BS EN 60317-55:2014
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Specifications for particular types of winding wires – Solderable polyurethane enamelled round copper wire overcoated with polyamide, Class 180
Published By | Publication Date | Number of Pages |
BSI | 2014 | 14 |
IEC 60317-55:2013 specifies the requirements of solderable enamelled round copper winding wire of class 180 with a dual coating. The underlying coating is based on polyurethane resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The superimposed coating is based on polyamide resin. NOTE – A modified resin is a resin that has undergone a chemical change, or contains one or more additives to enhance certain performance or application characteristics. The range of nominal conductor diameters covered by this standard is as follows: – Grade 1: 0,020 mm up to and including 1,600 mm; – Grade 2: 0,020 mm up to and including 1,600 mm. The nominal conductor diameters are specified in Clause 4 of IEC 60317-0-1:2013. This second edition cancels and replaces the first edition published in 2007. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: – revision to Clause 23, Pin hole test. Keywords: requirements of solderable enamelled round copper winding wire, class 180, dual coating This publication is to be read in conjunction with /2.
PDF Catalog
PDF Pages | PDF Title |
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6 | English CONTENTS |
7 | INTRODUCTION |
8 | 1 Scope 2 Normative references 3 Terms, definitions, general notes and appearance 3.1 Terms and definitions 3.2 General notes 3.2.1 Methods of test 3.2.2 Winding wire |
9 | 3.3 Appearance 4 Dimensions 5 Electrical resistance 6 Elongation 7 Springiness 8 Flexibility and adherence 9 Heat shock 10 Cut-through 11 Resistance to abrasion (nominal conductor diameters from 0,250 mm up to and including 1,600 mm) |
10 | 12 Resistance to solvents 13 Breakdown voltage 14 Continuity of insulation 15 Temperature index 16 Resistance to refrigerants Table 1 – Resistance to abrasion |
11 | 17 Solderability 17.1 Nominal conductor diameters up to and including 0,100 mm 17.2 Nominal conductor diameters over 0,100 mm 18 Heat or solvent bonding 19 Dielectric dissipation factor 20 Resistance to transformer oil 21 Loss of mass 23 Pin hole test 30 Packaging |
12 | Bibliography |