BS EN 16602-70-11:2015
$189.07
Space product assurance. Procurement of printed circuit boards
Published By | Publication Date | Number of Pages |
BSI | 2015 | 50 |
This Standard defines the requirements imposed on the customer, the supplier and the qualified PCB manufacturer for PCB procurement. The requirements of clause 7 apply to both qualification and procurement of finished PCBs and do not include the manufacturing tolerances. This Standard is applicable for the following type of boards: – Rigid PCBs (single-sided, double-sided, multilayer, sequential multilayer and PCBs with metal core) – Flexible PCBs (single-sided and double-sided) – Rigid-flex PCBs (multilayer and sequential multilayer) – High frequency PCBs – Special PCBs. PCBs are used for the mounting of components in order to produce PCB assemblies performing complex electrical functions. The PCBs are subjected to thermo-mechanical stresses during their assembly such as mounting of components by soldering, rework and repair under normal terrestrial conditions. In addition the assembled PCB is subjected to the environment imposed by launch and space flights. Therefore the qualification of a PCB supplier to ECSS-Q-ST-70-10 is of extreme importance before the procurement of PCB for space usage. This standard may be tailored for the specific characteristics and constraints of a space project in conformance with ECSS-S-ST-00.
PDF Catalog
PDF Pages | PDF Title |
---|---|
7 | 1 Scope |
8 | 2 Normative references |
9 | 3 Terms, definitions and abbreviated terms 3.1 Terms from other standards 3.2 Terms specific to the present standard |
12 | 3.3 Abbreviated terms |
13 | 4 Principles |
14 | 5 Requirements 5.1 Procurement of PCBs 5.1.1 General 5.1.2 Design and layout |
15 | 5.2 Base materials 5.2.1 Base laminate materials |
16 | 5.2.2 Basic metallic layer 5.2.3 Plated metallic layers and finishes 5.2.3.1 Copper (electrolytic) 5.2.3.2 Electroplated tin�lead thickness over copper |
17 | 5.2.3.3 Nickel electrolytic plating (optional) over copper plating 5.2.3.4 Gold (electrolytic) 5.2.4 Special materials 5.2.4.1 Metal core 5.2.4.2 Heat�sinks: material and surface treatment |
18 | 5.3 PCB delivery 5.3.1 Marking 5.3.2 Associated test coupons |
19 | 5.3.3 Outgoing inspection and PCB manufacturer data package 5.4 Packaging 5.4.1 Handling and storage 5.4.2 Packaging |
20 | 5.5 Supplier acceptance of PCBs 5.5.1 Supplier acceptance inspection 5.5.2 Electrical test |
21 | 6 Inspection of PCBs 6.1 General 6.2 Visual inspection and non�destructive test 6.2.1 Verification of marking 6.2.2 Visual aspects |
24 | 6.2.3 External dimensions |
25 | 6.2.4 Warp 6.2.5 Twist |
26 | 6.3 Microsection inspection criteria 6.3.1 General |
27 | 6.3.2 Thickness of metal�plating |
29 | 6.3.3 Aspect of plated�through holes |
32 | 7 Requirements for PCBs 7.1 Rigid single�sided and double�sided PCBs |
34 | 7.2 Rigid single�sided and double�sided PCBs for high frequency application |
37 | 7.3 Flexible PCBs |
38 | 7.4 Rigid�flex PCBs |
39 | 7.5 Rigid multilayer PCBs |
41 | 7.6 Sequential rigid multilayer PCBs |