BS EN IEC 62787:2021
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Concentrator photovoltaic (CPV) solar cells and cell on carrier (CoC) assemblies. Qualification
Published By | Publication Date | Number of Pages |
BSI | 2021 | 40 |
This document specifies the minimum requirements for the qualification of concentrator photovoltaic (CPV) cells and Cell on Carrier (CoC) assemblies for incorporation into CPV receivers, modules and systems. The object of this qualification standard is to determine the optoelectronic, mechanical, thermal, and processing characteristics of CPV cells and CoCs to show that they are capable of withstanding assembly processes and CPV application environments. The qualification tests of this document are designed to demonstrate that cells or CoCs are suitable for typical assembly processes, and when properly assembled, are capable of passing IEC 62108. This document defines qualification testing for two levels of concentrator photovoltaic device assembly: a) cell, or bare cell; and b) cell on carrier (CoC). NOTE Note that a variety of alternate names are used within the industry, such as solar cell assembly, receiver, etc.
PDF Catalog
PDF Pages | PDF Title |
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2 | undefined |
5 | Annex ZA(normative)Normative references to international publicationswith their corresponding European publications |
7 | English CONTENTS |
9 | FOREWORD |
11 | 1 Scope 2 Normative references |
12 | 3 Terms and definitions |
13 | Figures Figure 1 – Schematics and photos of Cells on Carrier and bare cell test assembly |
14 | 4 Operating environment 5 Sampling Figure 2 – Representative samples of CPV systems, where cells and CoCs are deployed |
15 | 6 Marking 7 Characterization methods for measuring the performance of bare cells and CoCs subjected to qualification tests 7.1 General 7.2 Light I-V measurement |
16 | 7.3 Dark I-V measurement 7.3.1 General 7.3.2 Procedure 7.4 Electroluminescence (EL) mapping |
17 | 7.5 X-ray and Scanning Acoustic Microscope (SAM) 7.6 Visual inspection 7.7 Thermal resistance measurement |
18 | 8 Pass criteria |
19 | Tables Table 1 – Qualification tests description for bare solar cells |
21 | Table 2 – Qualification tests description for CoCs |
23 | Figure 3 – Flow chart of qualification tests for bare solar cells |
24 | Figure 4 – Flow chart of qualification tests for CoCs |
25 | 9 Documentation and reporting 10 Modifications and requalification |
26 | 11 Qualification stress tests 11.1 General 11.2 ESD damage threshold 11.2.1 General 11.2.2 Purpose |
27 | 11.2.3 Procedure 11.2.4 Requirements 11.3 Front and back metal adhesion 11.3.1 Purpose 11.3.2 Procedure 11.3.3 Requirements 11.4 High-temperature storage 11.4.1 Purpose 11.4.2 Procedure |
28 | 11.4.3 Requirements 11.5 Thermal cycling 11.5.1 Purpose 11.5.2 Procedure Table 3 – Thermal Cycle Options (TCO) of test 11.5 for CoCs |
29 | 11.5.3 Requirements 11.6 High temperature with current injection 11.6.1 Purpose Figure 5 – Thermal Cycle Diagram for the CoC test and TCO-1 |
30 | 11.6.2 Procedure 11.6.3 Requirements 11.7 Low level light biased damp heat 11.7.1 Purpose 11.7.2 Procedure 11.7.3 Requirements |
31 | 11.8 Solderability 11.8.1 Purpose 11.8.2 Procedure |
32 | 11.8.3 Requirements 11.9 Illumination 11.9.1 Purpose 11.9.2 Procedure |
33 | 11.9.3 Requirements 11.10 Wire/Ribbon bond strength 11.10.1 Purpose 11.10.2 Procedure |
34 | Figure 6 – Force diagram in the bond strength test(taken from IEC 60749-22:2002, Annex A, Method B) Table 4 – Minimum pulling forces, PW (taken from IEC 60749-22:2002, Method B) |
35 | 11.10.3 Requirements Figure 7 – Minimum bond pull limits (normal to die)(taken from IEC 60749-22:2002, Annex A, Method B) |
36 | 11.11 Die adhesion 11.11.1 Purpose 11.11.2 Procedure 11.11.3 Requirements Figure 8 – Schematic of the test set up for the die adhesion test |
37 | 11.12 Connector shear strength 11.12.1 Purpose 11.12.2 Procedure Figure 9 – Die shear strength criteria (minimum force versus die attach area)(taken from MIL.ST-883-K) |
38 | 11.12.3 Pass/fail criteria 11.13 Bypass diode shear strength 11.13.1 Purpose 11.13.2 Procedure 11.13.3 Requirements Figure 10 – Schematics of the position of the pushing tool(taken from IEC 6213712:2007) |