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BS EN 16603-20-08:2023

BS EN 16603-20-08:2023

$215.11

Space engineering. Photovoltaic assemblies and components

Published By Publication Date Number of Pages
BSI 2023 234
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PDF Catalog

PDF Pages PDF Title
2 undefined
16 1 Scope
17 2 Normative references
19 3 Terms, definitions and abbreviated terms
3.1 Terms from other standards
3.2 Terms specific to the present standard
24 3.3 Abbreviated terms
27 3.4 Nomenclature
28 4 General
4.1 Overview
4.1.1 Objective and organization
30 4.1.2 Interfaces with other areas
31 4.2 Physical properties
4.3 Test and storage
4.3.1 Test environment
32 4.3.2 Test tolerances and accuracies
33 4.3.3 <>
4.4 Critical materials
34 5 Photovoltaic assemblies
5.1 Overview
5.1.1 Description
5.1.2 Purpose and objective
35 5.2 Conditions and method of test
36 5.3 Photovoltaic assembly design
5.3.1 Overview
5.3.2 Parameters related to parts, materials and processes (PMP)
5.3.2.1 Outgassing
5.3.2.2 Toxicity
37 5.3.2.3 Flammability
5.3.2.4 Corrosion
5.3.2.5 Magnetism
5.3.2.6 Erosion
5.3.2.7 Atomic oxygen (ATOX)
5.3.3 Parameters related to design
5.3.3.1 Cell integration
38 5.3.3.2 Stringing
5.3.3.3 Cell interspacing
5.3.3.4 Sectioning
5.3.3.5 Reverse bias protection
39 5.3.3.6 Insulation
5.3.3.7 Derating
5.3.3.8 Redundancy
5.3.3.9 Fault tolerance
40 5.3.3.10 Fatigue resistance
5.3.3.11 Adherence to substrate
5.3.3.12 Adhesive uniformity
5.3.3.13 Electrostatic discharge (ESD)
5.3.3.14 Electromagnetic compatibility (EMC)
41 5.3.3.15 Repairability
5.4 PVA manufacturing
5.4.1 Process validation
5.4.2 Defect acceptability
5.4.3 In-process testing
5.4.3.1 Overview
5.4.3.2 Mass measurement
5.4.3.3 Wet insulation test
42 5.4.3.4 Adherence to substrate
5.4.3.5 Visual inspection
5.4.3.6 Continuity check
43 5.4.4 Identification and traceability
5.4.5 Recording
5.5 PVA tests
5.5.1 Qualification tests
5.5.1.1 Purpose
5.5.1.2 Process
45 5.5.1.3 Fatigue thermal cycling test
47 5.5.1.4 Humidity
48 5.5.1.5 Electrostatic discharge (ESD) test
51 5.5.1.6 Erosion of materials
5.5.1.7 EMC
52 5.5.2 Acceptance tests for qualification coupons
5.5.2.1 Purpose
5.5.2.2 Applicability
5.5.2.3 Deliverables
5.5.2.4 Process
53 5.5.3 Definition of tests and checks
5.5.3.1 Add-on mass measurement
5.5.3.2 Full visual inspection
58 5.5.3.3 Electrical health check
60 5.5.3.4 Electrical performance measurement
61 5.5.3.5 Capacitance test
5.5.3.6 Bake-out
5.5.3.7 Thermal cycling acceptance test
62 5.5.3.8 Reflectance
63 5.5.3.9 X-Ray
5.5.3.10 Substrate integrity
5.5.3.11 Vacuum thermal cycling
64 5.6 Failure definition
5.6.1 Failure criteria
65 5.6.2 Failed qualification coupons
5.7 Data documentation
5.8 Delivery
5.9 Packaging, packing, handling and storage
66 6 Solar cell assemblies
6.1 General
6.1.1 Testing
6.1.2 Conditions and methods of test
6.1.3 Deliverable components
6.1.4 Identification and traceability
67 6.2 Production control (process identification document)
6.3 Acceptance tests
6.3.1 General
6.3.2 Test methods and conditions
68 6.3.3 Electrical performance acceptance test (EPA)
6.3.3.1 Purpose
6.3.3.2 Process
6.3.3.3 Pass-fail criteria
