BS EN 61190-1-3:2002
$167.15
Attachment materials for electronic assembly – Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
| Published By | Publication Date | Number of Pages |
| BSI | 2002 | 38 |
Prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, and powder solders, other than solder paste, for electronic soldering applications as well as for special electronic grade solders. This standard is a quality control document (not intended to relate directly to the material performance in the manufacturing process).
