BS EN 60749-15:2010:2011 Edition
$86.31
Semiconductor devices. Mechanical and climatic test methods – Resistance to soldering temperature for through-hole mounted devices
| Published By | Publication Date | Number of Pages |
| BSI | 2011 | 10 |
| Pages | 10 |
|---|---|
| Descriptors | Soldering, Environmental testing, Solderability testing, Slots, Destructive testing, Semiconductor devices, Encapsulated, Holes, Integrated circuits, Climate, Thermal testing, Electronic equipment and components, Mechanical testing |
| Identical National Standard Of | EN 60749-15:2010/AC:2011, IEC 60749-15:2010 |
| Standard Number | BS EN 60749-15:2010 |
| ISBN | 978 0 580 74712 0 |
| Replaced By | BS EN IEC 60749-15:2020 |
| Withdrawn Date | 2020-10-01 |
| Publication Date | 2011-06-30 |
| Committee | EPL/47 |
| Publisher | BSI |
| Replaces | BS EN 60749-15:2003 |
| Corrects | BS EN 60749-15:2010 |
| Title | Semiconductor devices. Mechanical and climatic test methods – Resistance to soldering temperature for through-hole mounted devices |
| Status | Withdrawn |
| ICS Codes | 31.080.01 - Semiconductor devices in general |