6.4 Qualification tests
6.4.1 General
70 6.4.2 Qualification
6.4.2.1 Production and test schedule
6.4.2.2 Qualification test samples
71 6.4.2.3 Qualification testing
6.4.3 Test methods, conditions and measurements
6.4.3.1 Full visual inspection including ELM (VI)
74 6.4.3.2 Dimensions and weight (DW)
6.4.3.3 Electrical performance (EP)
75 6.4.3.4 Temperature coefficients (TC)
76 6.4.3.5 Spectral response (SR)
6.4.3.6 Thermo-optical data (TO)
77 6.4.3.7 Thermal cycling (CY)
6.4.3.8 Humidity and temperature (HT1)
79 6.4.3.9 Coating adherence (CA)
6.4.3.10 Interconnector adherence (IA)
6.4.3.11 Electron irradiation (EI)
80 6.4.3.12 Photon irradiation and temperature annealing (PH)
81 6.4.3.13 Surface conductivity (SC)
6.4.3.14 Solar Cell Reverse Bias Test (RB)
6.4.3.15 Ultraviolet exposure test (UV)
83 6.4.3.16 Capacitance test (CT)
84 6.4.3.17 Flatness test (FT)
6.4.3.18 Long Duration – Life test (LT)
85 6.4.3.19 Angular Measurement (AM)
87 6.5 Failure definition
6.5.1 Failure criteria
6.5.2 Failed SCAs
6.6 Data documentation
6.7 Delivery
88 6.8 Packing, dispatching, handling and storage
6.8.1 Overview
6.8.2 ESD Sensitivity
89 7 Bare solar cells
7.1 Testing, deliverable components and marking
7.1.1 Testing
7.1.1.1 Tests for qualification and procurement
7.1.1.2 Conditions and methods of tests
7.1.1.3 Responsibility of supplier for the performance of tests and inspections
90 7.1.1.4 Preliminary characterization
7.1.2 Deliverable components
7.1.3 Marking
7.2 Production control (process identification document)
91 7.3 Acceptance tests
7.3.1 General
7.3.2 Test methods and conditions
7.3.2.1 Test other than electrical performance
92 7.3.2.2 Electrical performance
7.3.3 Documentation
7.4 Qualification tests
7.4.1 General
94 7.4.2 Qualification
7.4.2.1 Production and test schedule
7.4.2.2 Qualification test samples
95 7.4.2.3 Qualification testing
7.5 Test methods, conditions and measurements
7.5.1 Visual inspection including ELM (VI)
7.5.1.1 Applicability
7.5.1.2 Test process
7.5.1.3 Deviations
96 7.5.1.4 Solar cell defects
97 7.5.1.5 Solar cell contact area defects
7.5.2 Dimensions and weight (DW)
98 7.5.3 Electrical performance (EP)
7.5.3.1 Purpose
7.5.3.2 Process
7.5.4 Temperature coefficients (TC)
99 7.5.5 Spectral response (SR)
7.5.5.1 Purpose
7.5.5.2 Process
100 7.5.6 Optical properties (OP)
7.5.6.1 Overview
7.5.6.2 Hemispherical reflectance (HR)
7.5.6.3 Coverglass gain-loss (GL)
7.5.6.4 Solar absorptance (as)
7.5.7 Humidity and temperature (HT)
7.5.7.1 HT1 for qualification testing (subgroup O)
101 7.5.7.2 HT2 for qualification (subgroup A) and acceptance testing
102 7.5.8 Coating adherence (CA)
7.5.8.1 Purpose
7.5.8.2 Process
7.5.9 Contact uniformity (CU)
7.5.9.1 Purpose
7.5.9.2 Process
7.5.9.3 Pass fail criteria
103 7.5.10 Contact thickness (CT)
7.5.10.1 Purpose
7.5.10.2 Process
7.5.10.3 Pass fail criteria
7.5.11 Surface finish (SF)
7.5.11.1 Purpose
7.5.11.2 Process
7.5.11.3 Pass fail criteria
7.5.12 Pull test (PT)
7.5.12.1 Purpose
7.5.12.2 Process
104 7.5.13 Electron irradiation (EI)
7.5.13.1 Purpose
7.5.13.2 Process
105 7.5.14 Proton irradiation (PI)
7.5.14.1 Purpose
7.5.14.2 Process
107 7.5.15 Photon irradiation and temperature annealing (PH)
