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BS EN IEC 60384-21:2024

$189.07

Fixed capacitors for use in electronic equipment – Sectional specification. Fixed surface mount multilayer capacitors of ceramic dielectric, Class 1

Published By Publication Date Number of Pages
BSI 2024 50
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IEC 60384-21:2024 is applicable to fixed unencapsulated surface mount multilayer capacitors of ceramic dielectric with a defined temperature coefficient (dielectric Class 1), intended for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted on printed boards, or directly onto substrates for hybrid circuits. Capacitors for electromagnetic interference suppression are not included but are covered by IEC 60384-14. The object of this document is to specify preferred ratings and characteristics and to select from IEC 60384-1:2021 the appropriate quality assessment procedures, tests and measuring methods and to give general performance requirements for this type of capacitor. Test severities and requirements specified in detail specifications referring to this sectional specification provide specific test severities and requirements of an equal or higher performance level. Further information on the conception of generic, sectional and detail specifications can be found in the Introduction of IEC 60384-1:2021. This edition includes the following significant technical changes with respect to the previous edition: a) the document has been completely restructured to comply with the ISO/IEC Directives, Part 2 and to make it more useable; tables, figures and references have been revised accordingly; Annex X contains all cross-references of changes in clause/subclause numbers; b) the terms have been replaced by the letter symbols in Table 3; c) code of temperature coefficient and tolerance of C0G, U2J have been added in Table 4, Table 6, Table 8, Table 9, Table 11, Table 13, Table 16 and Annex B; d) the requirement in 5.5.2(visual examination) has been repeated in 5.9.3, 5.10.5, 5.11.4, 5.11.4, 5.13.7, 5.14.5 and 5.15.5; e) the deflection D in the very robust designs has been added in 5.9.1; f) Annex B has been changed informative into normative; g) Clause C.5 (Test schedule for quality conformance inspection) has been newly added to withdraw the blank detail specification: IEC 60384-21-1.

