BS EN 60115-2:2015
$215.11
Fixed resistors for use in electronic equipment – Sectional specification: Leaded fixed low power film resistors
| Published By | Publication Date | Number of Pages |
| BSI | 2015 | 74 |
IEC 60115-2:2014 is applicable to leaded fixed low-power film resistors for use in electronic equipment. These resistors are typically described according to types (different geometric shapes) and styles (different dimensions) and product technology. The resistive element of these resistors is typically protected by a conformal lacquer coating. These resistors have wire terminations and are primarily intended to be mounted on a circuit board in through-hole technique. The object of this standard is to prescribe preferred ratings and characteristics and to select from IEC 60115-1, the appropriate quality assessment procedures, tests and measuring methods and to give general performance requirements for this type of resistor. This edition includes the following significant technical changes with respect to the previous edition: – it includes test conditions and requirements for lead-free soldering and assessment procedures meeting the requirements of a “zero defect” approach; – it introduces a product classification based on application requirements; – it includes an extension of the list of styles and dimensions; – it includes the use of an extended scope of stability class definitions; – it includes the extension of the lists of preferred values of ratings; – it includes test conditions and requirements for lead-free soldering, for periodic overload and for resistance to electrostatic discharge (ESD); – it includes a new set of severities for a shear test; – it includes definitions for a test board; – it includes the replacement of assessment level E and possible others by the sole assessment level EZ, meeting the requirements of a “zero defect” approach; – it includes an extended endurance test, a flammability test, a temperature rise test, vibration tests, an extended rapid change of temperature test, and a single pulse high-voltage overload test; – it includes requirements applicable to 0-ohm resistors (jumpers); – it includes recommendations for the denomination, description, packaging and quality assessment of radial formed styles; – it includes prescriptions for endurance testing at room temperature, supplementary to the rulings of IEC 60115-1.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 4 | Foreword |
| 5 | Annex ZA (normative) Normative references to international publications with their corresponding European publications |
| 6 | Annex ZX (informative) Cross reference for references to the predecessor of this specification |
| 8 | English CONTENTS |
| 12 | 1 Scope 2 Normative references |
| 13 | 3 Terms, definitions, product technologies and product classification 3.1 Terms and definitions 3.2 Product technologies 3.2.1 Metal film technology 3.2.2 Metal glaze technology |
| 14 | 3.2.3 Metal oxide technology 3.2.4 Carbon film technology 3.3 Product classification |
| 15 | 4 Preferred characteristics 4.1 General 4.2 Style and dimensions Figures Figure 1 – Shape and dimensions of axial leaded resistors Tables Table 1 – Preferred styles of axial leaded resistors |
| 16 | 4.3 Preferred climatic categories Figure 2 – Alternative methods for specification of the length of excessive protective coating on axial leaded resistors Figure 3 – Lead-wire spacing of axial leaded resistors with bent leads |
| 17 | 4.4 Resistance 4.5 Tolerances on resistance 4.6 Rated dissipation P70 Figure 4 – Derating curve |
| 18 | 4.7 Limiting element voltage Umax 4.8 Insulation voltage Uins 4.9 Insulation resistance Rins 5 Tests and test severities 5.1 Preparation of specimen 5.1.1 Drying 5.1.2 Mounting of components on a test rack 5.1.3 Specification of test boards |
| 19 | Figure 5 – Basic layout for mechanical, environmental and electrical tests, Kelvin (4 point) connections Table 2 – Test board dimensions |
| 20 | 5.1.4 Mounting of components on test boards Figure 6 – Basic layout for mechanical, environmental and electrical tests, standard connections |
| 21 | 5.2 Tests 5.2.1 Dimensions 5.2.2 Insulation resistance 5.2.3 Voltage proof Figure 7 – Assembly of specimen to the test board |
| 22 | 5.2.4 Short time overload 5.2.5 Temperature rise 5.2.6 Robustness of terminations 5.2.7 Solderability |
| 23 | 5.2.8 Resistance to soldering heat 5.2.9 Rapid change of temperature |
| 24 | 5.2.10 Rapid change of temperature, ≥100 cycles 5.2.11 Vibration 5.2.12 Climatic sequence |
