🔥🔥 Don’t Miss Out on Our End of Autumn Sale. If you have any questions, feel free to click the bottom right corner to contact our customer service..

Concat us[email protected]
Shopping Cart

No products in the cart.

🔍
BS EN 62047-9:2011:2013 Edition

BS EN 62047-9:2011:2013 Edition

$142.49

Semiconductor devices. Micro-electromechanical devices – Wafer to wafer bonding strength measurement for MEMS

Published By Publication Date Number of Pages
BSI 2013 30
PDF Format Searchable Printable Preview Now
Guaranteed Safe Checkout
Categories: ,

If you have any questions, feel free to reach out to our online customer service team by clicking on the bottom right corner. We’re here to assist you 24/7.
Email:[email protected]

This standard describes bonding strength measurement method of wafer to wafer bonding, type of bonding process such as silicon to silicon fusion bonding, silicon to glass anodic bonding, etc., and applicable structure size during MEMS processing/assembly. The applicable wafer thickness is in the range of 10 µm to several millimeters.

Related products

BS EN 62047-9:2011
$142.49