PDF Catalog

PDF Pages PDF Title
2 undefined
5 Annex ZA (normative)Normative references to international publicationswith their corresponding European publications
6 English
CONTENTS
10 FOREWORD
12 1 Scope
2 Normative references
3 Terms and definitions
13 4 Preferred ratings and characteristics
4.1 Preferred characteristics
14 4.2 Preferred values of ratings
4.2.1 Rated temperature (TR)
4.2.2 Rated voltage (UR)
4.2.3 Category voltage (UC)
4.2.4 Preferred values of nominal capacitance and associated tolerance values
Tables
Table 1 – Preferred tolerances on nominal capacitance
15 4.2.5 Temperature coefficient (α)
Table 2 – Nominal temperature coefficient and tolerance (for reference temperature 20 °C)
16 Table 3 – Combination of temperature coefficient and tolerance
17 4.2.6 Dimensions
5 Test and measurement procedures
5.1 General
5.2 Preliminary drying
5.3 Measuring conditions
5.4 Mounting
5.5 Visual examination and check of dimensions
5.5.1 General
5.5.2 Visual examination
5.5.3 Requirements
18 Figures
Figure 1 – Fault: crack or fissure
Figure 2 – Fault: crack or fissure
Figure 3 – Separation or delamination
Figure 4 – Exposed electrodes
19 5.6 Electrical tests
5.6.1 Capacitance
5.6.2 Tangent of loss angle (tan δ)
Figure 5 – Principal faces
20 5.6.3 Insulation resistance
Table 4 – Tangent of loss angle limits
21 5.6.4 Voltage proof
5.7 Temperature coefficient (α) and temperature cyclic drift
5.7.1 General
Table 5 – Test voltages
22 5.7.2 Preliminary drying
5.7.3 Measuring conditions
5.7.4 Requirements
5.8 Shear test
5.9 Substrate bending test
5.9.1 General
5.9.2 Initial measurement
Table 6 – Temperature cyclic drift limits
23 5.9.3 Final inspection
5.10 Resistance to soldering heat
5.10.1 General
5.10.2 Initial measurement
5.10.3 Test conditions
24 5.10.4 Recovery
5.10.5 Final inspection, measurements and requirements
Figure 6 – Reflow temperature profile
Table 7 – Reflow temperature profiles for Sn-Ag-Cu alloy
Table 8 – Maximum capacitance change
25 5.11 Solderability
5.11.1 General
5.11.2 Test conditions
5.11.3 Recovery
5.11.4 Final inspection, measurements and requirements
26 5.12 Rapid change of temperature
5.12.1 General
5.12.2 Initial measurement
5.12.3 Number of cycles
5.12.4 Recovery
5.12.5 Final inspection, measurements and requirements
5.13 Climatic sequence
5.13.1 General
5.13.2 Initial measurement
Table 9 – Maximum capacitance change
27 5.13.3 Dry heat
5.13.4 Damp heat, cyclic, Test Db, first cycle
5.13.5 Cold
5.13.6 Damp heat, cyclic, Test Db, remaining cycles
5.13.7 Final inspection, measurements and requirements
Table 10 – Number of damp heat cycles
Table 11 – Final inspection, measurements and requirements
28 5.14 Damp heat, steady state
5.14.1 General
5.14.2 Initial measurement
5.14.3 Test conditions
5.14.4 Recovery
5.14.5 Final inspection, measurements and requirements
Table 12 – Test conditions for damp heat, steady state
29 5.15 Endurance
5.15.1 General
5.15.2 Initial measurement
5.15.3 Test conditions
Table 13 – Final inspection, measurements and requirements
Table 14 – Endurance test conditions (UC = UR)
30 5.15.4 Recovery
5.15.5 Final inspection, measurements and requirements
5.16 Robustness of terminations (only for capacitors with strip termination)
5.16.1 General
5.16.2 Test conditions
Table 15 – Endurance test conditions (UC ≠ UR)
Table 16 – Final inspection, measurements and requirements
31 5.16.3 Final inspection and requirements
5.17 Component solvent resistance (if required)
5.18 Solvent resistance of the marking (if required)
5.19 Accelerated damp heat, steady state (if required)
5.19.1 General
5.19.2 Initial measurement
5.19.3 Conditioning
Table 17 – Initial requirements
32 5.19.4 Recovery
5.19.5 Final measurements
6 Marking
6.1 General
6.2 Information for marking
6.3 Marking on the body
6.4 Requirements for marking
Table 18 – Conditioning
33 6.5 Marking of the packaging
6.6 Additional marking
7 Information to be given in a detail specification
7.1 General
7.2 Outline drawing and dimensions
7.3 Mounting
7.4 Rating and characteristics
7.4.1 General
7.4.2 Nominal capacitance range
34 7.4.3 Particular characteristics
7.4.4 Soldering
7.5 Marking
8 Quality assessment procedures
8.1 Primary stage of manufacture
8.2 Structurally similar components
8.3 Certified records of released lots
8.4 Qualification approval
8.4.1 General
8.4.2 Qualification approval on the basis of the fixed sample size procedures
35 8.4.3 Tests
36 Table 19 – Fixed sample size test plan for qualification approval Assessment level EZ
37 Table 20 – Tests schedule for qualification approval
40 Annexes
Annex A (normative) Guidance for the specification and coding of dimensions of fixed surface mount multilayer capacitors of ceramic dielectric, Class 1
Figure A.1 – Dimensions
Table A.1 – Dimensions
41 Annex B (normative) Combination of temperature coefficients and tolerances for the reference temperature of 25 °C
Table B.1 – Combination of temperature coefficients and tolerances for the reference temperature of 25 °C
42 Annex C (normative) Quality conformance inspection
C.1 Formation of inspection lots
C.1.1 Groups A and B inspection
C.1.2 Group C inspection
C.2 Test schedule
C.3 Delayed delivery
C.4 Assessment levels
43 C.5 Test schedule for quality conformance inspection
Table C.1 – Lot by lot inspection
Table C.2 – Periodic inspection
44 Table C.3 – Test schedule for quality conformance inspection (lot by lot)
45 Table C.4 – Test schedule for quality conformance inspection (Periodic test)
48 Annex X (informative) Cross-reference for reference to IEC 60384-21:2019
Table X.1 – Reference to IEC 60384-21 for clause/annex
Table X.2 – Reference to IEC 60384-21 for figure/table
49 Bibliography
BS EN IEC 60384-21:2024
$189.07