| 25 | 5.2.13 Damp heat, steady state 5.2.14 Endurance at 70 °C |
| 26 | 5.2.15 Endurance at room temperature 5.2.16 Endurance at the upper category temperature |
| 27 | 5.2.17 Single pulse high voltage overload test 5.2.18 Component solvent resistance 5.2.19 Solvent resistance of marking |
| 28 | 5.2.20 Flammability test 5.2.21 Electrostatic discharge (ESD) test 5.2.22 Periodic pulse overload test |
| 29 | 6 Performance requirements 6.1 General 6.2 Limits for change of resistance |
| 30 | Table 3 – Limits for change of resistance at tests |
| 31 | 6.3 Insulation resistance 6.4 Variation of resistance with temperature Table 4 – Permitted change of resistance due to variation of temperature |
| 32 | 6.5 Temperature rise 6.6 Solderability 6.7 Flammability 7 Marking, packaging and ordering information 7.1 Marking of the component 7.2 Packaging 7.3 Marking of the packaging 7.4 Ordering information |
| 33 | 8 Detail specifications 8.1 General 8.2 Information to be specified in a detail specification 8.2.1 Outline drawing or illustration 8.2.2 Style and dimensions 8.2.3 Climatic category 8.2.4 Resistance range |
| 34 | 8.2.5 Tolerances on resistance 8.2.6 Rated dissipation P70 8.2.7 Limiting element voltage Umax 8.2.8 Insulation voltage Uins 8.2.9 Insulation resistance Rins 8.2.10 Test severities 8.2.11 Limits of resistance change after testing 8.2.12 Temperature coefficient of resistance 8.2.13 Marking 8.2.14 Ordering information |
| 35 | 8.2.15 Mounting 8.2.16 Storage 8.2.17 Additional information 8.2.18 Quality assessment procedures 8.2.19 0 Ω resistors 9 Quality assessment procedures 9.1 General 9.2 Definitions 9.2.1 Primary stage of manufacture 9.2.2 Structurally similar components |
| 36 | 9.2.3 Assessment level EZ 9.3 Formation of inspection lots |
| 37 | 9.4 Qualification approval (QA) procedures 9.5 Quality conformance inspection 9.6 Capability approval (CA) procedures |
| 38 | 9.7 Technology approval (TA) procedures 9.8 Delayed delivery 9.9 Certified test records 9.10 Certificate of conformity (CoC) |
| 39 | Table 5 – Test schedule for qualification approval |
| 44 | Table 6 – Test schedule for quality conformance inspection |
| 49 | Annex A (normative) 0 Ω Resistors (Jumper) A.1 General A.2 Preferred characteristics A.3 Tests and test severities |
| 50 | A.4 Performance requirements A.5 Marking, packaging and ordering information A.6 Detail specification A.7 Quality assessment procedures |
| 52 | Annex B (informative) Radial formed styles B.1 General B.1.1 Scope of this annex B.1.2 Denomination of radial formed styles |
| 53 | B.1.3 Coated lead wires B.1.4 Means for support of mounting height B.1.5 Means for retention |
| 54 | B.2 Radial formed styles B.2.1 Radial formed style with lateral body position Figure B.1 – Shape and dimensions of radial formed resistor for lateral body position Figure B.2 – Shape and dimensions of radial formed resistor for lateral body position with kinked lead wires |
| 55 | B.2.2 Radial formed style with upright body position Table B.1 – Feasible lead-wire spacing of radial formed resistor for lateral body position |
| 56 | Figure B.3 – Shape and dimensions of a radial formed resistor for upright body position Figure B.4 – Shape and dimensions of a radial formed resistorfor upright body position and wide spacing |
| 57 | Figure B.5 – Shape and dimensions of a radial formed resistor for uprightbody position and wide spacing, with kinked lead wire |
| 58 | B.3 Packaging Table B.2 – Feasible lead-wire spacing of a radial formed resistor for upright body position |
| 59 | B.4 Quality assessment B.4.1 General B.4.2 Quality assessment of formed resistors B.4.3 Forming of finished resistors of assessed quality B.4.4 Special inspection requirements |
| 61 | Annex C (normative) Endurance at room temperature C.1 Remark on the temporary relevance of this annex C.2 General C.3 Test chamber and mounting of specimen |
| 62 | C.4 Initial measurement C.5 Temperature and load |
| 63 | Figure C.1 – Derating curve with specification of a suitable test dissipation Figure C.2 – Derating curve without specification of a suitable test dissipation |
| 64 | C.6 Duration C.7 Intermediate measurements C.8 Final inspection, measurements and requirements |
| 66 | Annex D (informative) Letter symbols and abbreviations D.1 Letter symbols |
| 68 | D.2 Abbreviations |
| 70 | Annex X (informative) Cross reference for references to the prior revision of this standard |
| 72 | Bibliography |
