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BS EN IEC 62228-5:2021

BS EN IEC 62228-5:2021

$215.11

Integrated circuits. EMC evaluation of transceivers – Ethernet transceivers

Published By Publication Date Number of Pages
BSI 2021 114
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IEC 62228-5:2021(E) specifies test and measurement methods for EMC evaluation of Ethernet transceiver ICs under network condition. It defines test configurations, test conditions, test signals, failure criteria, test procedures, test setups and test boards. It is applicable for transceiver of the Ethernet systems

  • 100BASE-T1 according to ISO/IEC/IEEE 8802-3/AMD1;
  • 100BASE-TX according to ISO/IEC/IEEE 8802-3;
  • 1000BASE-T1 according to ISO/IEC/IEEE 8802-3/AMD4

and covers

  • the emission of RF disturbances;
  • the immunity against RF disturbances;
  • the immunity against impulses;
  • the immunity against electrostatic discharges (ESD).

PDF Catalog

PDF Pages PDF Title
2 undefined
5 Annex ZA(normative)Normative references to international publicationswith their corresponding European publications
7 CONTENTS
13 FOREWORD
15 1 Scope
2 Normative references
16 3 Terms, definitions and abbreviated terms
3.1 Terms and definitions
17 3.2 Abbreviated terms
18 4 General
Tables
Table 1 ā€“ Overview of measurements and tests
19 5 Test and operating conditions
5.1 Supply and ambient conditions
5.2 Test operation modes
5.2.1 General
Table 2 ā€“ Supply and ambient conditions for functional operation
20 5.2.2 Transceiver configuration for normal operation mode
5.2.3 Transceiver configuration for low power mode
5.3 Definition of BIN
Table 3 ā€“ Definition for transceiver configuration for normal operation mode
Table 4 ā€“ Definition for transceiver mode configuration for low power mode
21 5.4 Test configuration
5.4.1 General configuration for transceiver network
Figures
Figure 1 ā€“ Minimum MDI interface test network (Min-BIN)
Figure 2 ā€“ Standard MDI interface test network (Std-BIN)
Figure 3 ā€“ Optimized MDI interface test network (Opt-BIN)
22 Figure 4 ā€“ General test configuration for testsin transceiver network for conducted tests
23 5.4.2 General configuration for single transceiver
5.4.3 Transceiver network tests ā€“ coupling ports and networks for conducted tests
Figure 5 ā€“ General test configuration for unpowered ESD test
Table 5 ā€“ Selection recommendation of MII interfacesfor transceiver network configuration
24 Figure 6 ā€“ Transceiver network tests ā€“ coupling ports and networks
25 Table 6 ā€“ Transceiver network tests ā€“ component value definitionsof coupling ports and networks
26 5.4.4 Single transceiver tests ā€“ coupling ports and networks
27 5.5 Test communication and signals
5.5.1 General
5.5.2 Test signals for normal operation mode
Figure 7 ā€“ Coupling ports and networks for unpowered ESD tests
Table 7 ā€“ Definitions of coupling ports for unpowered ESD tests
28 5.5.3 Test signals for low power mode
5.6 Evaluation criteria
5.6.1 General
5.6.2 Evaluation criteria for functional operation modes
Table 8 ā€“ Definition for transceiver mode configuration for normal operation mode
29 5.6.3 Evaluation criteria in unpowered condition after exposure to disturbances
Table 9 ā€“ Evaluation criteria for Ethernet transceiver
30 5.6.4 Status classes
Figure 8 ā€“ Principle drawing of the maximum deviation on an IV characteristic
Table 10 ā€“ Definition of functional status classes
31 5.7 DUT specific information
6 Test and measurement
6.1 Emission of conducted RF disturbances
6.1.1 Test method
6.1.2 Test setup
32 6.1.3 Test procedure and parameters
Figure 9 ā€“ Test setup for measurement of conducted RF disturbances
Table 11 ā€“ Settings of the conducted RF measurement equipment
33 6.2 Immunity to conducted RF disturbances
6.2.1 Test method
6.2.2 Test setup
