BS EN 62137:2004:2005 Edition
$142.49
Environmental and endurance testing. Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
| Published By | Publication Date | Number of Pages |
| BSI | 2005 | 30 |
| Pages | 30 |
|---|---|
| Descriptors | Reliability, Soldering, Thermal stress, Printed circuits, Integrated circuits, Life (durability), Electronic equipment and components, Printed-circuit boards, Mechanical testing, Quality control, Environmental testing, Performance testing, Soldered joints, Surface mounting devices, Semiconductor devices, Endurance testing |
| Identical National Standard Of | EN 60464-2:2001, IEC 62137:2004/COR1:2005 |
| Standard Number | BS EN 62137:2004 |
| ISBN | 0 580 44505 4 |
| Replaced By | BS EN 62137-4:2014 |
| Withdrawn Date | 2015-06-30 |
| Publication Date | 2005-05-13 |
| Committee | EPL/501 |
| Publisher | BSI |
| Replaces | DD IEC/PAS 62137-3:2008 |
| Corrects | BS EN 62137:2004, BS EN 62137-4:2014 |
| Title | Environmental and endurance testing. Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN |
| Status | Withdrawn |
| ICS Codes | 31.190 - Electronic component assemblies |
