BS IEC 61000-4-23:2016:2021 Edition
$215.11
Electromagnetic Compatibility (EMC) – Testing and measurement techniques. Test methods for protective devices for HEMP and other radiated disturbances
Published By | Publication Date | Number of Pages |
BSI | 2021 | 108 |
PDF Catalog
PDF Pages | PDF Title |
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2 | undefined |
4 | CONTENTS |
8 | FOREWORD |
10 | INTRODUCTION |
11 | 1 Scope 2 Normative references |
12 | 3 Terms and definitions |
17 | 4 HEMP test concepts 4.1 General |
18 | 4.2 Testing of shielding enclosures 4.2.1 General |
19 | Figures Figure 1 – Example of measured magnitude and phase of the transfer function T(ω) = Hin/Hout for a shielded enclosure |
20 | Figure 2 – Electric field and magnetic field shielding effectiveness of a 0,5 mm thick aluminum enclosure [29] |
21 | 4.2.2 Buildings Figure 3 – Measured magnetic field shielding effectiveness SEH for a building Figure 4 – Conceptual illustration of the HEMP test of a building |
22 | 4.2.3 Shelters and shielded rooms |
23 | 4.2.4 Cabinets, racks and boxes Figure 5 – Illustration of a shielded room or enclosure excited by HEMP fields Figure 6 – Illustration of equipment racks, cabinets and box excited by internal HEMP disturbance |
24 | Figure 7 – A general shield excited by current injection |
25 | 4.3 Testing of shielded cables and connectors 4.3.1 General 4.3.2 Testing of cable shields |
26 | Figure 8 – Basic configuration for transfer impedance measurement |
27 | Figure 9 – Measured transfer impedance magnitude and phase of transfer impedance per unit length for four braided shield cables with good shielding properties |
28 | 4.3.3 Testing of cable connectors Figure 10 – Basic configuration for transfer admittance measurement Figure 11 – Test configuration for transfer impedance measurement of a cable connector |
29 | 4.4 Testing of shielding materials 4.4.1 General 4.4.2 Conducting gaskets |
30 | Figure 12 – Examples of conducting gaskets used as HEMP protection devices Figure 13 – Circuit model representing the behaviour of a conducting gasket for HEMP protection |
31 | 4.4.3 Conducting sheets and screens Figure 14 – Measurement configuration for the resistivity of a sample |
32 | Figure 15 – Test concept for measuring the resistivity with surface probes |
34 | 4.4.4 Cut-off waveguides and honeycombs Figure 16 – Concepts for shielding effectiveness measurement of conducting sheets and screens Figure 17 – Example of the calculated plane-wave shielding effectivenes sof a 0,01 mm thick plate of different material as a function of frequency |
35 | 4.5 Summary of test concepts Figure 18 – Cut-off waveguides and honeycomb used as protective elements |
36 | 5 Test methods for measuring the shielding effectiveness of HEMP protection facilities 5.1 General 5.2 Electromagnetic field testing 5.2.1 General 5.2.2 Pulse field testing Tables Table 1 – Recommended test procedure for different test objects |
39 | Figure 19 – Examples of full-scale, pulse-radiating HEMP simulators |
41 | Figure 20 – Test procedure for the pulse test |
42 | 5.2.3 CW field testing Figure 21 – Typical configuration of a CW test facility |
43 | Figure 22 – Example CW measurement set-up |
44 | Figure 23 – Test and analysis procedures for conducting a CW test |
45 | Figure 24 – Analysis flow diagram for extrapolatinga measured CW spectrum to the HEMP response |
46 | Figure 25 – Example scan from 9 kHz to 3 GHz for the ambient electromagnetic field from communication signals |
47 | Figure 26 – Test procedure for the ambient EM excitation test |
48 | Figure 27 – Double-ended TEM cell for field illumination testing of small enclosures |
49 | Figure 28 – Example test set-up for field illumination in the TEM cell |
50 | Figure 29 – Illustration of the single-ended TEM cell and associated equipment |
52 | Figure 30 – Test set-up for the plane-wave shielding effectiveness measurements Table 2 – Dimensions and composition of distances d1 to d3, with reference to Figure 30 |
53 | Figure 31 – Test set-up for the H-field shielding effectiveness measurements Table 3 – Dimensions and composition of distances d1 to d3, with reference to Figure 31 |
54 | Figure 32 – Example of antenna locations for the localized antenna tests for a hypothetical shielded enclosure or facility Table 4 – Measurement frequencies and antennas in plane-wave |
56 | Table 5 – Measurement frequencies and antennas in magnetic field |
57 | 5.3 Current injection test procedures 5.3.1 General 5.3.2 Injection testing of enclosures |
