BS EN IEC 60749-5:2024 – TC
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Tracked Changes. Semiconductor devices. Mechanical and climatic test methods – Steady-state temperature humidity bias life test
Published By | Publication Date | Number of Pages |
BSI | 2024 | 34 |
IEC 60749-5:2023 is available as IEC 60749-5:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60749-5:2023 provides a steady-state temperature and humidity bias life test to evaluate the reliability of non-hermetic packaged semiconductor devices in humid environments. This test method is considered destructive. This edition includes the following significant technical changes with respect to the previous edition: a) The specification of the test equipment is changed to require the need to minimize relative humidity gradients and maximize air flow between semiconductor devices under test; b) The specification of the test equipment fixtures is changed to require the avoidance of condensation on devices under test and on electrical fixtures connecting the devices to the test equipment; c) replacement of references to “virtual junction” with “die”.
PDF Catalog
PDF Pages | PDF Title |
---|---|
21 | undefined |
24 | Annex ZA (normative)Normative references to international publicationswith their corresponding European publications |
25 | English CONTENTS |
26 | FOREWORD |
28 | 1 Scope 2 Normative references 3 Terms and definitions 4 General 5 Equipment 5.1 Equipment summary |
29 | 5.2 Temperature and relative humidity 5.3 Devices under stress 5.4 Minimizing release of contamination 5.5 Ionic contamination 5.6 Deionized water 6 Test conditions 6.1 Test conditions summary 6.2 Temperature, relative humidity and duration Table 1 – Temperature, relative humidity and duration |
30 | 6.3 Biasing guidelines 6.4 Biasing choice and reporting Table 2 – Criteria for choosing continuous or cyclical bias |
31 | 7 Procedures 7.1 Mounting 7.2 Ramp-up 7.3 Ramp-down 7.4 Test clock 7.5 Bias 7.6 Read-out 7.7 Handling |
32 | 8 Failure criteria 9 Safety 10 Summary |