BS EN IEC 62148-21:2019
$102.76
Fibre optic active components and devices. Package and interface standards – Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
| Published By | Publication Date | Number of Pages |
| BSI | 2019 | 20 |
This part of IEC 62148 covers the design guide of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is informative.
The purpose of this document is to specify adequately the electrical interface of PIC packages composed of optical transmitters and receivers that enable mechanical and electrical interchangeability of PIC packages.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 2 | undefined |
| 5 | Annex ZA(normative)Normative references to international publicationswith their corresponding European publications |
| 7 | English CONTENTS |
| 8 | FOREWORD |
| 10 | 1 Scope 2 Normative references 3 Terms and definitions |
| 11 | 4 Terminal position numbering 5 Code of package nominal dimensions 6 Symbols and drawings |
| 12 | Figures Figure 1 – S-FBGA and S-FLGA outline |
| 13 | 7 Dimensions and tolerances Figure 2 – Mechanical gauge drawing Figure 3 – Array of terminal-existence areas |
| 14 | Tables Table 1 – Dimensions and tolerances |
| 16 | Table 2 – Combination list of D, E, MD, and ME for e = 0,30 mm pitch S-FBGA (informative) |
| 17 | Table 3 – Combination list of D, E, MD, and ME for e = 0,25 mm pitch S-FLGA |
| 18 | Bibliography |
