BS IEC 62951-1:2017:2018 Edition
$102.76
Semiconductor devices. Flexible and stretchable semiconductor devices – Bending test method for conductive thin films on flexible substrates
| Published By | Publication Date | Number of Pages |
| BSI | 2018 | 18 |
This part of IEC 62951 specifies a bending test method to measure the electromechanical properties or flexibility of conductive thin films deposited or bonded on flexible non-conductive substrates. Conductive thin films on flexible substrates are extensively used in flexible electronic devices and flexible semiconductors. Conductive thin films include any films deposited or bonded onto a non-conductive flexible substrate such as thin metal film, transparent conducting electrode, and thin silicon film. The electrical and mechanical behaviours of thin films on flexible substrates differ from those of freestanding films and substrates due to their interfacial interactions and adhesion between the film and substrate. The object of this standard is to establish simple and repeatable test methods for evaluating the electromechanical properties or flexibility of conductive thin films on flexible substrate. The bending test methods include outer bending test and inner bending test.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 2 | undefined |
| 4 | CONTENTS |
| 5 | FOREWORD |
| 7 | 1 Scope 2 Normative references 3 Terms, definitions and symbols 3.1 Terms and definitions |
| 8 | 3.2 Symbols and designations |
| 9 | 4 Test piece 4.1 Design of test piece 4.2 Preparation of a test piece 4.3 Measurement of dimensions Figures Figure 1 – Shape of a test piece Table 1 – Symbols and designations of a test piece |
| 10 | 4.4 Storage prior to testing 5 Testing method and test apparatus 5.1 General 5.2 Test apparatus 5.3 Measurement of electrical resistance Figure 2 – Bending test apparatus |
| 11 | 5.4 Test procedure 5.5 Observation of cracks in test piece 5.6 Data analysis 5.7 Test environment |
| 12 | 6 Test report |
| 13 | Annex A (informative) X-Y-θ bending test method Figure A.1 – X-Y-( bending test method |
| 14 | Figure A.2 – Schematic of the bending geometry in X-Y-θ system |
| 15 | Annex B (informative) Data analysis: Calculation of bending radius and bending strain B.1 Calculation of bending radius B.2 Calculation of bending strain of the film Figure B.1 – Geometrical shape of bent test piece |
| 17 | Bibliography |
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