58 | Figure 33 – Test concept and equipment configuration for current injection testing of a shielded enclosure or box |
59 | 5.3.3 Transfer impedance and admittance of cable shields and connectors 5.3.4 Testing of gasket material |
61 | Figure 34 – Surface probe for volume resistivity measurement |
62 | Annexes Annex A (informative) HEMP test concepts for electrical systems A.1 Overview A.2 Types of HEMP tests A.2.1 General A.2.2 System-level transient tests |
63 | A.2.3 CW field illumination tests A.2.4 Current injection testing |
64 | A.2.5 Partial illumination testing A.2.6 Subsystem and component testing |
65 | A.3 Definition of the testing interface |
66 | Figure A.1 – Sample HEMP interaction diagram illustrating penetration mechanisms, system responses and generic test interface locations |
67 | A.4 Use of test data A.4.1 General A.4.2 Acceptance of new systems A.4.3 System assessments A.4.4 Hardness surveillance monitoring A.4.5 System design |
68 | A.5 Testing uncertainties |
69 | Annex B (informative) Characterization of shielded cables B.1 Fundamentals of cable shielding Figure B.1 – Geometry of a shielded coaxial line with an internal circuit |
70 | B.2 Definitions of transfer impedance and transfer admittance Figure B.2 – Coaxial cable located over a conducting ground plane |
71 | Figure B.3 – Two per-unit-length circuits formed by the sheath and its ground return, and the sheath and the internal conductor |
73 | B.3 Relative significance of Z′t and Y′t |
74 | Annex C (informative) Equipment for HEMP pulse measurements C.1 General C.2 Sensors for HEMP measurements C.2.1 B- and H-field sensors |
75 | Figure C.1 – Magnetic field sensors [23] Figure C.2 – Single-slot, cylindrical coil sensor [23] |
76 | C.2.2 D- and E-field sensors Figure C.3 – Two- and four-slot cylindrical coil sensors [23] Figure C.4 – Electrical configuration of an E-field sensor [23] |
77 | Figure C.5 – Biconical E-field sensor Figure C.6 – E-field sensor mounted on a conducting ground plane [23] Figure C.7 – Equipotential shapes for an optimally designed E-field sensor [23] |
78 | C.2.3 Current sensors Figure C.8 – Rogowski coil used for current measurements [23] Figure C.9 – Toroidal current sensor made of magnetic material [23] Figure C.10 – Voltage pick-up points on the edges of the toroidal sensor [23] |
79 | C.3 Signal transmission C.3.1 General C.3.2 Fibre optic links Figure C.11 – Example of a single-channel fibre optic transmission system [23] |
80 | C.3.3 Fibre optic transducers C.4 Signal detection and processing Figure C.12 – Attenuation of coaxial linesand fibre optic cables as a function of frequency |
82 | Annex D (informative) Equipment for CW testing D.1 General D.2 Antenna system |
83 | Figure D.1 – Various antennas for CW testing |
84 | D.3 Power amplifier Figure D.2 – Relationship between the CW antenna and the incident HEMP field |
85 | D.4 Receiver (network analyser) D.5 Reference and response sensors |
86 | Figure D.3 – Incident and ground-reflected field contributions to the reference sensor excitations |
87 | D.6 Fibre optic system Figure D.4 – Measured reference H-field spectrum and its inverse Fourier transform |
89 | Figure D.5 – Measured sensor responses and calibration function Figure D.6 – Measured transfer function, corrected by calibration file |
90 | D.7 Limitations of measurements |
91 | Annex E (informative) Characterization of a planar shield for HEMP protection E.1 General Figure E.1 – Example of a general shielding problem |
92 | E.2 Problem geometry Figure E.2 – Behaviour of the impedance ratio |E|/|H | as a function of distance from a source [29] |
93 | E.3 Equivalent circuit representation E.3.1 General Figure E.3 – Conducting slab of thickness, d, and infinite extent serving as an electromagnetic barrier |
94 | E.3.2 Chain parameter representation of the shield Figure E.4 – Equivalent circuit representation of the shielding problem |
95 | E.3.3 Circuit responses Figure E.5 – Two-port representation of a circuit |
97 | Table E.1 – Surface resistance and electrical parameters for selected materials |
99 | Annex F (informative) Inside-to-out measurement method F.1 Purpose F.2 Comparison of existing SE test methods |
100 | F.3 Inside-to-out SE test of shielded rooms F.3.1 Measurements of the inside-to-out SE Table F.1 – Comparison with other standards |
101 | Table F.2 – Test shielded rooms |
102 | Figure F.1 – Test set-up for the outside-to-in and inside-to-out SE measurement |
103 | F.3.2 Summary Table F.3 – Comparison of the SE measurement results |
104 | Bibliography |