BS EN 60191-6-22:2013
$102.76
Mechanical standardization of semiconductor devices – General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
| Published By | Publication Date | Number of Pages |
| BSI | 2013 | 20 |
IEC 60191-6-22:2012 provides the outline drawings and dimensions common to silicon-based package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 5 | English CONTENTS |
| 6 | 1 Scope 2 Normative references 3 Terms and definitions 4 Terminal position numbering 5 Code of package nominal dimensions |
| 7 | 6 Symbols and drawings Figures Figure 1 – S-FBGA outline |
| 8 | Figure 2 – S-FLGA outline |
| 9 | Figure 3 – Mechanical gauge drawing Figure 4 – Array of terminal-existence areas |
| 10 | 7 Dimensions 7.1 Group 1 Tables Table 1 – Dimensions and tolerances in Group 1 |
| 12 | 7.2 Group 2 Table 2 – Dimensions and tolerances of Group 2 |
| 13 | 8 Combination list of D, E, MD, and ME Table 3 – e = 0,80 mm pitch S-FBGA and S-FLGA Table 4 – e = 0,65 mm pitch S-FBGA and S-FLGA |
| 14 | Table 5 – e = 0,50 mm pitch S-FBGA and S-FLGA |
| 15 | Table 6 – e = 0,40 mm pitch S-FBGA and S-FLGA |
| 16 | Table 7 – e = 0,30 mm pitch S-FBGA and S-FLGA |
| 17 | Table 8 – e = 0,25 mm pitch S-FLGA |
| 18 | Bibliography |
