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BS EN 61709:2011

BS EN 61709:2011

$215.11

Electric components. Reliability. Reference conditions for failure rates and stress models for conversion

Published By Publication Date Number of Pages
BSI 2011 94
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This International Standard gives guidance on how failure rate data can be employed for reliability prediction of electric components in equipment.

Reference conditions are numerical values of stresses that are typically observed by components in the majority of applications. Reference conditions are useful since they are the basis of the calculation of failure rate under any conditions by the application of stress models that take into account the actual operating conditions. Failure rates stated at reference conditions allow realistic reliability predictions to be made in the early design phase.

The stress models described herein are generic and can be used as a basis for conversion of the failure rate data at these reference conditions to actual operating conditions when needed and this simplifies the prediction approach. Conversion of failure rate data is only permissible within the specified functional limits of the components.

This standard also gives guidance on how a database of component failure data can be constructed to provide failure rates that can be used with the included stress models. Reference conditions for failure rate data are specified, so that data from different sources can be compared on a uniform basis. If failure rate data are given in accordance with this International Standard then no additional information on the specified conditions is required.

This standard does not provide base failure rates for components ā€“ rather it provides models that allow failure rates obtained by other means to be converted from one operating condition to another operating condition.

The prediction methodology described in this standard assumes that the parts are being used within its useful life. The methods in this standard have a general application but are specifically applied to a selection of component types as defined in Clause 6 and Clause E.2.

PDF Catalog

PDF Pages PDF Title
6 English

CONTENTS
10 INTRODUCTION
11 1 Scope
2 Normative references
12 3 Terms, definitions and symbols
3.1 Terms and definitons
14 3.2 Symbols
15 4 Context and conditions
4.1 Failure modes
16 4.2 Operating profile considerations
4.3 Storage conditions
4.4 Environmental conditions
17 Tables

Table 1 ā€“ Basic environments
Table 2 ā€“ Values of environmental parameters for basic environments
18 5 Generic reference conditions and stress models
5.1 Recommended generic reference conditions
19 5.2 Generic stress models
Table 3 ā€“ Recommended reference conditions for environmentaland mechanical stresses
22 Table 4 ā€“ Environmental application factor, Ļ€E
23 6 Specific reference conditions and stress models
6.1 Integrated semiconductor circuits
Table 5 ā€“ Memory
24 Table 6 ā€“ Microprocessors and peripherals, microcontrollers and signal processors
25 Table 8 ā€“ Analog integrated circuits (IC)
Table 9 ā€“ Application-specific ICs (ASICs)
26 Table 10 ā€“ Constants for voltage dependence
Table 11ā€“ Factor Ļ€U
for digital CMOS-family ICs
Table 12 ā€“ Factor Ļ€U
for bipolar analog ICs
Table 13 ā€“ Constants for temperature dependence
28 Table 14 ā€“ Factor Ļ€T
for ICs (without EPROM; FLASH-EPROM; OTPROM; EEPROM; EAROM)
Table 15 ā€“ Factor Ļ€T
for EPROM, FLASH-EPROM, OTPROM, EEPROM, EAROM
29 6.2 Discrete semiconductors
Table 16 ā€“ Transistors common, low frequency
Table 17 ā€“ Transistors, microwave, e.g. RF >800 MHz
30 Table 18 ā€“ Diodes
Table 19 ā€“ Power semiconductors
31 Table 20 ( Constants for voltage dependence of transistors
Table 21 ā€“ Factor Ļ€U
for transistors
Table 22 ā€“ Constants for temperature dependence of discrete semiconductors
33 Table 23 ā€“ Factor Ļ€T
for transistors, reference and microwave diodes
Table 24 ā€“ Factor Ļ€T
for diodes (without reference and microwave diodes) and power semiconductors
34 6.3 Optoelectronic components
Table 25 ā€“ Optoelectronic semiconductor signal receivers
35 Table 26 ā€“ LEDs, IREDs, laser diodes and transmitter components
Table 27 ā€“ Optocouplers and light barriers
36 Table 28 ā€“ Passive optical components
Table 29 ā€“ Transceiver, transponder and optical sub-equipment
37 Table 30 ā€“ Constants for voltage dependence of phototransistors
Table 31 ā€“ Factor Ļ€U
for phototransistors
Table 32 ā€“ Constants for current dependence of LEDs and IREDs
Table 33 ā€“ Factor Ļ€I
for LEDs and IREDs
38 Table 34 ā€“ Constants for temperature dependence of optoelectronic components
39 Table 35 ā€“ Factor Ļ€T
for optical components
40 6.4 Capacitors
Table 36 ā€“ Capacitors
41 Table 37 ā€“ Constants for voltage dependence of capacitors
Table 38 ā€“ Factor Ļ€U
for capacitors
42 Table 39 ā€“ Constants for temperature dependence of capacitors
43 6.5 Resistors and resistor networks
Table 40 ā€“ Factor Ļ€T
for capacitors
44 Table 41 ā€“ Resistors and resistor networks
Table 42 ā€“ Constants for temperature dependence of resistors
45 6.6 Inductors, transformers and coils
Table 43 ā€“ Factor Ļ€T
for resistors
Table 44 ā€“ Inductors, transformers and coils
Table 45 ā€“ Constants for temperature dependence of inductors, transformers and coils
46 6.7 Microwave devices
Table 46 ā€“ Factor Ļ€T
for inductors, transformers and coils
Table 47 ā€“ Microwave devices
47 6.8 Other passive components
6.9 Electrical connections
Table 48 ā€“ Other passive components
48 6.10 Connectors and sockets
6.11 Relays
Table 49 ā€“ Electrical connections
Table 50 ā€“ Connectors and sockets
49 Table 51 ā€“ Relays
50 Figures

