BS EN 60068-3-13:2016 – TC:2020 Edition
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Tracked Changes. Environmental testing – Supporting documentation and guidance on Test T. Soldering
| Published By | Publication Date | Number of Pages |
| BSI | 2020 | 80 |
IEC 60068-3-13:2016 provides background information and guidance for writers and users of specifications for electric and electronic components, containing references to the test standards IEC 60068-2-20, IEC 60068-2-58, IEC 60068-2-69, IEC 60068-2-83, and to IEC 61760-1, which defines requirements to the specification of surface mounting components. This first edition cancels and replaces IEC 60068-2-44:1995 and constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: – information for lead-free solders are added; – technical update and restructuring.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 52 | English CONTENTS |
| 54 | FOREWORD |
| 56 | 1 Scope 2 Normative references 3 Terms, definitions and abbreviations 3.1 Terms and definitions |
| 57 | 3.2 Abbreviations 4 Overview 4.1 Factors influencing the formation and reliability of solder joints (ability to be soldered) |
| 58 | 4.2 Physics of surface wetting Figures Figure 1 – Sessile drop of solder on oxidised copper |
| 59 | Figure 2 – Sessile drop of solder plus flux on clean copper Figure 3 – Sessile drop equilibrium forces |
| 60 | 4.3 Quality and reliability of solder joints 5 Component soldering – Processes 5.1 General considerations 5.1.1 Components’ ability to be soldered |
| 62 | 5.1.2 Soldering processes 5.1.3 Soldering defects 5.1.4 Geometrical factors which may influence the soldering result 5.1.5 Process factors 5.1.6 Material factors Figure 4 – Typical soldering processes |
| 63 | 5.2 Solder 5.3 Grouping of soldering conditions 5.4 Ability to be soldered 5.5 Moisture sensitivity of components Tables Table 1 – Solder process groups |
| 64 | 5.6 Relation between storage time/storage conditions and solderability 5.6.1 Natural and accelerated ageing 5.6.2 Oxidation 5.6.3 Growth of intermetallic layers 5.6.4 Effect of ageing to wetting characteristics |
| 65 | 5.6.5 Test conditions for accelerated ageing |
| 66 | 5.7 Place of soldering tests in testing |
| 67 | 6 Soldering tests 6.1 General |
| 68 | 6.2 Solder 6.3 Fluxes 6.4 Test equipment 6.5 Evaluation methods 6.5.1 Criteria for visual inspection |
| 69 | 6.5.2 Criteria for quantitative evaluation of the wetting characteristic 6.5.3 Special cases 6.6 Acceptance criteria 7 Soldering tests – Methods 7.1 General principles 7.2 Survey of test methods |
| 71 | Figure 5 – Soldering tests for devices with leads |
| 72 | 7.3 Bath test Figure 6 – Soldering tests for SMDs |
| 73 | 7.4 Reflow test 7.4.1 With/without solder land 7.4.2 Selection of solder paste (flux system and activity grade) 7.5 Soldering iron test 7.6 Resistance to dissolution of metallization and soldering heat 7.6.1 General 7.6.2 Limitations |
| 74 | 7.6.3 Choice of severity 7.7 Wetting balance test 7.7.1 General |
| 75 | 7.7.2 Test methods available 7.7.3 Limitations 8 Requirements and statistical character of results |
| 77 | Bibliography |
