BS EN 60758:2016 – TC:2020 Edition
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Tracked Changes. Synthetic quartz crystal. Specifications and guidelines for use
| Published By | Publication Date | Number of Pages |
| BSI | 2020 | 146 |
IEC 60758:2016 applies to synthetic quartz single crystals intended for manufacturing piezoelectric elements for frequency control, selection and optical applications. This edition includes the following significant technical changes with respect to the previous edition: – order rearrangement and review of terms and definitions; – abolition as a standard of the infrared absorbance coefficient ? 3410; – addition of the value measurement explanation by FT-IR equipment in annex; – addition of the synthetic quartz crystal standards for optical applications.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 1 | compares BS EN 60758:2016 |
| 2 | TRACKED CHANGES Text example 1 — indicates added text (in green) |
| 86 | CONTENTS |
| 90 | FOREWORD |
| 92 | INTRODUCTION |
| 93 | 1 Scope 2 Normative references 3 Terms and definitions |
| 97 | 4 Specification for synthetic quartz crystal 4.1 Standard values 4.1.1 Shape of synthetic quartz for optical applications 4.1.2 Orientation of the seed 4.1.3 Inclusion density |
| 98 | 4.1.4 Striae in synthetic quartz for optical applications 4.1.5 Infrared quality indications of α3 500 and α3 585 for piezoelectric applications Tables Table 1 – Inclusion density grades for piezoelectric applications Table 2 – Inclusion density grades for optical applications Table 3 – Infrared absorbance coefficient grades for piezoelectric applications |
| 99 | 4.1.6 Grade classification by α value and Schlieren method for optical applications 4.1.7 Frequency-temperature characteristics of synthetic quartz for piezoelectric applications 4.1.8 Etch channel density ρ Table 4 – Infrared absorbance coefficient gradesand Schlieren method for optical applications |
| 100 | 4.1.9 Internal transmittance for optical applications Table 5 – Etch channel density grades for piezoelectric applications |
| 101 | 4.2 Requirements and measuring methods 4.2.1 Orientation Figures Figure 1 – Quartz crystal axis and cut direction |
| 102 | 4.2.2 Handedness 4.2.3 Synthetic quartz crystal dimensions |
| 103 | 4.2.4 Seed dimensions 4.2.5 Imperfections Figure 2 – Idealized sections of a synthetic quartz crystal grown on a Z-cut seed |
| 105 | Figure 3 – Typical example of cutting wafers of AT-cut plate, minor rhombohedral-cut plate, X-cut plate, Y-cut plate and Z-cut plate |
| 106 | 4.2.6 Evaluation of infrared quality by α measurement |
| 108 | 4.2.7 Frequency versus temperature characteristics for piezoelectric applications |
| 109 | 4.2.8 Striae in synthetic quartz for optical applications 4.2.9 Growth band in synthetic quartz for optical applications Figure 4 – Frequency-temperature characteristics deviation rate of the test specimen Figure 5 – Typical schlieren system setup |
| 110 | 4.2.10 Etch channel density |
| 111 | 4.2.11 Internal transmittance for optical applications 4.3 Marking 4.3.1 General |
| 112 | 4.3.2 Shipping requirements 5 Specification for lumbered synthetic quartz crystal 5.1 Standard values 5.1.1 Tolerance of dimensions |
| 113 | 5.1.2 Reference surface flatness 5.1.3 Angular tolerance of reference surface Figure 6 – Lumbered synthetic quartz crystal outline and dimensions along X-, Y- and Z-axes |
| 114 | 5.1.4 Centrality of the seed Figure 7 – Angular deviation for reference surface |