Figure 1 ā€“ Selection of stress regions in accordance with current and voltage-operating conditions
Table 52 ā€“ Factor Ļ€ES
for low current relays
Table 53 ā€“ Factor Ļ€ES
for general purpose relays
51 6.12 Switches and push-buttons
Table 54 ā€“ Factor Ļ€ES
for automotive relays
Table 55 ā€“ Constants for temperature dependence of relays
Table 56 ā€“ Facteur Ļ€T
for relays
52 Figure 2 ā€“ Selection of stress regionsin accordance with current and voltage-operating conditions
Table 57 ā€“ Switches and push-buttons
53 6.13 Signal and pilot lamps
Table 58 ā€“ Factor Ļ€ES
for switches and push-buttons for low electrical stress
TableĀ 59 ā€“ Factor Ļ€ES
for switches and push-buttons for higher electrical stress
Table 60 ā€“ Signal and pilot lamps
54 Table 61 ā€“ Factor Ļ€U
for signal and pilot lamps
55 Annex A (normative)
Failure modes of components
Table A.1 ā€“ Failure modes ā€“ Integrated circuits (ICs)(digital)
Table A.2 ā€“ Failure modes ā€“ Transistors, diodes, optocouplers
56 Table A.3 ā€“ Failure modes ā€“ Capacitors
Table A.4 ā€“ Failure modes ā€“ Resistors, inductive devices, relays
57 Annex B (informative)
Failure rate prediction
61 Figure B.1 ā€“ Stress profile
62 Figure B.2 ā€“ Averaging failure rates
67 Annex C (informative)
Considerations for the design of a data base on failure rates
68 Table C.1 ā€“ Reliability prediction database attributes
70 Annex D (informative)
Potential sources of failure rate data and methods of selection
72 Table D.1 ā€“ Sources of reliability data (in alphabetical order)
76 Annex E (informative)
Overview of component classification
77 Table E.1 ā€“ Classification tree (IECĀ 61360)
88 Annex F (informative)
Examples
90 Bibliography

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BS EN 61709:2011
$215.11