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BS EN 16602-70-12:2016

BS EN 16602-70-12:2016

$215.11

Space product assurance. Design rules for printed circuit boards

Published By Publication Date Number of Pages
BSI 2016 176
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This European Standard specifies the requirements for the supplier and PCB manufacturer for PCB design.

This European Standard is applicable for all types of PCBs, including sequential, rigid and flexible PCBs, HDI and RF PCBs.

This European Standard can be made applicable for other products combining mechanical and electrical functionality using additive or reductive manufacturing processes, as used in PCB manufacturing. Examples of such products are slip rings and bus bars.

This European Standard may be tailored for the specific characteristics and constraints of a space project in conformance with ECSS-S-ST-00.

PDF Catalog

PDF Pages PDF Title
16 1 Scope
17 2 Normative references
18 3 Terms, definitions and abbreviated terms
3.1 Terms from other standards
3.2 Terms specific to the present standard
26 3.3 Abbreviated terms
28 4 Principles
4.1 Qualified PCBs
4.2 Manufacturing tolerances
4.3 Reliability of design
30 5 Design review and MRR
5.1 Overview
5.2 Documentation
32 6 General design and production requirements
6.1 Reliability of design
6.2 Choice of materials and build-up
6.2.1 Overview
35 6.2.2 Material selection
6.3 Selection of the PCB manufacturer
6.4 Traceability and marking
36 7 Rigid PCBs
7.1 PCB build-up
7.1.1 General
7.1.2 Copper styles
38 7.1.3 Dielectric thickness
41 7.2 PCB dimension
7.3 Thickness of PCB
7.3.1 General
42 7.3.2 Polyimide PCB
7.3.3 Epoxy PCB
7.3.4 Number of copper layers in PCB
7.3.5 Aspect ratio of vias
43 7.4 Track width and spacing
7.4.1 General
7.4.2 Manufacturing tolerances for width and spacing
44 7.4.3 External layers
45 7.4.4 Normal pitch tracks on internal layers
46 7.4.5 Fine pitch tracks on internal layers
47 7.4.6 Routing to AAD footprint on internal layers
48 7.5 Pad design
7.5.1 Non-functional pad removal
7.5.2 Pad dimensions
50 7.5.3 Non-circular external pads
51 7.6 Copper planes in rigid PCB
52 7.7 Design considerations for the prevention of sliver and peelable
7.8 PCB surface finish
7.8.1 Metallization
53 7.8.2 Solder mask
7.8.2.1 Overview
7.8.2.2 Use of solder mask
54 8 Flex PCBs
8.1 Overview
8.2 Dynamic applications
8.3 PCB build-up
8.3.1 General
8.3.2 Dielectric materials
55 8.3.3 Copper cladding
8.3.4 Copper planes in flex PCB
56 8.4 Track design
57 8.5 Through holes
8.5.1 Annular ring
58 8.5.2 Vias and pads
8.5.3 Tear drop pad for flex PCB
59 8.6 Bending radius
8.6.1 Overview
8.6.2 General
60 8.7 Sculptured flex PCB
8.7.1 Overview
8.7.2 General
8.7.3 Copper foil dimensions for build-up
61 8.7.4 Connection finger
62 8.7.5 Through-holes
63 8.7.6 Bending radius
64 9 Rigid-flex PCBs
9.1 Overview
9.2 General
65 9.3 Build-up
66 9.4 Cover layer
9.5 Interface of rigid part and flexible part
9.6 Pads
67 10 Thermal rules and heat sinks
10.1 Overview
10.2 General requirements
10.3 Specific requirements for external heat sink
10.3.1 Overview
10.3.2 Construction of the interface between PCB and heat sink
68 10.3.3 Dimensional requirements
70 10.4 Specific requirements for internal heat sink
10.4.1 General
10.4.2 Cu thickness and type
71 10.4.3 CIC and Molybdenum inserts
10.4.4 Dimensional requirements
