BS EN 60191-6-17:2011
$142.49
Mechanical standardization of semiconductor devices – General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for stacked packages. Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
| Published By | Publication Date | Number of Pages |
| BSI | 2011 | 32 |
IEC 60191-6-17:2011 provides outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 6 | English CONTENTS |
| 7 | INTRODUCTION |
| 8 | 1 Scope 2 Normative references 3 Terms and definitions |
| 9 | 4 Terminal position numbering |
| 10 | 5 Drawings Figures Figure 1 – Individual stackable package, P-FBGA (cavity-up) |
| 11 | Figure 2 – Individual stackable package, P-FBGA (cavity-down) |
| 12 | Figure 3 – Individual stackable package, P-FLGA (cavity-up) |
| 13 | Figure 4 – Stacked package outline, P-PFBGA (cavity-up BGA and cavity-up BGA) |
| 14 | Figure 5 – Stacked package outline, P-PFBGA (cavity-down BGA and cavity-down BGA) |
| 15 | Figure 6 – Stacked package outline, P-PFBGA (cavity-down BGA + cavity-up LGA) |
| 16 | Figure 7 – Stacked package outline, P-PFLGA (cavity-up LGA + cavity-up BGA) |
| 17 | Figure 8 – Functional gauge Figure 9 – Pattern of terminal position area |
| 18 | 6 Dimensions 6.1 Group 1 Tables Table 1 – Dimensions, Group 1 |
| 23 | 6.2 Group 2 Table 2 – Dimensions Group 2 |
| 24 | 6.3 Combination of D, E, MD, and ME Table 3 – Combination of D, E, MD, and ME, e = 0,80 mm pitch FBGA and FLGA |
| 25 | Table 4 – Combination of D, E, MD, and ME, e = 0,65 mm pitch FBGA and FLGA |
| 26 | Table 5 – Combination of D, E, MD, and ME, e = 0,50 mm pitch FBGA and FLGA |
| 27 | Table 6 – Combination of D, E, MD, and ME, e = 0,40 mm pitch FBGA an FLGA |
| 28 | Table 7 – Combination of D, E, MD, and ME, e = 0,30 mm pitch FLGA |
| 29 | 7 Dimension table Table 8 – Dimension table |
