BS EN 61190-1-3:2007+A1:2010:2011 Edition
$167.15
Attachment materials for electronic assembly – Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
| Published By | Publication Date | Number of Pages |
| BSI | 2011 | 40 |
| Publication Date | 2011-03-31 |
|---|---|
| Amends | BS EN 61190-1-3:2007, 09/30190431 DC |
| Descriptors | Soldering, Electronic equipment and components, Particulate materials, Fluxes (materials), Bars (materials), Bonding, Electronic engineering, Solders, Pastes, Test methods, Electrical connections, Classification systems, Quality assurance, Quality control |
| Identical National Standard Of | IEC 61190-1-3:2007/AMD1:2010, EN 61190-1-3:2007/A1:2010, CLC/TR 61340-5-2:2008 |
| Standard Number | BS EN 61190-1-3:2007+A1:2010 |
| ISBN | 978 0 580 64639 3 |
| Replaced By | BS EN IEC 61190-1-3:2018 |
| Withdrawn Date | 2018-03-28 |
| Pages | 40 |
| Committee | EPL/501 |
| Publisher | BSI |
| Replaces | BS EN 61190-1-3:2002 |
| Title | Attachment materials for electronic assembly – Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
| Status | Withdrawn |
| ICS Codes | 31.190 - Electronic component assemblies |