7.5.15.1 Purpose
7.5.15.2 Process
7.5.16 Solar cell reverse bias test (RB)
7.5.16.1 Purpose
7.5.16.2 Process
108 7.5.16.3 Pass-fail criteria
7.5.17 Thermal cycling (CY)
7.5.17.1 Purpose
7.5.17.2 Process
7.5.18 Active-passive interface evaluation test (IF)
7.5.18.1 Purpose
7.5.18.2 Process
7.5.19 Flatness test (FT)
7.5.19.1 Purpose
109 7.5.19.2 Process
7.5.19.3 Pass/fail criteria.
7.6 Failure definition
7.6.1 Failure criteria
7.6.2 Failed components
7.7 Data documentation
110 7.8 Delivery
7.9 Packing, dispatching, handling and storage
7.9.1 Overview
7.9.2 ESD Sensitivity
111 8 Coverglasses
8.1 Overview
8.1.1 Purpose
8.1.2 Description
8.2 Interfaces
8.3 Testing, deliverable components and marking
8.3.1 Testing
8.3.1.1 Tests for qualification and procurement
112 8.3.1.2 Conditions and methods of tests
8.3.1.3 Responsibility of supplier for the performance of tests and inspections
8.3.2 Deliverable components
8.3.3 Marking (coating orientation)
113 8.4 Production control (Process identification document)
8.5 Acceptance test
8.5.1 Acceptance test samples
8.5.2 Acceptance test sequence
114 8.5.3 Test methods and conditions
8.5.4 Documentation
8.6 Qualification tests
8.6.1 General
115 8.6.2 Qualification
8.6.2.1 Production and test schedule
8.6.2.2 Qualification test samples
8.6.2.3 Qualification testing
117 8.7 Test methods, conditions and measurements
8.7.1 Visual inspection (VI)
8.7.1.1 General
8.7.1.2 Deviations
8.7.1.3 Defects
118 8.7.2 Transmission into air (TA)
119 8.7.3 Electro-optical properties (EO)
8.7.3.1 Bulk and surface resistivity
8.7.3.2 Refractive index
8.7.4 Mechanical properties (MP)
8.7.4.1 Dimension and weight
120 8.7.4.2 Density
8.7.4.3 Thickness
8.7.4.4 Edge parallelism
8.7.4.5 Perpendicularity of sides
8.7.5 Reflectance properties (OP)
8.7.5.1 Reflectance
8.7.5.2 Reflectance cut-on
121 8.7.5.3 Reflectance cut-off
8.7.5.4 Reflectance bandwidth
8.7.6 Normal emittance (NE)
8.7.7 Surface resistivity (SC)
122 8.7.8 Flatness or bow (FT)
8.7.9 Transmission into adhesive (TH)
123 8.7.10 Boiling water test (BW)
8.7.11 Humidity and temperature
8.7.11.1 HT3 for qualification testing (subgroup O)
8.7.11.2 HT4 for acceptance testing
124 8.7.12 UV exposure (UV)
8.7.12.1 Purpose
8.7.12.2 Process
8.7.13 Electron irradiation (EI)
8.7.13.1 Purpose
8.7.13.2 Process
125 8.7.14 Proton irradiation (PI)
8.7.14.1 Purpose
8.7.14.2 Process
8.7.15 Breaking strength (BS)
8.7.16 Thermal cycling (CY)
126 8.7.17 Abrasion resistance (coated surface) (AE)
8.7.18 Coating adhesion (TD)
8.8 Failure definition
8.8.1 Failure criteria
8.8.2 Failed components
127 8.9 Data documentation
8.10 Delivery
8.11 Packing, dispatching, handling and storage
128 9 Solar cell protection diodes
9.1 Overview
9.2 Testing, deliverable components and marking
9.2.1 Testing
9.2.1.1 Tests for qualification and procurement
129 9.2.1.2 Conditions and methods of tests
9.2.1.3 Responsibility of supplier for the performance of tests and inspections
9.2.2 Deliverable components
9.2.2.1 Integral protection diodes
130 9.2.2.2 External protection diodes
9.2.3 Marking
9.3 Production control (process identification document)
9.3.1 Integral protection diodes
9.3.2 External protection diodes
9.4 Acceptance tests
9.4.1 General
131 9.4.2 Integral protection diodes
