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BS EN IEC 60286-3:2022 – TC 2023

BS EN IEC 60286-3:2022 – TC 2023

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Tracked Changes. Packaging of components for automatic handling – Packaging of surface mount components on continuous tapes

Published By Publication Date Number of Pages
BSI 2023 142
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This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).

PDF Catalog

PDF Pages PDF Title
1 30468449
79 A-30414097
80 undefined
85 Annex ZA (normative)Normative references to international publicationswith their corresponding European publications
87 English
CONTENTS
91 FOREWORD
93 INTRODUCTION
94 1 Scope
2 Normative references
3 Terms, definitions and symbols
3.1 Terms and definitions
95 Tables
Table 1 – Component size codes
96 3.2 Symbols
Figures
Figure 1 – Sectional view of component cavity (type 1b)
Table 2 – Classification to symbols concerning tape, reel and common symbols
98 4 Structure of the specification
5 Dimensional requirements for taping
5.1 Component cavity positioning requirements
5.1.1 Requirements for type 1a, type 1b, type 2a, type 2b and type 3
5.1.2 Requirements for type 4
99 5.2 Component cavity dimension requirements (type 1a, type 1b, type 2a, type 2b and type 3)
5.3 Type 1a – Punched carrier tape, with top and bottom cover tape (tape widths: 8 mm and 12 mm)
Figure 2 – 8 mm and 12 mm punched carrier-tape dimensions (4 mm cavity pitch)
100 Figure 3 – Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset
Figure 4 – Maximum component tilt, rotation and lateral movement
101 Table 3 – Constant dimensions of 8 mm and 12 mm punched carrier tape
Table 4 – Variable dimensions of 8 mm and 12 mm punched carrier tape
102 5.4 Type 1b – Pressed carrier tape, with top cover tape (tape width: 8 mm)
Figure 5 – Dimensions (P0 = 4 mm/P1 = 2 mm) and (P0 = 4 mm/P1 = 1 mm)
Table 5 – Component tilt, planar rotation and lateral movement
103 Figure 6 – Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset
Figure 7 – Maximum component tilt, rotation and lateral movement
Table 6 – Constant dimensions of 8 mm pressed carrier tape
104 5.5 Type 2a – Blister carrier tape, with single round sprocket holes and tape pitches down to 2 mm (tape widths: 8 mm, 12 mm, 16 mm and 24 mm)
Figure 8 – Blister carrier tape dimensions (8 mm, 12 mm, 16 mm and 24 mm)
Table 7 – Variable dimensions of 8 mm pressed carrier tape
Table 8 – Component tilt, planar rotation and lateral movement
105 Figure 9 – Illustration of 2 mm cavity pitch and pocket offset
Figure 10 – Maximum component tilt, rotation and lateral movement
Table 9 – Constant dimensions of 8 mm to 24 mm blister carrier tape
106 5.6 Type 2b – Blister carrier tape, with single round sprocket holes and with 1mm tape pitch (tape widths: 4 mm)
Table 10 – Variable dimensions of 8 mm to 24 mm blister carrier tape
Table 11 – Component tilt, rotation and lateral movement
107 Figure 11 – Type 2b carrier tape
Figure 12 – Maximum pocket offset
Figure 13 – Maximum component tilt, rotation and lateral movement
108 5.7 Type 3 – Blister carrier tape, with double sprocket holes (32 mm to 200 mm)
Table 12 – Constant dimensions of 4 mm carrier tape
Table 13 – Variable dimensions of 4 mm carrier tape
Table 14 – Component tilt, planar rotation and lateral movements
109 Figure 14 – Blister carrier tape
Figure 15 – Elongated sprocket hole skew
Figure 16 – Maximum component tilt, rotation and lateral movement
110 Table 15 – Constant dimensions of 32 mm to 200 mm blister carrier tape
Table 16 – Variable dimensions of 32 mm to 200 mm blister carrier tape
111 5.8 Type 4 – Adhesive-backed punched plastic carrier tape for singled bare die and other surface mount components (8 mm, 12 mm, 16 mm and 24 mm)
Figure 17 – Adhesive-backed punched carrier-tape dimensions(4 mm compartment pitch)
Figure 18 – Illustration of 2 mm compartment pitch
Table 17 – Component tilt, planar rotation and lateral movements
