BS EN 60664-3:2017
$142.49
Insulation coordination for equipment within low-voltage systems – Use of coating, potting or moulding for protection against pollution
| Published By | Publication Date | Number of Pages |
| BSI | 2017 | 32 |
This part of IEC 60664 applies to assemblies protected against pollution by the use of coating, potting or moulding, thus allowing a reduction of clearance and creepage distances as described in IEC 60664‑1 .
This document describes the requirements and test procedures for two methods of protection:
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type 1 protection improves the microenvironment of the parts under the protection;
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type 2 protection is considered to be similar to solid insulation.
This document also applies to all kinds of protected printed boards, including the surface of inner layers of multi-layer boards, substrates and similarly protected assemblies. In the case of multi-layer printed boards, the distances through an inner layer are covered by the requirements for solid insulation in IEC 60664‑1 .
Examples of substrates are hybrid integrated circuits and thick-film technology.
This document refers only to permanent protection. It does not cover assemblies that are subjected to mechanical adjustment or repair.
The principles of this standard are applicable to functional, basic, supplementary and reinforced insulation.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 2 | National foreword |
| 7 | English CONTENTS |
| 9 | FOREWORD |
| 11 | INTRODUCTION |
| 12 | 1 Scope 2 Normative references |
| 13 | 3 Terms and definitions |
| 14 | 4 Design requirements 4.1 Principles 4.2 Application range with regards to the environment |
| 15 | 4.3 Requirements for the types of protection 4.4 Dimensioning procedures Tables Table 1 – Minimum spacings for type 2 protection |
| 16 | 5 Tests 5.1 General 5.2 Specimens for testing coatings |
| 17 | 5.3 Specimens for testing mouldings and potting 5.4 Preparation of test specimens 5.5 Visual examination 5.6 Scratch-resistance test |
| 18 | 5.7 Conditioning of the test specimens 5.7.1 General 5.7.2 Cold conditioning 5.7.3 Dry-heat conditioning Figures Figure 1 – Scratch-resistance test for protecting layers |
| 19 | 5.7.4 Rapid change of temperature Table 2 – Dry-heat conditioning Table 3 – Degrees of severities for rapid change of temperature |
| 20 | 5.7.5 Damp heat, steady-state with polarizing voltage 5.8 Mechanical and electrical tests after conditioning and electromigration 5.8.1 General test conditions 5.8.2 Adhesion of coating |
| 21 | 5.8.3 Insulation resistance between conductors 5.8.4 Voltage test 5.8.5 Partial discharge extinction voltage 5.9 Additional tests 5.9.1 General |
| 22 | 5.9.2 Resistance to soldering heat 5.9.3 Flammability 5.9.4 Solvent resistance |
| 23 | Annex A (normative)Test sequences Table A.1 – Test sequence 1 |
| 24 | Table A.2 – Test sequence 2 additional conditioning with respect to electromigration Table A.3 – Additional tests |
| 25 | Annex B (normative)Decisions to be taken by the technical committees B.1 General B.2 Decisions required by technical committees B.3 Optional test conditions |
| 26 | Annex C (normative)Printed wiring board for testing coatings C.1 General C.2 Specification of the printed wiring board C.3 Arrangement of the conductors |
| 27 | C.4 Arrangement of lands C.5 Connections for the tests |
| 28 | Figure C.1 – Configuration of the test specimen |
| 29 | Figure C.2 – Configuration of landsand adjacent conductors |
| 30 | Bibliography |
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BS EN 60664-3:2017 – TC:2020 Edition
Tracked Changes. Insulation coordination for equipment within low-voltage systems – Use of coating, potting or…
