems and Components Introduction Alternating Current (ac) Grounding (Earthing) Electrode System Components |
| 56 | Considerations |
| 57 | Equipment Grounding (Earthing) System Components Telecommunications Bonding Infrastructure |
| 58 | Small Systems |
| 60 | Large Systems |
| 62 | Grounding Electrodes Overview |
| 63 | Considerations Grounding Electrode Connections Building Ground (Electrode) Ring |
| 64 | Requirements |
| 65 | Telecommunications and ICT Busbars Primary Bonding Busbar (PBB) |
| 66 | Considerations |
| 67 | Secondary Bonding Busbar (SBB) |
| 68 | Considerations |
| 69 | Bonding Conductors Named Conductors Telecommunications Bonding Conductor (TBC) Telecommunications Bonding Backbone (TBB) Backbone Bonding Conductor (BBC) |
| 70 | Telecommunications Equipment Bonding Conductor (TEBC) |
| 72 | Rack Bonding Conductor (RBC)/Equipment Bonding Conductor (EBC) Sizing of Bonding Conductors |
| 74 | Limitations of Bonding Conductor Calculation |
| 75 | Quick Determination of Bonding Conductor Size Installation Considerations |
| 76 | Bonding Connections Connection Methods Compression Mechanical Exothermic |
| 77 | General Considerations Bonding to the Primary Bonding Busbar (PBB) or the Secondary Bonding Busbar (SBB) |
| 78 | Bonding Equipment Cabinets and Racks |
| 79 | Connecting the Telecommunications Equipment Bonding Conductor (TEBC) Structural Bonding of Cabinets and Racks |
| 80 | Bonding Equipment to the Rack Bonding Conductor (RBC) or Rack Bonding Busbar (RBB) Cable Runways and Cable Trays Bonding |
| 81 | Supplementary Bonding Networks Overview Supplementary Bonding Grid (SBG) |
| 83 | Meshed Bonding Network (Mesh-BN) |
| 84 | Meshed Isolated Bonding Network (Mesh-IBN) Cabinet and Rack Bonding to Supplementary Bonding Networks |
| 87 | Chapter 3: Testing, Inspection, and Administration |
| 88 | Table of Contents |
| 89 | Figures Tables |
| 90 | Testing Bonding and Grounding (Earthing) Testing Procedures Recommended Testing Procedures and Criteria True Root Mean Square Alternating Current (ac) and Direct Current (dc) Measurements |
| 91 | Two-Point Bonding Measurements Equipment Grounding (Earthing) Conductor Impedance Measurement Integrity of Telecommunications Bonding Connections Testing |
| 92 | Soil Resistivity Earth Ground Resistance Earth Ground Resistance Values |
| 93 | Earth Ground Resistance Testing |
| 95 | Testing Considerations |
| 96 | Non-Approved Testing Methods Improving Grounding Electrode (Rod) Resistance Options to Reduce Earth Ground Resistance Alternating Current (ac) Grounding (Earthing) Electrode Testing |
| 97 | Inspection |
| 98 | Administration Overview Classes |
| 99 | Classes and Associated Identifiers Administration System Elements |
| 102 | Labeling Methods |
| 103 | Records |
| 104 | Required Records Numbering Schemes |
| 105 | Telecommunications Spaces Identification |
| 107 | Bonding and Grounding System Identification Components |
| 110 | Chapter 4: Entrance Facilities and Protection |
| 111 | Table of Contents |
| 112 | Figures Tables |
| 113 | Cabling Exposure Introduction Ground Potential Rise (GPR) |
| 115 | Lightning Exposure |
| 116 | Entrance Facilities (EFs) Overview |
| 118 | Surge Protection Devices (SPDs) Primary Protectors |
| 119 | Secondary Protectors |
| 120 | Data and Fire Alarm Protectors |
| 121 | Lightning Protection Overview Codes and Standards NFPA 780, Standard for the Installation of Lightning ProtectionSystems |
| 122 | Zone of Protection |
| 123 | Extended Zone of Protection Lightning Protection System Considerations |
| 124 | Chapter 5: Outside Plant (OSP) Bonding and Grounding (Earthing) |
| 125 | Table of Contents |
| 127 | Figures |
| 128 | Outside Plant (OSP) Bonding and Grounding (Earthing) Introduction General Considerations |
| 129 | Outside Plant (OSP) Pathways Bonding Telecommunications and Power Grounds Underground Pathway Bonding Maintenance Hole (MH) Bonding and Grounding (Earthing) |
| 133 | Direct-Buried Cable Bonding Direct-Buried Plant Exposed to Power |
| 134 | Joint Random Direct-Buried Plant Aerial Cable Bonding Maintaining Electrical Continuity of Shields Metallic Conductors |
| 135 | Bonding Support Strands/Messengers to Ground Bonding Cable Shields to Support Strands/Messengers |
| 136 | Bonding at Power Crossings |
| 137 | Bonding in Joint Use or Joint Occupancy |
| 138 | Underground/Direct-Buried Cable Dips in Aerial Cable Runs Aerial Inserts |
| 139 | Aerial to Underground Transitions |
| 140 | Towers and Antennas Site Grounding Systems Type 1 Sites Type 2 Sites |
| 142 | Tower Grounding |
| 143 | Tower Ground Ring Guyed Metallic Towers |
| 144 | Self-Supporting Metallic Towers Monopoles |
| 145 | Wooden Structures Rooftop Grounding |
| 147 | Antenna Transmission Line Grounding |
| 148 | Radio Equipment Buildings |
| 149 | Other Outside Plant (OSP) Structures Telecommunication Shelters/Outdoor Cabinets Fence Grounding |
| 150 | Generators Satellite Dishes |
| 151 | Tunnels Spacing Between Bonding Points |
| 152 | Electromagnetic Interference (EMI) Mutual Impedance |
| 153 | Power Distribution Multiground Neutral (MGN) Systems |
| 154 | Non-multiground Neutral (MGN) Power Systems |
| 155 | Electrified Transport Systems |
| 156 | Guidelines |
| 157 | Glossary A B |
| 158 | C D |
| 159 | E |
| 160 | F G |
| 161 | I L M |
| 162 | N O P R |
| 163 | S |
| 164 | T |
| 165 | U V W Z |
| 167 | Bibliography |