73 11 HDI PCBs
11.1 Overview
11.2 Justification
11.3 Microvia technology
74 11.4 Microvias
11.4.1 Build-up of microvia layers
76 11.4.2 Design of microvias
11.4.3 Pad design for microvia
77 11.4.4 Annular ring for microvias
11.5 Core PCB for HDI
11.5.1 General build-up
78 11.5.2 Annular ring on vias for fine pitch footprint
79 11.5.3 Track width and spacing on external layers
11.5.4 Track width and spacing on internal layers for impedance control and routing to AAD
80 11.5.5 Track width and spacing on internal layers for differential pair routing within the footprint of 1,0 mm pitch AAD
81 11.5.6 Aspect ratio of vias for footprint of AAD with 1 mm pitch
83 12 PCBs for high frequency applications
12.1 Material selection
12.2 Build-up of RF PCB
12.3 Embedded film resistors
85 12.4 Thickness of RF PCB
12.5 Track width and spacing
12.5.1 External layers
86 12.5.2 Internal Layers
12.6 Pad design
12.6.1 Pad dimensions
12.6.2 Non-functional pads
12.7 Surface finish
12.8 Profiled layers and vias
88 13 Electrical requirements for PCB design
13.1 Overview
89 13.2 General
13.3 PCB drying
13.4 Electrical characteristics
90 13.5 Floating metal
13.6 Current rating
13.6.1 Overview
91 13.6.2 Requirements for temperature increment
13.6.3 Requirements for the model IPC-2152 for current rating
92 13.6.4 Amendments to the model from IPC-2152
13.6.4.1 Overview
93 13.6.4.2 List of amendments
13.7 Provisions to prevent open circuit failure on critical tracks
13.7.1 Overview
94 13.7.2 Routing
13.8 Voltage rating
13.8.1 Overview
13.8.2 General requirements
96 13.8.3 Spacing on flex and rigid-flex laminate
97 13.8.4 Conformal coating
98 13.9 Double insulation design rules for critical tracks
13.9.1 Overview
13.9.2 Critical nets
13.9.3 Prevention of short circuit
13.9.3.1 Increase insulation in the PCB
100 13.9.3.2 Increase insulation of PCB assembly
101 13.9.3.3 Routing
103 13.10 Insulation distance of combined requirements on rigid PCB
108 13.11 Controlled impedance tracks
13.11.1 Definitions specific to controlled impedance
13.11.2 General rules
13.11.3 Microstrip and stripline
109 13.11.4 Line impedance termination for end-to-end configuration
13.11.5 Line impedance termination for multidrop configuration
110 13.12 Digital PCB
13.12.1 Overview
13.12.2 Zone management and routing
111 13.12.3 Criticality of digital signals
13.12.3.1 Non-critical signals
13.12.3.2 Critical signals
112 13.12.3.3 Highly critical signals
13.13 Analog PCB
13.13.1 Overview
13.13.2 Criticality of analog signals
13.13.2.1 Non-critical signals
113 13.13.2.2 Critical signals
13.13.2.3 Highly critical signals
13.13.3 Routing and shielding
114 13.14 Mixed analog-digital PCB
115 14 Design for assembly
14.1 Overview
14.2 General
116 14.3 Placement requirements
14.3.1 Conductive patterns
117 14.3.2 Components
119 14.3.3 Component pads
120 14.3.4 Fan out of SMT pads
122 14.3.5 Fan out of PTH
123 14.4 Specific requirements for fused tin-lead finish
14.5 Dimensional requirements for SMT foot print
14.5.1 Overview
124 14.5.2 General
125 14.5.3 Bipolar components
126 14.5.4 SOIC components
127 14.5.5 J-leaded components
128 14.5.6 LCC components
130 14.5.7 Flat pack components
131 14.5.8 AAD components
132 15 Design of test coupon
15.1 Design rules for test coupon
15.2 Test coupon design

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BS EN 16602-70-12:2016
$215.11