9.4.3 External protection diodes
9.4.4 External and integral diodes
132 9.4.5 Test methods and conditions
9.4.5.1 Production and test schedule
9.4.5.2 Diode characterization for acceptance (DCA)
9.4.6 Documentation
133 9.5 Qualification tests
9.5.1 General
9.5.2 Integral protection diodes
134 9.5.3 External protection diodes
136 9.5.4 Integral and external protection diodes
9.5.4.1 Production and test schedule
9.5.4.2 Qualification test samples
137 9.5.4.3 Qualification testing
9.6 Test methods, conditions and measurements
9.6.1 General
9.6.2 Visual inspection (VI)
9.6.2.1 Applicability
9.6.2.2 Test process
138 9.6.2.3 Deviations
9.6.2.4 Protection diode defects
9.6.2.5 External protection diode contact area defects
9.6.3 Dimensions and weight (DW)
139 9.6.4 Thermal cycling (CY)
9.6.4.1 Purpose
9.6.4.2 Process
9.6.5 Burn in (BI)
9.6.5.1 Purpose
9.6.5.2 Process
140 9.6.6 Humidity and temperature
9.6.6.1 HT1 for qualification testing (subgroup O)
9.6.6.2 HT2 for acceptance testing
141 9.6.7 Contact uniformity (CU)
9.6.7.1 Purpose
9.6.7.2 Process
9.6.7.3 Pass Fail Criteria
9.6.8 Contact thickness (CT)
9.6.8.1 Purpose
9.6.8.2 Process
9.6.8.3 Pass Fail Criteria
9.6.9 Surface Finish (SF)
9.6.9.1 Purpose
142 9.6.9.2 Process
9.6.9.3 Pass Fail Criteria
9.6.10 Contact adherence (CA)
9.6.10.1 Purpose
9.6.10.2 Process
143 9.6.11 Pull test (PT)
9.6.11.1 Purpose
9.6.11.2 Process
144 9.6.12 Electron irradiation (EI)
9.6.12.1 Purpose
9.6.12.2 Process
9.6.13 Temperature annealing (TA)
9.6.13.1 Purpose
145 9.6.13.2 Process
9.6.14 Temperature behaviour (TB)
9.6.14.1 Purpose
9.6.14.2 Process
9.6.15 Diode characterization (DC)
9.6.15.1 Purpose
9.6.15.2 Process
146 9.6.15.3 Pass-fail criteria
9.6.16 Human body ESD (DE)
9.6.16.1 Purpose
147 9.6.16.2 Process
9.6.16.3 Pass-fail criteria
9.6.17 Switching test (DS)
9.6.17.1 Purpose
9.6.17.2 Process
149 9.6.17.3 Pass-fail criteria
9.6.18 Long Duration – Life test (LT)
9.6.18.1 Purpose
150 9.6.18.2 Process
151 9.6.18.3 Pass-fail criteria
9.7 Failure definition
9.7.1 Failure criteria
152 9.7.2 Failed components
9.8 Data documentation
9.9 Delivery
9.10 Packing, despatching, handling and storage
9.10.1 Overview
9.10.2 ESD sensitivity
153 10 Solar simulators and calibration procedures
10.1 Solar simulators
10.1.1 Spectral distribution
10.1.1.1 AM0 spectrum
10.1.1.2 Total Irradiance of the Solar simulator
10.1.1.3 Spectral distribution of the Solar simulator
155 10.1.2 Irradiance uniformity
156 10.1.3 Irradiance stability
157 10.2 Standard cell and Solar simulator calibration
10.2.1 Primary standards
10.2.2 Secondary working standards (SWS)
10.2.2.1 Selection of secondary working standards
10.2.2.2 <>
158 10.2.2.3 Secondary working standards performance requirements
159 10.2.3 Standards cells documentation
10.2.4 Maintenance of standards
10.2.5 Recalibration and intercomparison
10.2.6 Solar simulator calibration and maintenance
10.2.6.1 Solar simulator calibration
160 10.2.6.2 Solar simulator maintenance
161 11 Capacitance measurement methods
11.1 Single junction solar cell capacitance measurement
11.1.1 Overview
11.1.1.1 General
11.1.1.2 Description
11.1.2 Signal measurement method
162 11.1.3 Measurement procedure
11.1.3.1 Preparation of the measurement equipment
163 11.1.3.2 Process for calibration of the test equipment
