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BS EN 16602-70-11:2015

$189.07

Space product assurance. Procurement of printed circuit boards

Published By Publication Date Number of Pages
BSI 2015 50
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This Standard defines the requirements imposed on the customer, the supplier and the qualified PCB manufacturer for PCB procurement. The requirements of clause 7 apply to both qualification and procurement of finished PCBs and do not include the manufacturing tolerances. This Standard is applicable for the following type of boards: – Rigid PCBs (single-sided, double-sided, multilayer, sequential multilayer and PCBs with metal core) – Flexible PCBs (single-sided and double-sided) – Rigid-flex PCBs (multilayer and sequential multilayer) – High frequency PCBs – Special PCBs. PCBs are used for the mounting of components in order to produce PCB assemblies performing complex electrical functions. The PCBs are subjected to thermo-mechanical stresses during their assembly such as mounting of components by soldering, rework and repair under normal terrestrial conditions. In addition the assembled PCB is subjected to the environment imposed by launch and space flights. Therefore the qualification of a PCB supplier to ECSS-Q-ST-70-10 is of extreme importance before the procurement of PCB for space usage. This standard may be tailored for the specific characteristics and constraints of a space project in conformance with ECSS-S-ST-00.

PDF Catalog

PDF Pages PDF Title
7 1 Scope
8 2 Normative references
9 3 Terms, definitions and abbreviated terms
3.1 Terms from other standards
3.2 Terms specific to the present standard
12 3.3 Abbreviated terms
13 4 Principles
14 5 Requirements
5.1 Procurement of PCBs
5.1.1 General
5.1.2 Design and layout
15 5.2 Base materials
5.2.1 Base laminate materials
16 5.2.2 Basic metallic layer
5.2.3 Plated metallic layers and finishes
5.2.3.1 Copper (electrolytic)
5.2.3.2 Electroplated tin�lead thickness over copper
17 5.2.3.3 Nickel electrolytic plating (optional) over copper plating
5.2.3.4 Gold (electrolytic)
5.2.4 Special materials
5.2.4.1 Metal core
5.2.4.2 Heat�sinks: material and surface treatment
18 5.3 PCB delivery
5.3.1 Marking
5.3.2 Associated test coupons
19 5.3.3 Outgoing inspection and PCB manufacturer data package
5.4 Packaging
5.4.1 Handling and storage
5.4.2 Packaging
20 5.5 Supplier acceptance of PCBs
5.5.1 Supplier acceptance inspection
5.5.2 Electrical test
21 6 Inspection of PCBs
6.1 General
6.2 Visual inspection and non�destructive test
6.2.1 Verification of marking
6.2.2 Visual aspects
24 6.2.3 External dimensions
25 6.2.4 Warp
6.2.5 Twist
26 6.3 Microsection inspection criteria
6.3.1 General
27 6.3.2 Thickness of metal�plating
29 6.3.3 Aspect of plated�through holes
32 7 Requirements for PCBs
7.1 Rigid single�sided and double�sided PCBs
34 7.2 Rigid single�sided and double�sided PCBs for high frequency application
37 7.3 Flexible PCBs
38 7.4 Rigid�flex PCBs
39 7.5 Rigid multilayer PCBs
41 7.6 Sequential rigid multilayer PCBs
BS EN 16602-70-11:2015
$189.07