BS IEC 62951-8:2023
$102.76
Semiconductor devices. Flexible and stretchable semiconductor devices – Test method for stretchability, flexibility, and stability of flexible resistive memory
Published By | Publication Date | Number of Pages |
BSI | 2023 | 18 |
PDF Catalog
PDF Pages | PDF Title |
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2 | undefined |
4 | CONTENTS |
5 | FOREWORD |
7 | 1 Scope 2 Normative references 3 Terms and definitions |
8 | 4 Test method 4.1 General 4.2 Test equipment and tools Tables Table 1 ā Performance parameters of resistive type memory |
9 | Figures Figure 1 ā Examples experimental setup for testing stretchability (top)and flexibility (bottom) |
10 | 4.3 Test procedures 4.3.1 Stretchability test |
11 | 4.3.2 Flexibility test Figure 2 ā Schematic for stretchability test denoting parametersbefore and during testing |
12 | 4.3.3 Stability testing Figure 3 ā Schematic for flexibility test denoting parameters before and during testing |
13 | 4.4 Test report Table 2 ā Example temperature and relative humidity conditions |
14 | Annex A (informative)Induced strain on a substrate due to bending A.1 Detailed derivation of the strain formula by bending Figure A.1 ā Deformation of a substrate induced strain by bending |
15 | A.2 Simulation results induced strain by bending Figure A.2 ā Deformation of a substrate induced tensile strain by stretching |
16 | Bibliography |