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BS EN 61191-2:2017:2019 Edition

BS EN 61191-2:2017:2019 Edition

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Printed board assemblies – Sectional specification. Requirements for surface mount soldered assemblies

Published By Publication Date Number of Pages
BSI 2019 40
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This part of IEC 61191 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through- hole, chip mounting, terminal mounting, etc.).

PDF Catalog

PDF Pages PDF Title
2 undefined
7 CONTENTS
10 FOREWORD
12 1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
5 Surface mounting of components
5.1 General
13 5.2 Alignment requirements
5.3 Process control
5.4 Surface mounted component requirements
5.5 Flatpack lead forming
5.5.1 General
5.5.2 Surface mounted device lead bends
Figures
Figure 1 ā€“ Lead formation for surface mounted device
14 5.5.3 Surface mounted device lead deformation
5.5.4 Flattened leads
5.5.5 Dual-in-line packages (DIPs)
5.5.6 Parts not configured for surface mounting
5.6 Small devices with two terminations
5.6.1 General
5.6.2 Stack mounting
5.6.3 Devices with external deposited elements
15 5.7 Lead component body positioning
5.7.1 General
5.7.2 Axial-leaded components
5.7.3 Other components
5.8 Parts configured for butt lead mounting
5.9 Non-conductive adhesive coverage limits
6 Acceptance requirements
6.1 General
6.2 Control and corrective actions
16 6.3 Surface soldering of leads and terminations
6.3.1 General
6.3.2 Solder fillet height and heel fillets
17 6.3.3 Flat ribbon L and gull-wing leads
Figure 2 ā€“ Fillet height
18 6.3.4 Round or flattened (coined) leads
Figure 3 ā€“ Flat ribbon and gull-wing leads
19 6.3.5 J leads
Figure 4 ā€“ Round or flattened (coined) lead joint
20 6.3.6 Rectangular or square end component
Figure 5 ā€“ J lead joint
21 6.3.7 Cylindrical end-cap terminations
Figure 6 ā€“ Rectangular or square end components
22 6.3.8 Bottom only terminations
Figure 7 ā€“ Cylindrical end-cap terminations
23 6.3.9 Castellated terminations
Figure 8 ā€“ Bottom only terminations
24 6.3.10 Butt joints
Figure 9 ā€“ Leadless chip carriers with castellated terminations
25 6.3.11 Inward L-shaped ribbon leads
Figure 10 ā€“ Butt joints
26 6.3.12 Flat lug leads
Figure 11 ā€“ Inward L-shaped ribbon leads
27 6.3.13 Ball grid array
Figure 12 ā€“ Flat lug leads
28 6.3.14 Column grid array
Figure 13 ā€“ BGA with collapsing balls
Tables
Table 1 ā€“ BGA with non-collapsing balls
Table 2 ā€“ Column grid array
29 6.3.15 Bottom termination components
6.3.16 Components with bottom thermal plane terminations (D-Pak)
Figure 14 ā€“ Bottom termination components
30 Figure 15 ā€“ Bottom thermal plane terminations
31 6.3.17 P-style terminations
6.4 General post-soldering requirements applicable to all surface-mounted assemblies
6.4.1 Dewetting
6.4.2 Leaching
6.4.3 Pits, voids, blowholes, and cavities
Figure 16 ā€“ P-style terminations
32 6.4.4 Solder wicking
6.4.5 Solder webs and skins
6.4.6 Bridging
6.4.7 Degradation of marking
6.4.8 Solder spikes
6.4.9 Disturbed joint
6.4.10 Component damage
6.4.11 Open circuit, non-wetting
6.4.12 Component tilting
33 6.4.13 Non-conducting adhesive encroachment
6.4.14 Open circuit, no solder available
6.4.15 Component on edge
7 Rework and repair
34 Table 3 ā€“ Reworkable defects
35 Annex A (normative)Placement requirements for surface mounted devices
A.1 General
A.2 Component positioning
A.3 Small devices incorporating two terminations
A.3.1 Metallization coverage over the land (side-to-side)
A.3.2 Metallization coverage over the land (end)
A.4 Mounting of cylindrical end-cap devices (MELFs)
A.5 Registration of castellated chip carriers
A.6 Surface mounted device lead and land contact
A.7 Surface mounted device lead side overhang
36 A.8 Surface mounted device lead toe overhang
A.9 Surface mounted device lead height off land (prior to soldering)
A.10 Positioning of J lead devices
A.11 Positioning gull-wing lead devices
A.12 External connections to packaging and interconnect structures
37 Bibliography

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BS EN 61191-2:2017
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