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BS EN IEC 61189-2-808:2024

BS EN IEC 61189-2-808:2024

$142.49

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Thermal resistance of an assembly by thermal transient method

Published By Publication Date Number of Pages
BSI 2024 26
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IEC 61189-2-808:2024 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink. NOTE: This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.

PDF Catalog

PDF Pages PDF Title
2 undefined
5 Annex ZA (normative)Normative references to international publicationswith their corresponding European publications
6 English
CONTENTS
7 FOREWORD
9 1 Scope
2 Normative references
3 Terms and definitions
4 Objective
10 5 Test specimen
Figures
Figure 1 – Structure of an assembly
Figure 2 – The fabricated test sample
11 6 Test equipment and procedures
6.1 Test method and recommended test parameters
6.2 Test equipment
12 6.3 Test procedure
7 Test result
Figure 3 – Test structure for measuring thermal resistance
13 8 Report
Figure 4 – Test result for thermal resistance of an assembly
Tables
Table 1 – Test result for thermal resistance of an assembly
15 Annex A (informative) Additional test methods for thermal resistance
Table A.1 – ASTM C1113
Table A.2 – ASTM E1461
16 Table A.3 – ASTM D5470
17 Annex B (informative) Thermal resistance of die attach materials
B.1 Test specimen
B.2 Die attach materials
Figure B.1 –Structure of test sample using die attach material
Figure B.2 –The fabricated test sample using die attach material
18 B.3 Test result
Table B.1 – Properties for die attach materials
19 Figure B.3 – Test graph for die attach materials
Table B.2 – Test result for die attach materials
20 Annex C (informative) Uncertainty and repeatability for thermal resistance test
C.1 Test specimen
C.2 Test result
Figure C.1 – Test structure for measuring thermal resistance
Figure C.2 – Test result for thermal resistance of assembly
21 Table C.1 – Test result for thermal resistance of assembly
22 Annex D (informative) Thermostat equipment
Figure D.1 – Connection of the thermostat unit to the T3Ster® main system unit
23 Figure D.2 –Calibration diagram recorded by the T3Ster® thermostat
24 Bibliography

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BS EN IEC 61189-2-808:2024
$142.49