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BS EN IEC 62025-2:2019

BS EN IEC 62025-2:2019

$142.49

High frequency inductive components. Non-electrical characteristics and measuring methods – Test methods for non-electrical characteristics

Published By Publication Date Number of Pages
BSI 2019 30
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This part of IEC 62025 specifies a test method for the non-electrical characteristics of the surface mounted device (SMD) inductors to be used for electronic and telecommunication equipment. The object of this part of this document is to define methods for measuring mechanical performance only. As the reliability performances and specifications relative to non-electrical performances are defined in IEC 62211, detailed measuring methods for mechanical performance of reliability testing are defined in this document.

PDF Catalog

PDF Pages PDF Title
2 undefined
5 Annex ZA(normative)Normative references to international publicationswith their corresponding European publications
7 English
CONTENTS
9 FOREWORD
11 1 Scope
2 Normative references
12 3 Terms and definitions
4 Test conditions
4.1 Standard atmospheric conditions for test
4.2 Referee conditions
5 Mechanical characteristics test
5.1 Body strength test
5.1.1 Body strength test procedures
13 Figures
Figure 1 – Method for pressurizing the body
14 5.1.2 Information to be given in the detail specification
5.2 Robustness of terminations (electrodes)
5.2.1 Resistance to bending of printed-circuit board
Figure 2 – Pressurizing jig
15 Figure 3 – Example of printed-circuit board
Tables
Table 1 – Size of soldering lands according to the code of multi-layer chip inductors
16 Table 2 – Thickness of solder paste by the size code of inductors
17 Figure 4 – Layout
Figure 5 – Pressurizing jig
Figure 6 – Pressurizing
18 5.2.2 Adherence test (see test of Ue3 of IEC 60068-2-21)
19 Figure 7 – Pressurizing and shape of jig
20 5.3 Solderability
5.3.1 General
5.3.2 Preconditioning
5.3.3 Initial measurement
5.3.4 Test method
21 Table 3 – Conditions of immersion into solder
Table 4 – Reflow temperature
22 5.3.5 Recovery
5.3.6 Final measurement
5.3.7 Items to be specified in detail specification
Figure 8 – Reflow temperature profile
23 5.4 Resistance to soldering heat
5.4.1 General
5.4.2 Preconditioning
5.4.3 Initial measurement
5.4.4 Test method
Table 5 – Severity
24 5.4.5 Recovery
5.4.6 Final measurement
5.4.7 Items to be specified in detail specification
Table 6 – Reflow temperature
25 5.5 Resistance to dissolution of metallization
5.5.1 General
5.5.2 Preconditioning
5.5.3 Initial measurement
5.5.4 Test methods
5.5.5 Final measurements
26 5.5.6 Items to be specified in detail specification
5.6 Vibration
5.6.1 Test equipment
5.6.2 Preparation
5.6.3 Test method
5.6.4 Items to be specified in detail specification
Table 7 – Conditions of vibration
27 5.7 Resistance to shock
5.7.1 Mechanical shock method
5.7.2 Items to be specified in detail specification
28 Annex A (normative) Mounting of surface mounting inductor on test printed-circuit board
A.1 General
A.2 Mounting printed-circuit board and mounting land
A.3 Solder
29 A.4 Preparation
A.5 Preheating
A.6 Soldering
A.7 Cleaning

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BS EN IEC 62025-2:2019
$142.49