165 11.1.3.3 Measurement of the cell with the network analyser
11.1.4 Measurement analysis
11.1.4.1 Correction of the measurement with respect to the actual impedance of the shunt (impedance values from the B/A measurements)
166 11.1.4.2 Modelling
168 11.1.5 Measurement of the capacitance of a multi-junction cell
169 11.2 Time domain capacitance measurement
11.2.1 Overview
11.2.1.1 General
11.2.1.2 Description
170 11.2.2 Measurement procedure
11.2.2.1 Measurement equipment set-up
11.2.2.2 Calibration of the measurement equipment
11.2.2.3 Performance measurement
11.2.2.4 Data processing
172 12 Planar Blocking Diodes
12.1 Overview
12.2 Testing, deliverable components and Marking
12.2.1 Testing
12.2.1.1 Tests for qualification and procurement
12.2.1.2 Conditions and methods of tests
173 12.2.1.3 Responsibility of supplier for the performance of tests and inspections
12.2.2 Deliverable components
12.2.3 Marking
174 12.3 Production control (process identification document)
12.4 Acceptance test
12.4.1 General
12.4.2 Planar blocking diodes
175 12.5 Qualification tests
12.5.1 General
12.5.2 Blocking diodes
12.5.3 Production and test schedule
12.5.4 Qualification test samples
176 12.5.5 Qualification testing
179 12.6 Test methods, conditions and measurements
12.6.1 Visual inspection (VI)
12.6.1.1 Process
12.6.1.2 Deviations
12.6.1.3 Defects
12.6.2 Dimensions and weight (DW)
180 12.6.3 Diode characterization (DC)
12.6.3.1 Purpose
12.6.3.2 Process
12.6.3.3 Pass/fail criteria
12.6.4 Humidity and Temperature
12.6.4.1 HT1 for qualification testing (subgroup O)
181 12.6.4.2 HT2 for acceptance testing
182 12.6.5 Temperature Cycling (CY)
12.6.5.1 Purpose
12.6.5.2 Process
12.6.6 Contact Adherence (CA)
12.6.6.1 Purpose
12.6.6.2 Process
12.6.6.3 Pass/fail criteria
183 12.6.7 Burn-in (BI)
12.6.7.1 Purpose
12.6.7.2 Power Burn-in (FWD-BI)
12.6.7.3 High Temperature Reverse Bias Burn-in (HTRB-BI)
184 12.6.8 Long duration-Life Test (LT)
12.6.8.1 Purpose
12.6.8.2 Process
12.6.8.3 Pass/fail criteria
12.6.9 Temperature behaviour test (TB)
12.6.9.1 Purpose
12.6.9.2 Process
185 12.6.10 Temperature robustness test (TR)
12.6.10.1 Purpose
12.6.10.2 Process
12.6.11 Total Dose Radiation Testing (RT)
12.6.11.1 Ionising radiation test
186 12.6.11.2 Non-ionising radiation test
187 12.6.12 Temperature Annealing (TA)
12.6.12.1 Purpose
12.6.12.2 Process
12.6.13 Contact uniformity test (CU)
12.6.13.1 Purpose
188 12.6.13.2 Process
12.6.13.3 Pass-fail criteria
12.6.14 Surface Finish test (SF)
12.6.14.1 Purpose
12.6.14.2 Process
12.6.14.3 Pass-fail criteria
12.6.15 Human Body ESD test (ESD)
12.6.15.1 Purpose
12.6.15.2 Process
12.6.15.3 Pass-fail criteria
189 12.6.16 Pull test (PT) / Interconnector adherence test (IA)
12.6.16.1 Purpose
12.6.16.2 Process
12.6.16.3 Pass-fail criteria
12.6.17 Surge test (ST)
12.6.17.1 Purpose
12.6.17.2 Process
12.6.17.3 Pass-Fail criteria
190 12.6.18 Thermo-optical data (TO)
12.6.18.1 Purpose
12.6.18.2 Process
12.6.18.3 Pass-fail criteria
12.7 Failure definition
12.7.1 Failure criteria
12.7.2 Failed Blocking Diodes
191 12.8 Data documentation
12.9 Delivery
12.10 Packing, despatching, handling and storage
12.10.1 Overview
12.10.2 ESD sensitivity

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