112 Figure 19 – Maximum component planar rotation and lateral displacement
Table 18 – Dimensions of adhesive backed punched carrier tape
113 6 Polarity and orientation requirements of components in the tape
6.1 Requirements for all types
Table 19 – Variable dimensions of adhesive-backed punched carrier tape
Table 20 – Component planar rotation and lateral displacement
114 6.2 Specific requirements for type 1a
6.3 Specific requirements for type 4
7 Carrier tape requirements
7.1 Taping materials
7.2 Minimum bending radius (for all types)
Figure 20 – Example of polarity and orientation
115 7.3 Camber
Figure 21 – Bending radius
Table 21 – Minimum bending radius
116 8 Cover tape requirements (for type 1a, type 1b, type 2a, type 2b and type 3)
Figure 22 – Measuring method and camber
117 Figure 23 – Dot seals for thin components (as exceptions)
Table 22 – Peel force
118 9 Component taping and additional tape requirements
9.1 All types
9.2 Specific requirements for type 1b
9.3 Specific tape requirements for type 2b
119 9.4 Specific requirement for type 4
9.4.1 General
9.4.2 Coordinate system
Table 23 – Absolute referencing data for component target position
120 9.4.3 Component positioning and lateral displacement
Figure 24 – Type 4 coordinate system
121 9.5 Specific requirements for tapes containing die products
9.5.1 General
9.5.2 Tape design for tapes containing die products
9.5.3 Cleanliness
Figure 25 – Component clearance and positioning method
122 9.5.4 Die lateral movement (type 1a, type 2a and type 2b)
10 Reel requirements
10.1 Dimensions
10.1.1 General
10.1.2 Reel dimensions
Figure 26 – Reel
123 10.1.3 Reel hole dimensions
Table 24 – Reel dimensions
124 10.1.4 Drive hole dimensions (optional)
Figure 27 – Reel hole presentation
Table 25 – Reel hole dimensions
125 10.2 Marking
Figure 28 – Drive hole layout
Table 26 – Drive hole dimensions
126 11 Tape reeling requirements
11.1 All types
11.2 Specific requirements for type 1a
11.3 Specific requirements for type 4
11.4 Leader and trailer tape
11.4.1 General
Figure 29 – Tape reeling and label area on the reel
127 11.4.2 Leader
11.4.3 Trailer
11.5 Recycling
11.6 Missing components
Figure 30 – Leader and trailer
128 Annex A (normative) Recommended measuring methods for type 1b
A.1 Measurement method for carrier tape thickness (T and T3)
A.2 Measurement method for cavity (A0 and B0)
Figure A.1 – Carrier tape thickness measurement points
129 A.3 Measurement method for cavity depth (dimension K0)
Figure A.2 – Cavity cross-section
Figure A.3 – Cavity depth dimension
130 Annex B (informative) Measuring methods of electrostatic potential and charge decay performance while cover tape is peeled off from carrier tape containing surface mount devices
B.1 General
131 B.2 Method for measuring electrostatic potential and charge decay performance
B.2.1 General
Figure B.1 – Configuration of measurement method usingelectrostatic potential measuring system
132 Figure B.2 – Diagram of measure electrostatic potential when peeling cover tape
Figure B.3 – Configuration of electrostatic charge decay measurement method
133 B.2.2 Measurement instrument and device
Figure B.4 – Diagram of the measurement of electrostatic charge decay performance
135 B.2.3 Sample (test specimen)
B.2.4 Pre-treatment conditions and measurement environment conditions
Figure B.5 – Dimensions of the sample
136 B.2.5 Measurement conditions
B.2.6 Method for measuring electrostatic potential
Table B.1 – Conditions of the environment in which the samples are kept and the conditions of the measurement test environment before measurement
137 B.2.7 Method for measuring the electrostatic charge decay performance
138 B.3 Items to be described in the test report and items to be specified in the related standards
B.3.1 Items to be described in the test report
139 B.3.2 Items specified in related standards
140 Bibliography

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BS EN IEC 60286-3:2022 - TC 2023
$258.95