BS EN 62047-5:2011:2013 Edition
$167.15
Semiconductor devices. Micro-electromechanical devices – RF MEMS switches
Published By | Publication Date | Number of Pages |
BSI | 2013 | 38 |
This part of IEC 62047 describes terminology, definition, symbols, test methods that can be used to evaluate and determine the essential ratings and characteristic parameters of RF MEMS switches. The statements made in this standardization are also applicable to RF (Radio Frequency) MEMS (Micro-Electro-Mechanical Systems) switches with various structures, contacts (d.c. contact and capacitive contact), configurations (series and shunt), switching networks (SPST, SPDT, DPDT, etc.), and actuation mechanism such as electrostatic, electro-thermal, electromagnetic, piezoelectric, etc. The RF MEMS switches are promising devices in advanced mobile phones with multi-band/mode operation, smart radar systems, reconfigurable RF devices and systems, SDR (Software Defined Radio) phones, test equipments, tunable devices and systems, satellite, etc.
PDF Catalog
PDF Pages | PDF Title |
---|---|
6 | English CONTENTS |
8 | 1 Scope 2 Normative references 3 Terms and definitions |
9 | 3.1 Switching operation 3.2 Switching configuration 3.3 Actuating mechanism |
10 | 3.4 Switching network configurations 3.5 Reliability (performance) |
11 | 3.6 Electrical characteristics |
12 | 4 Essential ratings and characteristics 4.1 Identification and types |
13 | 4.2 Application and specification description 4.3 Limiting values and operating conditions 4.4 DC and RF characteristics Figures Figure 1 – Terminals of RF MEMS switch |
14 | 4.5 Mechanical and environmental characteristics 4.6 Additional information 5 Measuring methods 5.1 General 5.2 DC characteristics |
15 | Figure 2 – Circuit diagram for measuring d.c. actuation voltage and RF characteristics of RF MEMS switches |
16 | Figure 3 – Circuit diagram for measuring impedancebetween the input and output ports |
19 | 5.3 RF characteristics |
20 | Figure 4 – Circuit diagram for measuring RF characteristics between the inputand output ports using a network analyzer |
23 | 5.4 Switching characteristics |
24 | 6 Reliability (performance) 6.1 General 6.2 Life time cycles Figure 5 – Circuit block diagram of a test setupto evaluate life time of RF MEMS switch |
26 | 6.3 Temperature cycles 6.4 High temperature and high humidity testing Figure 6 – Circuit block diagram of a test setup for power handling capability of RF MEMS switch |
27 | 6.5 Shock testing 6.6 Vibration testing 6.7 Electrostatic discharge (ESD) sensitivity testing |
28 | Annex A (informative) General description of RF MEMS Switches Tables Table A.1 – Comparison of semiconductor and RF MEMS switches |
29 | Annex B (informative) Geometry of RF MEMS switches Figure B.1 – RF MEMS series d.c. contact switch with two contact areas. Figure B.2 – RF MEMS series d.c. contact switch with one contact area |
30 | Figure B.3 – RF MEMS shunt d.c. contact switch Figure B.4 – RF MEMS series capacitive type switch with one contact area |
31 | Figure B.5 – RF MEMS shunt capacitive type switch Table B.1 – Comparison of RF MEMS switches with different actuation mechanism |
32 | Annex C (informative) Packaging of RF MEMS switches |
33 | Annex D (informative) Failure mechanism of RF MEMS switches Table D.1 – Comparison of failure mechanism of RF MEMS switches |
34 | Annex E (informative) Applications of RF MEMS switches |
36 | Annex F (informative) Measurement procedure of RF MEMS switches Figure F.1 – Measurement procedure of RF MEMS switches |