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BS EN 62047-17:2015

$167.15

Semiconductor devices. Micro-electromechanical devices – Bulge test method for measuring mechanical properties of thin films

Published By Publication Date Number of Pages
BSI 2015 34
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IEC 62047-17:2015 specifies the method for performing bulge tests on the free-standing film that is bulged within a window. The specimen is fabricated with micro/nano structural film materials, including metal, ceramic and polymer films, for MEMS, micromachines and others. The thickness of the film is in the range of 0,1 ? to 10 ?, and the width of the rectangular and square membrane window and the diameter of the circular membrane range from 0,5 mm to 4 mm. The tests are carried out at ambient temperature, by applying a uniformly-distributed pressure to the testing film specimen with bulging window. Elastic modulus and residual stress for the film materials can be determined with this method.

PDF Catalog

PDF Pages PDF Title
6 English
CONTENTS
8 FOREWORD
10 1 Scope
2 Normative references
3 Terms, definitions and symbols
3.1 Terms and definitions
11 3.2 Symbols
4 Principle of bulge test
Figures
Figure 1 – Typical example of bulge specimen
Tables
Table 1 – Symbols and designations of a specimen
12 5 Test apparatus and environment
5.1 General
Figure 2 – Membrane window bulged by pressure
Figure 3 – Typical example of bulge test apparatus
13 5.2 Apparatus
5.2.1 Pressuring device
5.2.2 Bulge (pressure) chamber
5.2.3 Height measurement units
14 5.3 Test environment
6 Specimen
6.1 General
6.2 Shape and dimension of specimen
6.3 Measurement of test piece dimension
Figure 4 – Bulge membrane window shapes
15 7 Test procedure and analysis
7.1 Test procedure
16 7.2 Data analysis
Figure 5 – Example of typical pressure-height curve obtained from bulge test
17 8 Test report
18 Annex A (informative) Determination of mechanical properties
A.1 General
A.2 Determination of mechanical properties using stress-strain curve
20 A.3 Determination of mechanical properties using analysis of load-deflection
21 Table A.1 – Examples of various expressions of parameters, C1 and C2(ν), for thin square films
Table A.2 – Examples of various expressions of parameters, C1 and C2(ν), for thin spherical films
22 Figure A.1 – Determination of biaxial modulus in the stress-strain curve obtained from bulge test
23 Annex B (informative) Deformation measurement techniques
B.1 General
B.2 Laser interferometry technique
B.3 Capacitance type measurement
25 Figure B.1 – Typical example of laser interferometer configuration
26 Figure B.2 – Typical fringe patterns obtained from laser Michelson interferometry and ESPI system
27 Figure B.3 – Typical example of the measurement system using a photo detector
Figure B.4 – Schematic of capacitance bulge tester
28 Figure B.5 – Typical example of relationshipbetween bulge height and capacitance change
29 Annex C (informative) Example of test piece fabrication: MEMS process
C.1 Test piece fabrication
Figure C.1 – Example of fabrication procedure for bulge test piece
30 C.2 Measurement of shape of specimen
31 Bibliography
BS EN 62047-17:2015
$167.15