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BS EN IEC 60749-10:2022 – TC

BS EN IEC 60749-10:2022 – TC

$134.27

Tracked Changes. Semiconductor devices. Mechanical and climatic test methods – Mechanical shock. device and subassembly

Published By Publication Date Number of Pages
BSI 2022 38
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IEC 60749-10:2022 is intended to evaluate devices in the free state and assembled to printed wiring boards for use in electrical equipment. The method is intended to determine the compatibility of devices and subassemblies to withstand moderately severe shocks. The use of subassemblies is a means to test devices in usage conditions as assembled to printed wiring boards. Mechanical shock due to suddenly applied forces, or abrupt change in motion produced by handling, transportation or field operation can disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test intended for device qualification. This edition cancels and replaces the first edition published in 2002. This edition includes the following significant technical changes with respect to the previous edition:

  1. covers both unattached components and components attached to printed wiring boards;
  2. tolerance limits modified for peak acceleration and pulse duration;
  3. mathematical formulae added for velocity change and equivalent drop height.

PDF Catalog

PDF Pages PDF Title
1 30460178
23 A-30435580
24 undefined
26 European foreword
Endorsement notice
27 English
CONTENTS
28 FOREWORD
30 1 Scope
2 Normative references
3 Terms and definitions
32 4 Apparatus
5 Procedure
5.1 Apparatus set-up
33 Figure 1 ā€“ Live-bug orientation with solder spheres of device facingdownward in either free or mounted state
Figure 2 ā€“ Dead-bug orientation with solder spheres of devicefacing upward in either free or mounted state
34 5.2 Device or subassembly in free-state
5.3 Subassembly in mounted state
Table 1 ā€“ Device or subassembly free state test levels
35 5.4 Measurements
6 Failure criteria
Table 2 ā€“ Subassembly mounted state test levels
36 7 Summary
37 Bibliography

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BS EN IEC 60749-10:2022 - TC
$134.27