BS EN 16602-60:2023 – TC
$280.87
Tracked Changes. Space product assurance. Electrical, electronic and electromechanical (EEE) components
Published By | Publication Date | Number of Pages |
BSI | 2023 | 200 |
PDF Catalog
PDF Pages | PDF Title |
---|---|
1 | 30477636 |
95 | A-30441672 |
96 | undefined |
105 | 1 Scope |
106 | 2 Normative references |
108 | 3 Terms, definitions and abbreviated terms 3.1 Terms from other standards 3.2 Terms specific to the present standard |
109 | 3.3 Abbreviated terms |
111 | 3.4 Conventions |
112 | 3.5 Nomenclature |
113 | 4 Requirements for Class 1 components 4.1 Component programme management 4.1.1 General 4.1.2 Components control programme 4.1.2.1 Organization 4.1.2.2 Component control plan 4.1.3 Parts control board |
114 | 4.1.4 Declared components list |
115 | 4.1.5 Electrical and mechanical GSE 4.1.6 EQM components |
116 | 4.2 Component selection, evaluation and approval 4.2.1 General 4.2.2 Manufacturer and component selection 4.2.2.1 General rules 4.2.2.2 Parts and material restriction |
119 | 4.2.2.3 Preferred sources 4.2.2.4 Radiation hardness |
120 | 4.2.2.5 Derating 4.2.3 Component evaluation 4.2.3.1 General |
121 | 4.2.3.2 Component manufacturer assessment 4.2.3.3 Constructional analysis |
122 | 4.2.3.4 Evaluation testing 4.2.4 Parts approval |
123 | 4.3 Component procurement 4.3.1 General 4.3.2 Procurement specification |
124 | 4.3.3 Screening requirements 4.3.4 Initial customer source inspection (precap) |
125 | 4.3.5 Lot acceptance |
126 | 4.3.6 Final customer source inspection (buy-off) 4.3.7 Incoming inspections |
127 | 4.3.8 Radiation verification testing 4.3.9 Destructive physical analysis |
128 | 4.3.10 Relifing 4.3.11 Manufacturer’s data documentation deliveries |
129 | 4.4 Handling and storage 4.5 Component quality assurance 4.5.1 General 4.5.2 Nonconformances or failures |
130 | 4.5.3 Alerts 4.5.4 Traceability |
131 | 4.5.5 Lot homogeneity for sampling test 4.6 Specific components 4.6.1 General 4.6.2 ASICs 4.6.3 Hybrids 4.6.4 One time programmable devices |
132 | 4.6.5 Microwave monolithic integrated circuits 4.6.6 Connectors 4.7 Documentation |
134 | 5 Requirements for Class 2 components 5.1 Component programme management 5.1.1 General 5.1.2 Components control programme 5.1.2.1 Organization 5.1.2.2 Component control plan 5.1.3 Parts Control Board |
135 | 5.1.4 Declared Components List |
136 | 5.1.5 Electrical and mechanical GSE 5.1.6 EQM components 5.2 Component selection, evaluation and approval 5.2.1 General |
137 | 5.2.2 Manufacturer and component selection 5.2.2.1 General rules 5.2.2.2 Parts and material restriction |
139 | 5.2.2.3 Radiation hardness |
140 | 5.2.2.4 Derating 5.2.2.5 Preferred sources 5.2.3 Component evaluation 5.2.3.1 General |
141 | 5.2.3.2 Component manufacturer assessment 5.2.3.3 Constructional analysis 5.2.3.4 Evaluation testing |
142 | 5.2.4 Parts approval 5.3 Component procurement 5.3.1 General |
143 | 5.3.2 Procurement specification 5.3.3 Screening requirements |
144 | 5.3.4 Initial Customer Source Inspection (precap) 5.3.5 Lot acceptance |
145 | 5.3.6 Final customer source inspection (buy-off) 5.3.7 Incoming inspections |
146 | 5.3.8 Radiation verification testing 5.3.9 Destructive physical analysis |
147 | 5.3.10 Relifing 5.3.11 Manufacturer’s data documentation deliveries |
148 | 5.4 Handling and storage 5.5 Component quality assurance 5.5.1 General 5.5.2 Nonconformances or failures |
149 | 5.5.3 Alerts 5.5.4 Traceability 5.5.5 Lot homogeneity for sampling test 5.6 Specific components 5.6.1 General 5.6.2 ASICs |
150 | 5.6.3 Hybrids 5.6.4 One time programmable devices |
151 | 5.6.5 Microwave monolithic integrated circuits 5.6.6 Connectors 5.7 Documentation |
153 | 6 Requirements for Class 3 components 6.1 Component programme management 6.1.1 General 6.1.2 Components control programme 6.1.2.1 Organization 6.1.2.2 Component control plan 6.1.3 Parts control board 6.1.4 Declared components list |
154 | 6.1.5 Electrical and mechanical GSE 6.1.6 EQM components 6.2 Component selection, evaluation and approval 6.2.1 General |
155 | 6.2.2 Manufacturer and component selection 6.2.2.1 General rules 6.2.2.2 Parts and material restriction |
157 | 6.2.2.3 Preferred sources 6.2.2.4 Radiation hardness |
158 | 6.2.2.5 Derating 6.2.3 Component evaluation 6.2.3.1 General |
159 | 6.2.3.2 Component manufacturer assessment 6.2.3.3 Constructional analysis 6.2.3.4 Evaluation testing |
160 | 6.2.4 Parts approval |
161 | 6.3 Component procurement 6.3.1 General 6.3.2 Procurement specification 6.3.3 Screening requirements |
162 | 6.3.4 Initial customer source inspection (precap) 6.3.5 Lot acceptance 6.3.6 Final customer source inspection (buy-off) |
163 | 6.3.7 Incoming inspections 6.3.8 Radiation verification testing 6.3.9 Destructive physical analysis |
164 | 6.3.10 Relifing |
165 | 6.3.11 Manufacturer’s data documentation deliveries 6.4 Handling and storage 6.5 Component quality assurance 6.5.1 General |
166 | 6.5.2 Nonconformances or failures 6.5.3 Alerts 6.5.4 Traceability |
167 | 6.5.5 Lot homogeneity for sampling test 6.6 Specific components 6.6.1 Overview 6.6.2 ASICs 6.6.3 Hybrids 6.6.4 One time programmable devices |
168 | 6.6.5 Microwave monolithic integrated circuits 6.6.6 Connectors 6.7 Documentation |
170 | 7 Quality levels |
184 | 8 Evaluation and lot acceptance for retinned parts |
185 | 9 Pure tin lead finish – risk analysis 9.1 Overview 9.2 Requirements |