BS IEC 63068-2:2019
$142.49
Semiconductor devices. Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices – Test method for defects using optical inspection
| Published By | Publication Date | Number of Pages |
| BSI | 2019 | 28 |
IEC 63068-2:2019(E) provides definitions and guidance in use of optical inspection for detecting as-grown defects in commercially available 4H-SiC (Silicon Carbide) epitaxial wafers. Additionally, this document exemplifies optical images to enable the detection and categorization of the defects for SiC homoepitaxial wafers. This document deals with a non-destructive test method for the defects so that destructive methods such as preferential etching are out of scope in this document.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 2 | undefined |
| 4 | CONTENTS |
| 6 | FOREWORD |
| 8 | INTRODUCTION |
| 9 | 1 Scope 2 Normative references 3 Terms and definitions |
| 13 | 4 Optical inspection method 4.1 General |
| 14 | 4.2 Principle 4.3 Requirements 4.3.1 Illumination |
| 15 | 4.3.2 Wafer positioning and focusing 4.3.3 Image capturing 4.3.4 Image processing 4.3.5 Image analysis 4.3.6 Image evaluation 4.3.7 Documentation |
| 16 | 4.4 Parameter settings 4.4.1 General 4.4.2 Parameter setting process 4.5 Procedure 4.6 Evaluation 4.6.1 General 4.6.2 Mean width of planar and volume defects |
| 17 | 4.6.3 Evaluation process 4.7 Precision 4.8 Test report |
| 18 | Annex A (informative) Optical inspection images of defects A.1 General A.2 Micropipe Figures Figure A.1 – Micropipe |
| 19 | A.3 TSD A.4 TED Figure A.2 – TSD |
| 20 | A.5 BPD A.6 Scratch trace Figure A.3 – TED Figure A.4 – Scratch trace |
| 21 | A.7 Stacking fault A.8 Propagated stacking fault Figure A.5 – Stacking fault |
| 22 | A.9 Stacking fault complex Figure A.6 – Propagated stacking fault |
| 23 | A.10 Polytype inclusion Figure A.7 – Stacking fault complex |
| 24 | Figure A.8 – Polytype inclusion |
| 25 | A.11 Particle inclusion A.12 Bunched-step segment Figure A.9 – Particle inclusion |
| 26 | Figure A.10 – Bunched-step segment |
| 27 | Bibliography |
