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BS IEC 62951-8:2023

$102.76

Semiconductor devices. Flexible and stretchable semiconductor devices – Test method for stretchability, flexibility, and stability of flexible resistive memory

Published By Publication Date Number of Pages
BSI 2023 18
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PDF Catalog

PDF Pages PDF Title
2 undefined
4 CONTENTS
5 FOREWORD
7 1 Scope
2 Normative references
3 Terms and definitions
8 4 Test method
4.1 General
4.2 Test equipment and tools
Tables
Table 1 ā€“ Performance parameters of resistive type memory
9 Figures
Figure 1 ā€“ Examples experimental setup for testing stretchability (top)and flexibility (bottom)
10 4.3 Test procedures
4.3.1 Stretchability test
11 4.3.2 Flexibility test
Figure 2 ā€“ Schematic for stretchability test denoting parametersbefore and during testing
12 4.3.3 Stability testing
Figure 3 ā€“ Schematic for flexibility test denoting parameters before and during testing
13 4.4 Test report
Table 2 ā€“ Example temperature and relative humidity conditions
14 Annex A (informative)Induced strain on a substrate due to bending
A.1 Detailed derivation of the strain formula by bending
Figure A.1 ā€“ Deformation of a substrate induced strain by bending
15 A.2 Simulation results induced strain by bending
Figure A.2 ā€“ Deformation of a substrate induced tensile strain by stretching
16 Bibliography
BS IEC 62951-8:2023
$102.76