BS EN 62047-18:2013
$102.76
Semiconductor devices. Micro-electromechanical devices – Bend testing methods of thin film materials
| Published By | Publication Date | Number of Pages |
| BSI | 2013 | 18 |
This part of IEC 62047 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 µm and 10 µm. Thin films are used as main structural materials for Micro-electromechanical Systems (abbreviated as MEMS in this document) and micromachines.
The main structural materials for MEMS, micromachines, etc., have special features, such as a few micron meter size, material fabrication by deposition, photolithography, and/ or non-mechanical machining test piece. This International Standard specifies the bend testing and test piece shape for micro-sized smooth cantilever type test pieces, which enables a guarantee of accuracy corresponding to the special features.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 6 | English CONTENTS |
| 7 | 1 Scope 2 Normative references |
| 8 | 3 Symbols and designations 4 Test piece 4.1 Design of test piece Figures Figure 1 – Schematically shown test piece with substrate Tables Table 1 – Symbols and designation of test piece |
| 9 | 4.2 Preparation of test piece 4.3 Test piece width and thickness 4.4 Storage prior to testing 5 Testing method 5.1 General |
| 10 | Figure 2 – Measurement method |
| 11 | 5.2 Method for mounting of test piece 5.3 Method for loading 5.4 Speed of testing 5.5 Displacement measurement 5.6 Test environment 5.7 Data analysis |
| 12 | 6 Test report 5.8 Material for test pieces |
| 13 | Annex A (informative) Precautions for the test piece/substrate interface Figure A.1 – Finishing angle of substrate contact area with test piece |
| 14 | Annex B (informative) Precautions necessary for the force displacement relationship Figure B.1 – Cantilever type bend test piece of metallic glass in accordance with IEC 62047-18 |
| 15 | Figure B.2 – Typical example of relationship between force and displacement |
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BS EN 62047-18:2013
Semiconductor devices. Micro-electromechanical devices – Bend testing methods of thin film materials Published By Publication…