Table 12 ā€“ Conducted emission measurements
34 6.2.3 Test procedure and parameters
Figure 10 ā€“ Test setup for DPI tests
35 Table 13 ā€“ Specifications for DPI tests
36 Table 14 ā€“ DPI tests for functional status class AIC evaluationof Ethernet transceivers
37 Table 15 ā€“ DPI tests for functional status class CIC or DIC evaluationof Ethernet transceivers
38 6.3 Immunity to impulses
6.3.1 Test method
6.3.2 Test setup
Figure 11 ā€“ Test setup for impulse immunity tests
39 6.3.3 Test procedure and parameters
Table 16 ā€“ Specifications for impulse immunity tests
Table 17 ā€“ Parameters for impulse immunity test
40 Table 18 ā€“ Impulse immunity tests for functional status class AIC evaluationof Ethernet transceivers
Table 19 ā€“ Impulse immunity tests for functional status class CIC or DIC evaluation of Ethernet transceivers
41 6.4 Electrostatic Discharge (ESD)
6.4.1 Test method
6.4.2 Test setup
Figure 12 ā€“ Test setup for powered ESD tests ā€“ principle arrangement
42 Figure 13 ā€“ Test setup for powered ESD tests ā€“ stimulation and monitoring
43 Figure 14 ā€“ Test setup for unpowered ESD tests ā€“ principle arrangement
45 Figure 15 ā€“ Test setup for unpowered ESD tests ā€“ stimulation and monitoring for function validation pre and post ESD test
46 6.4.3 Test procedure and parameters
Table 20 ā€“ Specifications for ESD tests
47 Table 21 ā€“ ESD tests in powered mode for functional status class AIC, CICand DIC evaluation of Ethernet transceivers
48 7 Test report
Table 22 ā€“ ESD tests in unpowered mode for functional status class DIC evaluationof Ethernet transceiver ICs
49 Annex A (normative)Ethernet test circuits
A.1 General
A.2 Test circuit for Ethernet transceivers for functional tests
50 Figure A.1 ā€“ General drawing of the circuit diagram of test networkfor 100BASE-T1 and 1000BASE-T1 Ethernet transceivers for functionaltest using conducted test methods
51 A.3 Test circuit for Ethernet transceivers for ESD test
Figure A.2 ā€“ General drawing of the circuit diagram of test networkfor 100BASE-TX Ethernet transceivers for functional test using conducted test methods
52 Figure A.3 ā€“ General drawing of the circuit diagram forESD tests of Ethernet transceivers in powered mode
53 Figure A.4 ā€“ General drawing of the circuit diagram for ESD tests of Ethernet transceivers in unpowered mode
54 Annex B (normative)Test circuit boards
B.1 Test circuit board for transceiver network configuration
Figure B.1 ā€“ Example of functional conducted test boardfor Ethernet transceiver ICs (100BASE-T1)
55 Figure B.2 ā€“ Example of powered ESD test boardfor Ethernet transceivers ICs (100BASE-T1)
56 B.2 Test circuit board for single transceiver configuration
Figure B.3 ā€“ Example of unpowered ESD test boardfor Ethernet transceivers ICs (100BASE-T1), top layer
Figure B.4 ā€“ Example of unpowered ESD test boardfor Ethernet transceivers ICs (100BASE-T1), bottom layer
57 Table B.1 ā€“ Parameter ESD test circuit board
58 Annex C (informative)Test of Ethernet transceiver for radiated RF emission and RF immunity
C.1 General
C.2 General configuration for transceiver network
Figure C.1 ā€“ General test configuration for testsin transceiver network used for radiated tests
59 C.3 Tests
C.3.1 General
60 Figure C.2 ā€“ General drawing of the circuit diagram of test network for 100BASE-T1 and 1000BASE-T1 Ethernet transceivers for functional test using radiated RF test methods
61 Figure C.3 ā€“ Example of functional radiated test board for Ethernettransceiver ICs (100BASE-T1), top layer (DUT side)
62 Figure C.4 ā€“ Example of functional radiated test board for Ethernettransceiver ICs (100BASE-T1), bottom layer (external circuitry side)
63 C.3.2 Emission of radiated RF disturbances
Figure C.5 ā€“ Test setup for measurement of radiated RF emission
64 C.3.3 Immunity to radiated RF disturbances
Table C.1 ā€“ Settings of the radiated RF measurement equipment
