BS EN 60749:1999:2002 Edition

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Semiconductor devices. Mechanical and climatic test methods

Published By	Publication Date	Number of Pages
BSI	2002	80

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Categories: 31.080.01 - Semiconductor devices in general, BSI

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Description

Uniform preferred test methods and values for stress levels for judging the environmental properties of semiconductor devices (discrete and integrated circuits) from which a selection may be made.

PDF Catalog

PDF Pages	PDF Title
1	BRITISH STANDARD BRITISH STANDARD
2	National foreword National foreword
4	Foreword Foreword to amendment A1 Foreword to amendment A2 Foreword Foreword to amendment A1 Foreword to amendment A2
5	Contents
78	�(normative) Normative references to international publications with their corresponding European… �(normative) Normative references to international publications with their corresponding European… �(normative) Normative references to international publications with their corresponding European… �(normative) Normative references to international publications with their corresponding European…

Additional information

Replaced By	BS EN 60749-1:2003, BS EN 60749-8:2003, BS EN 60749-5:2003, BS EN 60749-32:2003+A1:2010, BS EN 60749-31:2003, BS EN 60749-22:2003, BS EN 60749-20:2003, BS EN 60335-2-11:2001
Amends	BS EN 60749:1999
Descriptors	Integrated circuits, Solderability testing, Strength of materials, Dimensional measurement, Classification systems, Specimen preparation, Accelerated testing, Pull-out tests, Mass spectrometry, Mechanical testing, Thermal-shock tests, Storage, Electrical testing, Visual inspection (testing), Torsion testing, Low-pressure tests, Defects, Endurance testing, Test equipment, Test specimens, Electric terminals, Temperature measurement, Environmental testing, Marking, Shear testing, Leak tests, Electronic equipment and components, Bonding, Stress, Moisture measurement, Vibration testing, Radioactive tracer methods, Thermal testing, Semiconductor devices, Fire tests, Damp-heat tests, Flammability, Testing conditions
Identical National Standard Of	EN 60749/A2 (IEC 60749/A2:2001 AS), IEC 60749:1996/AMD2:2001
Partially Replaced By	BS EN 60749-14:2003, BS EN 60749-21:2005, BS EN 60749-9:2002, BS EN 60749-26:2006, BS EN 60749-10:2002, BS EN 60749-13:2002, BS EN 60749-27:2006+A1:2012, BS EN 60749-2:2002, BS EN 60749-15:2003, BS EN 60749-3:2002, BS EN 60749-12:2002, BS EN 60749-11:2002, BS EN 60749-7:2002, BS EN 60749-5:2003, BS EN 60749-6:2002, BS EN 60749-39:2006, BS EN 60749-25:2003, BS EN 60749-19:2003+A1:2010, BS EN 60749-36:2003, BS EN 60749-4:2002
Standard Number	BS EN 60749:1999, IEC 60749:1996
ISBN	0 580 32151 7
Withdrawn Date	2007-05-01
Publication Date	2002-09-23
Pages	80
Committee	EPL/47
Publisher	BSI
Replaces	BS 6493-3:1985
Title	Semiconductor devices. Mechanical and climatic test methods
Status	Withdrawn
ICS Codes	31.080.01 - Semiconductor devices in general

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BS EN 60749:1999:2002 Edition

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