BS EN 61190-1-2:2007
$102.76
Attachment materials for electronic assembly – Requirements for soldering pastes for high-quality interconnects in electronics assembly
| Published By | Publication Date | Number of Pages |
| BSI | 2007 | 22 |
IEC 61190-1-2:2007 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material’s performance in the manufacturing process. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an explanation of solder ball test standards.