| 115 | 5.2 Requirements and measuring methods 5.2.1 As-grown quartz bars used for lumbered quartz bars 5.2.2 Dimensions of lumbered synthetic quartz crystal 5.2.3 Identification on reference surface 5.2.4 Measurement of reference surface flatness 5.2.5 Measurement of reference surface angle tolerance 5.2.6 Centrality of the seed Figure 8 – Centrality of the seed with respect to the dimensionalong the Z- or Z’-axis |
| 116 | 5.3 Delivery conditions 5.3.1 General 5.3.2 Marking 5.3.3 Packing 5.3.4 Making batch 6 Inspection rule for synthetic quartz crystal and lumbered synthetic quartz crystal 6.1 Inspection rule for as-grown synthetic quartz crystal 6.1.1 Inspection 6.1.2 Lot-by-lot test |
| 117 | 6.2 Inspection rule for lumbered synthetic quartz crystal 6.2.1 General Table 6 – Test conditions and requirements for the lot-by-Iot test for group A Table 7 – Test conditions and requirements for the lot-by-lot test for group B |
| 118 | 6.2.2 Lot-by-lot test 7 Guidelines for the use of synthetic quartz crystal for piezoelectric applications 7.1 General 7.1.1 Overview 7.1.2 Synthetic quartz crystal Table 8 – Test conditions and requirements for the lot-by-lot test |
| 119 | 7.2 Shape and size of synthetic quartz crystal 7.2.1 Crystal axis and face designation |
| 120 | 7.2.2 Seed 7.2.3 Shapes and dimensions Figure 9 – Quartz crystal axis and face designation |
| 121 | 7.2.4 Growth zones 7.3 Standard method for evaluating the quality of synthetic quartz crystal Figure 10 – Synthetic quartz crystal grown on a Z-cut seed of small X-dimensions |
| 122 | 7.4 Other methods for checking the quality of synthetic quartz crystal 7.4.1 General 7.4.2 Visual inspection 7.4.3 Infrared radiation absorption method |
| 123 | 7.4.4 Miscellaneous Figure 11 – Example of a relation between the α value and the Q value at wave number 3 500 cm-1 |
| 124 | 7.5 α grade for piezoelectric quartz 7.6 Optional grading (only as ordered), in inclusions, etch channels, Al content 7.6.1 Inclusions 7.6.2 Etch channels 7.6.3 Al content |
| 125 | 7.6.4 Swept quartz |
| 126 | 7.7 Ordering |
| 127 | Annexes Annex A (informative) Frequently used sampling procedures A.1 Complete volume counting A.2 Commodity Y-bar sampling – Method 1 A.3 Commodity Y-bar sampling – Method 2 |
| 128 | A.4 Use of comparative standards for 100 % crystal inspection |
| 129 | Annex B (informative) Numerical example Table B.1 – Commodity bar sampling, method 1 Table B.2 – Commodity bar sampling |
| 130 | Annex C (informative) Example of reference sample selection |
| 131 | Annex D (informative) Explanations of point callipers Figure D.1 – Point callipers Figure D.2 – Digital point callipers |
| 132 | Annex E (informative) Infrared absorbance α value compensation E.1 General E.2 Sample preparation, equipment set-up and measuring procedure E.2.1 General E.2.2 Sample preparation E.2.3 Equipment set-up |
| 133 | E.2.4 Measurement procedure E.3 Procedure to establish correction terms Figure E.1 – Schematic of measurement set-up |
| 134 | Figure E.2 – Graph relationship between averaged α and measured α at two wave numbers of α3 500 and α3 585 Table E.1 – Example of calibration data at α3 585 Table E.2 – Example of calibration data at α3 500 |
| 135 | E.4 Calculation of compensated (corrected) absorbance values |
| 136 | Annex F (informative) Differences of the orthogonal axial system for quartz between IEC standard and IEEE standard |
| 137 | Figure F.1 – Left- and right-handed quartz crystals |
| 138 | Annex G (informative) α value measurement consistency between dispersive infrared spectrometer and fourier transform infrared spectrometer G.1 General G.2 Experiment |
| 139 | G.3 Experimental result |
| 141 | Figure G.1 – Relationship of α between measuring value and reference value |
| 142 | Bibliography |
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