BS EN 62047-2:2006
$102.76
Semiconductor devices. Micro-electromechanical devices – Tensile testing method of thin film materials
Published By | Publication Date | Number of Pages |
BSI | 2006 | 16 |
Specifies the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10 m, which are main structural materials for micro-electromechanical systems (MEMS), micromachines and similar devices. The main structural materials for MEMS, micromachines and similar devices have special features such as typical dimensions in the order of a few microns, a material fabrication by deposition, and a test piece fabrication by non-mechanical machining using etching and photolithography. This International Standard specifies the testing method, which enables a guarantee of accuracy corresponding to the special features.