Table C.2 ā€“ Radiated RF emission measurements
65 Figure C.6 ā€“ Test setup for radiated RF immunity tests
66 Table C.3 ā€“ Specifications for radiated RF immunity tests
67 Table C.4 ā€“ Radiated RF immunity tests for functionalstatus class AIC evaluation of Ethernet transceivers
68 Annex D (informative)Examples for test limits for Ethernet transceiverin automotive application
D.1 General
D.2 Emission of conducted RF disturbances
Figure D.1 ā€“ Example of limits for conducted RF emission ā€“MDI Opt-BIN, VBAT and WAKE
69 D.3 Immunity to conducted RF disturbances
Figure D.2 ā€“ Example of limits for conducted RF emission ā€“ local supplies
Table D.1 ā€“ Example of limits for conducted RF emission ā€“test cases with recommended limit classes
70 Figure D.3 ā€“ Example of limits for conducted RF immunityfor functional status class AIC ā€“ MDI Opt-BIN
Figure D.4 ā€“ Example of limits for conducted RF immunityfor functional status class AIC ā€“ VBAT and WAKE
71 Table D.2 ā€“ Example of limits for conducted RF immunity ā€“test cases with recommended limit classes for functional status class AIC
72 Figure D.5 ā€“ Example of limits for conducted RF immunityfor functional status class CIC or DIC ā€“ MDI Opt-BIN
Figure D.6 ā€“ Example of limits for conducted RF immunityfor functional status class CIC or DIC ā€“ VBAT and WAKE
73 D.4 Immunity to impulses
D.5 Electrostatic discharge (ESD)
Table D.3 ā€“ Example of limits for conducted RF immunity ā€“test cases with recommended limit classes for functional status class CIC or DIC
Table D.4 ā€“ Example of limits for impulse immunity ā€“ Class I
Table D.5 ā€“ Example of limits for impulse immunity ā€“test cases with recommended limit classes for functional status class CIC or DIC
74 D.6 Emission of radiated RF disturbances
Figure D.7 ā€“ Example of limits for radiated RF emissionfor IC stripline with 6,7 mm active conductor height
Table D.6 ā€“ Example of limits for powered and unpowered ESD tests ā€“ test cases with recommended limits for functional status class A1IC, A2IC, A3IC, CIC or DIC
75 D.7 Immunity to radiated RF disturbances
Figure D.8 ā€“ Example of limits for radiated RF immunity
Table D.7 ā€“ Example of limits for radiated RF emission ā€“test cases with recommended limit classes
76 Table D.8 ā€“ Example of limits for radiated RF immunity ā€“test cases with recommended limit classes
77 Annex E (informative)Characterization of common mode chokesfor EMC evaluation of Ethernet transceivers
E.1 General
E.2 Test
E.2.1 General
Figure E.1 ā€“ General electrical drawing of a CMC
78 E.2.2 S-parameter measurement mixed mode
Figure E.2 ā€“ Test setup for S-parameter measurements at CMC
79 Figure E.3 ā€“ Example of test board 4-port S-parameter measurement at CMC ā€“mixed mode, top layer
Figure E.4 ā€“ Example of test board 3-port S-parameter measurement at CMC ā€“single ended, top layer
80 Table E.1 ā€“ Test procedure and parametersfor 3-port test board characterization for CMC
81 Table E.2 ā€“ Test procedure and parameters for S-parameter measurements at CMC
82 Figure E.5 ā€“ Recommended characteristics for Sdd11, Sdd22 (RL) for CMC
Table E.3 ā€“ Required S-parameter measurements for CMC
83 Figure E.6 ā€“ Recommended characteristics for Sdd21 (IL) for CMC
Figure E.7 ā€“ Recommended characteristics for Scc21 (CMR) for CMC
84 Figure E.8 ā€“ Recommended characteristics for Sdc11, Sdc22 (LCL) for CMC
Figure E.9 ā€“ Recommended characteristics for Ssd21, Ssd12 (DCMR)and Sds21, Sds12 (CDMR) for CMC
85 E.2.3 ESD damage
Figure E.10 ā€“ Test setup for ESD damage tests at CMC
86 Figure E.11 ā€“ Example of ESD test board for CMC, top layer
Table E.4 ā€“ Test parameters for ESD damage tests at CMC
87 E.2.4 Saturation test at RF disturbances
Table E.5 ā€“ Required ESD tests for damage for CMC
88 Figure E.12 ā€“ Test setup for RF saturation measurements at CMC
Figure E.13 ā€“ Example of RF saturation / S-parameter test board for CMC, top layer
89 Table E.6 ā€“ Test procedure and parameters for RF saturation tests at CMC
Table E.7 ā€“ Required RF saturation tests for CMC
90 E.2.5 Saturation test at ESD
Figure E.14 ā€“ Test setup for ESD saturation measurements at CMC
Figure E.15 ā€“ Example of ESD saturation test board for CMC, top layer
91 Table E.8 ā€“ Test procedure and parameters for ESD saturation tests at CMC
Table E.9 ā€“ Required ESD saturation tests for CMC
Table E.10 ā€“ ESD saturation break down voltage classes for CMC
92 E.2.6 TDR measurement of differential mode impedance
Figure E.16 ā€“ Example of ESD saturation tests results for CMC
Figure E.17 ā€“ Test setup for TDR measurement at CMC
93 Figure E.18 ā€“ Example of TDR test board for CMC, top layer
Table E.11 ā€“ Test procedure and parameters for TDR measurement at CMC
Table E.12 ā€“ Required TDR measurements for CMC
94 Annex F (informative)Characterization of ESD suppression devicesfor EMC evaluation of Ethernet transceivers
F.1 General
Table F.1 ā€“ Specification of ESD suppression device
95 F.2 Test
F.2.1 General
Figure F.1 ā€“ Arrangement of ESD suppression devicewithin the 100BASE-T1 and 1000BASE-T1 MDI interface
96 F.2.2 S-parameter measurement mixed mode
Figure F.2 ā€“ Test setup for S-parameter measurements at ESD suppression device
97 Figure F.3 ā€“ Example of test board 4-port S-parameter measurementfor ESD suppression device ā€“ mixed mode, top layer
Figure F.4 ā€“ Example of test board 3-port S-parameter measurementfor ESD suppression device ā€“ single ended, top layer
98 Table F.2 ā€“ Test procedure and parameters for 3-port test boardcharacterization for ESD suppression device
99 Table F.3 ā€“ Test procedure and parameters for S-parametermeasurements at ESD suppression device
Table F.4 ā€“ Required S-parameter measurements for ESD suppression device
100 Figure F.5 ā€“ Recommended characteristics for Sdd11 (RL) for ESD suppression device
Figure F.6 ā€“ Recommended characteristics for Sdd21 (IL) for ESD suppression device
101 Figure F.7 ā€“ Recommended characteristics for Ssd21 (DCMR)for ESD suppression device
102 F.2.3 ESD damage
Figure F.8 ā€“ Test setup for ESD damage tests at ESD suppression device
103 Figure F.9 ā€“ Example of ESD test board for ESD suppression device, top layer
104 Table F.5 ā€“ Test parameters for ESD damage tests at ESD suppression device
Table F.6 ā€“ Required ESD tests for damage for ESD suppression device
105 F.2.4 ESD discharge current measurement
Figure F.10 ā€“ Test setup for ESD discharge current measurementat ESD suppression device
106 Figure F.11 ā€“ Example of ESD discharge current test boardfor ESD suppression device, top and bottom layer
107 Table F.7 ā€“ Test parameters for ESD discharge currentmeasurement at ESD suppression device
Table F.8 ā€“ Required current measurement for ESD suppression device
108 Figure F.12 ā€“ Example of test results and recommended limits for remaining ESD discharge current after the MDI test network for ESD suppression device
Table F.9 ā€“ Recommended limits for remaining ESD discharge currentafter the MDI test network for ESD suppression device
109 F.2.5 Test of unwanted clamping effect at RF immunity tests
Figure F.13 ā€“ Test setup for RF clamping test at ESD suppression device
Table F.10 ā€“ Limit classes and related applied ESD test voltages
110 Figure F.14 ā€“ Example of test board RF clamping test at suppression device, top layer
111 Table F.11 ā€“ Test procedure and parameters for RF clampingtests at ESD suppression device
112 Figure F.15 ā€“ Recommended test power levels for RF clampingtests at ESD suppression device
Table F.12 ā€“ Required RF clamping tests for ESD suppression device
113 Bibliography

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